Outsourced Semiconductor Assembly and Testing Market: Trends, Opportunities and Competitive Analysis (2023-

Trends, opportunity and forecast in the global OSAT market to 2028 by service type (assembly & packaging and testing), packaging type (wire bond, flip chip, wafer level, and others), application (automotive, telecommunications, computing & networking, consumer electronics, and industrial), and region (North America, Europe, Asia Pacific, and the Rest of the World)

Published	Pages	Publisher	Report code
Mar 2023	150	Lucintel	ASDR-620070

Published: Mar 2023 - Pages : 150 - Publisher : Lucintel - Report code : ASDR-620070

Advanced Semiconductor
Amkor
Jiangsu Changjiang Electronics Technology
Siliconware Precision Industries
PTI (Powertech Technology Inc.)
United test and assembly center
King Yuan Electronics
ChipMOS

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Published: March, 2025 | Report code: ASDR-675395