The future of the global flexible printed circuit board (FPC) market looks promising with opportunities in the computer/peripheral, telecommunication, consumer electronics, medical, automotive, and aerospace and defense industries. The global FPC market is expected to reach an estimated $24.3 billion by 2027 with a CAGR of 3.1% from 2021 to 2027. The major drivers for this market are increasing demand for FPC in the telecommunication industry, growth in connected devices, and advancement in automotive electronics.
Emerging trends, which have a direct impact on the dynamics of the industry, include miniaturization of electronic devices and growing demand for low loss/high speed PCBs.
A total of 122 figures / charts and 134 tables are provided in this 197-page report to help in your business decisions. Sample figures with insights are shown below. To learn the scope of benefits, companies researched, and other details of the FPC market report, please download the report brochure.
In this market, telecommunication is the largest end use industry, whereas multilayer FPC is the largest market technology segment. Growth in various segments of the FPC market is given in the figure below.
The study includes trends and forecast for the global flexible printed circuit board (FPC) market by technology, end use industry, laminate material type, raw material usage, and region as follows:
By End Use Industry [$M and M Sqm shipment analysis for 2016 – 2027]:
- Consumer Electronics
- Aerospace and Defense
By Technology [$M and M Sqm shipment analysis for 2016 – 2027]:
- Single Layer
- Double Layer
- Multi- Layer
By Laminate Material Type [$M and M Sqm shipment analysis for 2016 – 2027]:
- Polyester and Others
By Raw Material Usage [$M and kilotons shipment analysis for 2016 – 2027]:
- Polyimide Films
- Polyester and Other Films
By Region [$M and M Sqm shipment analysis for 2016 – 2027]:
- North America
- United States
- Asia Pacific
- South Korea
- Rest of the World
Some of the flexible printed circuit board companies profiled in this report include NOK Corporation, Zhen Ding Technology, Sumitomo, Flexium Interconnect, Fujikura, Nitto Denko, Compeq Manufacturing, Samsung Electro-Mechanics, Unimicron, and Young Poong Electronics.
Lucintel forecasts that multi-layer will remain the largest technology type due to increasing demand in the automotive and telecommunication industries. The rigid-flex substrate segment is expected to witness the highest growth during the forecast period due to growing demand for smartphone and display applications.
Telecommunication will remain the largest end use industry, supported by increasing demand for smartphones, data storage, 5G technology, and network solution sectors. The medical end use market is expected to witness the highest growth during the forecast period because it will witness increasing demand for portable, wireless, and more complex electronic assemblies.
Asia Pacific is expected to remain the largest market and witness the highest growth over the forecast period due to increasing ADAS and vehicle safety features in automotive and growth in consumer electronic devices and telecommunication products. Increasing usage of electric vehicles due to growing environmental concerns and regulations is also expected to drive the demand for FPC in this region.
Features of the Flexible Printed Circuit Board Market
- Market Size Estimates:Flexible printed circuit board market size estimation in terms of value ($M) and volume (million square meter)
- Trend And Forecast Analysis:Market trends (2016-2021) and forecast (2022-2027) by various segments and regions.
- Segmentation Analysis:Flexible printed circuit board market size by various segments, such as end use industry, technology, laminate material type, and raw material usage, in terms of value and volume.
- Regional Analysis:Flexible printed circuit board market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
- Growth Opportunities:Analysis on growth opportunities in various end use industries, technologies, laminate material types, and raw material usages, and regions, for the flexible printed circuit board market.
- Strategic Analysis:This includes M&A, new product development, and competitive landscape for the flexible printed circuit board market.
- Analysis of competitive intensity of the industry based on Porter’s Five Forces model.
This report answers following 11 key questions
Q.1 What are some of the most promising potential, high-growth opportunities for the global FPC market by end use industry (computers/peripherals, telecommunication, consumer electronics, medical, automotive, aerospace and defense, and others), technology (single layer, double layer, multi-layer and rigid flex), laminate material type (polyimide and polyester & others), laminate raw material usage (polyimide films and polyester & other films), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q. 2 Which segments will grow at a faster pace and why?
Q.3 Which regions will grow at a faster pace and why?
Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the market?
Q.5 What are the business risks and threats to the market?
Q.6 What are the emerging trends in this market and the reasons behind them?
Q.7 What are some changing demands of customers in the market?
Q.8 What are the new developments in the market? Which companies are leading these developments?
Q.9 Who are the major players in this market? What strategic initiatives are being implemented by key players for business growth?
Q.10 What are some of the competitive products and processes in this area and how big of a threat do they pose for loss of market share via material or product substitution?
Q.11 What M & A activities did take place in the last five years in this market?