Table of Content




1. Executive Summary


2. Global Outsourced Semiconductor Assembly and Testing Market: Market Dynamics
2.1: Introduction, Background, and Classifications
2.2: Supply Chain
2.3: Industry Drivers and Challenges


3. Market Trends and Forecast Analysis from 2017 to 2028
3.1: Macroeconomic Trends (2017-2022) and Forecast (2023-2028)
3.2: Global Outsourced Semiconductor Assembly and Testing Market Trends (2017-2022) and Forecast (2023-2028)
3.3: Global Outsourced Semiconductor Assembly and Testing Market by Service Type
3.3.1: Assembly & Packaging
3.3.2: Testing
3.4: Global Outsourced Semiconductor Assembly and Testing Market by Packaging Type
3.4.1: Wire Bond
3.4.2: Flip Chip
3.4.3: Wafer Level
3.4.4: Others
3.5: Global Outsourced Semiconductor Assembly and Testing Market by Application
3.5.1: Automotive
3.5.2: Telecommunications
3.5.3: Computing & Networking
3.5.4: Consumer Electronics
3.5.5: Industrial


4. Market Trends and Forecast Analysis by Region from 2017-2028
4.1: Global Outsourced Semiconductor Assembly and Testing Market by Region
4.2: North American Outsourced Semiconductor Assembly and Testing Market
4.2.1: North American Outsourced Semiconductor Assembly and Testing Market by Service Type: Assembly & Packaging and Testing
4.2.2: North American Outsourced Semiconductor Assembly and Testing Market by Application: Automotive, Telecommunications, Computing & Networking, Consumer Electronics, and Industrial
4.3: European Outsourced Semiconductor Assembly and Testing Market
4.3.1: European Outsourced Semiconductor Assembly and Testing Market by Service Type: Assembly & Packaging and Testing
4.3.2: European Outsourced Semiconductor Assembly and Testing Market by Application: Automotive, Telecommunications, Computing & Networking, Consumer Electronics, and Industrial
4.4: APAC Outsourced Semiconductor Assembly and Testing Market
4.4.1: APAC Outsourced Semiconductor Assembly and Testing Market by Service Type: Assembly & Packaging and Testing
4.4.2: APAC Outsourced Semiconductor Assembly and Testing Market by Application: Automotive, Telecommunications, Computing & Networking, Consumer Electronics, and Industrial
4.5: ROW Outsourced Semiconductor Assembly and Testing Market
4.5.1: ROW Outsourced Semiconductor Assembly and Testing Market by Service Type: Assembly & Packaging and Testing
4.5.2: ROW Outsourced Semiconductor Assembly and Testing Market by Application: Automotive, Telecommunications, Computing & Networking, Consumer Electronics, and Industrial


5. Competitor Analysis
5.1: Product Portfolio Analysis
5.2: Operational Integration
5.3: Porter’s Five Forces Analysis


6. Growth Opportunities and Strategic Analysis
6.1: Growth Opportunity Analysis
6.1.1: Growth Opportunities for the Outsourced Semiconductor Assembly and Testing Market by Service Type
6.1.2: Growth Opportunities for the Outsourced Semiconductor Assembly and Testing Market by Packaging Type
6.1.3: Growth Opportunities for the Outsourced Semiconductor Assembly and Testing Market by Application
6.1.5: Growth Opportunities for the Outsourced Semiconductor Assembly and Testing Market by Region
6.2: Emerging Trends in the Global Outsourced Semiconductor Assembly and Testing Market
6.3: Strategic Analysis
6.3.1: New Product Development
6.3.2: Capacity Expansion of the Global Outsourced Semiconductor Assembly and Testing Market
6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Outsourced Semiconductor Assembly and Testing Market
6.3.4: Certification and Licensing


7. Company Profiles of Leading Players
7.1: Advanced Semiconductor
7.2: Amkor
7.3: Jiangsu Changjiang Electronics Technology
7.4: Siliconware Precision Industries
7.5: PTI (Powertech Technology Inc.)
7.6: United test and assembly center
7.7: King Yuan Electronics
7.8: ChipMOS