Table of Content





1. Executive Summary


2. Market Background and Classifications
2.1: Introduction, Background and Classification
2.2: Supply Chain
2.3: Industry Drivers and Challenges


3. Market Trends and Forecasts Analysis from 2015-2026
3.1: Macroeconomic Trends and Forecasts
3.2: Global Advanced IC Packaging Market Trends and Forecast
3.3: Global Advanced IC Packaging Market by Packaging Type
3.3.1: Flip-Chip
3.3.2: Fan-in Wafer Level (WLP) Packaging
3.3.3: Embedded-Die
3.3.4: Fan-Out
3.3.5: 2.5 Dimensional/3 Dimensional (2.5D/3D)
3.4: Global Advanced IC Packaging Market by End Use Industry
3.4.1: Consumer and Communication
3.4.2: Automotive
3.4.3: Industrial
3.4.4: Healthcare
3.4.5: Aerospace and Defense
3.4.6: Others


4. Market Trends and Forecast Analysis from 2015 to 2026
4.1: Global Advanced IC Packaging Market by Region
4.2: North American Advanced IC Packaging Market Trends and Forecast
4.3: European Advanced IC Packaging Market Trends and Forecast
4.4: APAC Advanced IC Packaging Market Trends and Forecast
4.5: ROW Advanced IC Packaging Market Trends and Forecast


5. Competitor Analysis
5.1: Product Portfolio Analysis
5.2: Operation Integration
5.3: Geographical Reach
5.4: Porter’s Five Forces Analysis


6. Growth Opportunities and Strategic Analysis
6.1: Growth Opportunity Analysis
6.1.1: Growth Opportunities for the Global Advanced IC Packaging Market by Packaging Type
6.1.2: Growth Opportunities for the Global Advanced IC Packaging Market by End Use Industry
6.1.3: Growth Opportunities for the Global Advanced IC Packaging Market by Region
6.2: Emerging Trends in the Global Advanced IC Packaging Market
6.3: Strategic Analysis
6.3.1: New Product Development
6.3.2: Capacity Expansion of the Global Advanced IC Packaging Market
6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Advanced IC Packaging Market


7. Company Profiles of Leading Players
7.1: Amkor Technology
7.2: Taiwan Semiconductor
7.3: Advanced Semiconductor Engineering Technology
7.4: Intel Corporation
7.5: Samsung Electronics
7.6: JCET Group
7.7: Texas Instruments
7.8: Toshiba Corporation
7.9: Renesas



List of Figures

List of Figures

Chapter 2. Market Background and Classifications
Figure 2.1: Advanced IC Packaging
Figure 2.2: Evolution of IC Packaging
Figure 2.3: 2.5D Packaging
Figure 2.4: 3D IC Packaging
Figure 2.5: Chip First Fan-Out
Figure 2.6: Chip Last Fan-Out
Figure 2.7: Flip Chip Packaging
Figure 2.8: Embedded Die Packaging
Figure 2.9: Fan-In Wafer Level Packaging
Figure 2.10: System-In-Package
Figure 2.11: Consumer Electronics
Figure 2.12: Automotive
Figure 2.13: Industrial
Figure 2.14: Healthcare
Figure 2.15: Aerospace and Defense
Figure 2.16: Classification of the Advanced IC Packaging Market by Packaging Type and End Use Industry
Figure 2.17: Increasing Capability and Complexity in Advanced IC Packaging
Figure 2.18: Technology Roadmap from Nano Scale to Micro Scale
Figure 2.19: Advanced IC Packaging Node From Nano Scale to Micro Scale
Figure 2.20: Supply Chain of the Global Advanced IC Packaging Market
Figure 2.21: Major Drivers and Challenges for the Global Advanced IC Packaging Market

Chapter 3. Market Trends and Forecasts Analysis from 2015-2026
Figure 3.1: Trends of the Global GDP Growth Rate
Figure 3.2: Trends of the Global Population Growth Rate
Figure 3.3: Trends of the Global Inflation Rate
Figure 3.4: Trends of the Global Unemployment Rate
Figure 3.5: Trends of the Regional GDP Growth Rate
Figure 3.6: Trends of the Regional Population Growth Rate
Figure 3.7: Trends of the Regional Inflation Rate
Figure 3.8: Trends of the Regional Unemployment Rate
Figure 3.9: Regional Per Capita Income Trends
Figure 3.10: Forecast for the Global GDP Growth Rate
Figure 3.11: Forecast for the Global Population Growth Rate
Figure 3.12: Forecast for the Global Inflation Rate
Figure 3.13: Forecast for the Global Unemployment Rate
Figure 3.14: Forecast for the Regional GDP Growth Rate
Figure 3.15: Forecast for the Regional Population Growth Rate
Figure 3.16: Forecast for the Regional Inflation Rate
Figure 3.17: Forecast for the Regional Unemployment Rate
Figure 3.18: Forecast for the Regional Per Capita Income
Figure 3.19: Addressable Market for Advanced IC Packaging Market in 2020
Figure 3.20: Trends and Forecast for the Global Advanced IC Packaging Market (2015-2026)
Figure 3.21: Trends of the Global Advanced IC Packaging Market ($M) by Packaging Type (2015-2020)
Figure 3.22: Forecast for the Global Advanced IC Packaging Market ($M) by Packaging Type (2021-2026)
Figure 3.23: Trends and Forecast for Flip-Chip in the Global Advanced IC Packaging Market (2015-2026)
Figure 3.24: Trends and Forecast for Fan-in Wafer Level Packaging in the Global Advanced IC Packaging Market (2015-2026)
Figure 3.25: Trends and Forecast for Embedded-Die in the Global Advanced IC Packaging Market (2015-2026)
Figure 3.26: Trends and Forecast for Fan-Out in the Global Advanced IC Packaging Market (2015-2026)
Figure 3.27: Trends and Forecast for 2.5 Dimensional/3 Dimensional in the Global Advanced IC Packaging Market (2015-2026)
Figure 3.28: Trends of the Global Advanced IC Packaging Market ($M) by End Use Industry (2015-2020)
Figure 3.29: Forecast for the Global Advanced IC Packaging Market ($M) by End Use Industry (2021-2026)
Figure 3.30: Trends and Forecast for Consumer and Communication in the Global Advanced IC Packaging Market (2015-2026)
Figure 3.31: Trends and Forecast for Automotive in the Global Advanced IC Packaging Market (2015-2026)
Figure 3.32: Trends and Forecast for Industrial in the Global Advanced IC Packaging Market (2015-2026)
Figure 3.33: Trends and Forecast for Healthcare in the Global Advanced IC Packaging Market (2015-2026)
Figure 3.34: Trends and Forecast for Aerospace and Defense in the Global Advanced IC Packaging Market (2015-2026)
Figure 3.35: Trends and Forecast for Others in the Global Advanced IC Packaging Market (2015-2026)

Chapter 4. Market Trends and Forecast Analysis from 2015 to 2026
Figure 4.1: Trends of the Global Advanced IC Packaging Market ($M) by Region (2015-2020)
Figure 4.2: Forecast for the Global Advanced IC Packaging Market ($M) by Region (2021-2026)
Figure 4.3: Trends and Forecast for the North American Advanced IC Packaging Market (2015-2026)
Figure 4.4: Trends and Forecast for the European Advanced IC Packaging Market (2015-2026)
Figure 4.5: Trends and Forecast for the APAC Advanced IC Packaging Market (2015-2026)
Figure 4.6: Trends and Forecast for the ROW Advanced IC Packaging Market (2015-2026)

Chapter 5. Competitor Analysis
Table 5.1: Product Mapping of Global Advanced IC Packaging Suppliers Based on Markets Served
Figure 5.2: Foundries Capable of Developing Different Node Capacities
Figure 5.3: Headquarter Locations of Major Global Advanced IC Packaging Suppliers
Figure 5.4: Porter’s Five Forces Industry Analysis of the Global Advanced IC Packaging Industry

Chapter 6. Growth Opportunities and Strategic Analysis
Figure 6.1: Growth Opportunities for the Global Advanced IC Packaging Market by Packaging Type (2021-2026)
Figure 6.2: Growth Opportunities for the Global Advanced IC Packaging Market by End Use Industry (2021-2026)
Figure 6.3: Growth Opportunities for the Global Advanced IC Packaging Market by Region (2021-2026)
Figure 6.4: Technology Heat Map by Factors
Figure 6.5: Technology Heat Map by End Use Industry
Figure 6.6: Strategic Implication for Advanced IC Packaging Market
Figure 6.7: Emerging Trends in the Advanced IC Packaging Market
Figure 6.8: Capacity Building by Major Players during the Trend Period (Source: Lucintel)

List of Tables

List of Tables

Chapter 1. Executive Summary
Table 1.1: Global Advanced IC Packaging Market Parameters and Attributes

Chapter 3. Market Trends and Forecasts Analysis from 2015-2026
Table 3.1: Trends of the Global Advanced IC Packaging Market (2015-2020)
Table 3.2: Forecast for the Global Advanced IC Packaging Market (2021-2026)
Table 3.3: Market Size and CAGR of Packaging Types of the Global Advanced IC Packaging Market by Value (2015-2020)
Table 3.4: Market Size and CAGR of Packaging Types of the Global Advanced IC Packaging Market by Value (2021-2026)
Table 3.5: Trends of Flip-Chip in the Global Advanced IC Packaging Market (2015-2020)
Table 3.6: Forecast for Flip-Chip in the Global Advanced IC Packaging Market (2021-2026)
Table 3.7: Trends of Fan-in Wafer Level Packaging in the Global Advanced IC Packaging Market (2015-2020)
Table 3.8: Forecast for Fan-in Wafer Level Packaging in the Global Advanced IC Packaging Market (2021-2026)
Table 3.9: Trends of Embedded-Die in the Global Advanced IC Packaging Market (2015-2020)
Table 3.10: Forecast for Embedded-Die in the Global Advanced IC Packaging Market (2021-2026)
Table 3.11: Trends of Fan-Out in the Global Advanced IC Packaging Market (2015-2020)
Table 3.12: Forecast for Fan-Out in the Global Advanced IC Packaging Market (2021-2026)
Table 3.13: Trends of 2.5 Dimensional/3 Dimensional in the Global Advanced IC Packaging Market (2015-2020)
Table 3.14: Forecast for 2.5 Dimensional/3 Dimensional in the Global Advanced IC Packaging Market (2021-2026)
Table 3.15: Market Size and CAGR of Various End Use Industries of the Global Advanced IC Packaging Market by Value (2015-2020)
Table 3.16: Market Size and CAGR of Various End Use Industries of the Global Advanced IC Packaging Market by Value (2021-2026)
Table 3.17: Trends of Consumer and Communication in the Global Advanced IC Packaging Market (2015-2020)
Table 3.18: Forecast for Consumer and Communication in the Global Advanced IC Packaging Market (2021-2026)
Table 3.19: Trends of Automotive in the Global Advanced IC Packaging Market (2015-2020)
Table 3.20: Forecast for Automotive in the Global Advanced IC Packaging Market (2021-2026)
Table 3.21: Trends of Industrial in the Global Advanced IC Packaging Market (2015-2020)
Table 3.22: Forecast for Industrial in the Global Advanced IC Packaging Market (2021-2026)
Table 3.23: Trends of Healthcare in the Global Advanced IC Packaging Market (2015-2020)
Table 3.24: Forecast for Healthcare in the Global Advanced IC Packaging Market (2021-2026)
Table 3.25: Trends of Aerospace and Defense in the Global Advanced IC Packaging Market (2015-2020)
Table 3.26: Forecast for Aerospace and Defense in the Global Advanced IC Packaging Market (2021-2026)
Table 3.27: Trends of Others in the Global Advanced IC Packaging Market (2015-2020)
Table 3.28: Forecast for Others in the Global Advanced IC Packaging Market (2021-2026)

Chapter 4. Market Trends and Forecast Analysis from 2015 to 2026
Table 4.1: Market Size and CAGR of Various Regions in the Global Advanced IC Packaging Market by Value (2015-2020)
Table 4.2: Market Size and CAGR of Various Regions in the Global Advanced IC Packaging Market (2021-2026)
Table 4.3: Trends of the North American Advanced IC Packaging Market (2015-2020)
Table 4.4: Forecast for the North American Advanced IC Packaging Market (2021-2026)
Table 4.5: Trends of the European Advanced IC Packaging Market (2015-2020)
Table 4.6: Forecast for the European Advanced IC Packaging Market (2021-2026)
Table 4.7: Trends of the APAC Advanced IC Packaging Market (2015-2020)
Table 4.8: Forecast for the APAC Advanced IC Packaging Market (2021-2026)
Table 4.9: Trends of the ROW Advanced IC Packaging Market (2015-2020)
Table 4.10: Forecast for the ROW Advanced IC Packaging Market (2021-2026)

Chapter 5. Competitor Analysis
Table 5.1: Operational Integration of Advanced IC Packaging Suppliers

Chapter 6. Growth Opportunities and Strategic Analysis
Table 6.1: New Product Development by Major Advanced IC Packaging Producers During the Trend Period (2015-2020)