Advanced IC Packaging Market: Trends, Forecast and Competitive Analysis

Trends, opportunities and forecast in advanced IC packaging market to 2026 by packaging type (flip-chip, fan-in wafer level packaging, embedded-die, fan-out, 2.5D/3D) end use industry (consumer and communication, automotive, industrial, healthcare, aerospace and defense, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)

Published	Pages	Publisher	Report code
Jan 2022	138	Lucintel	ASDR-598107

Published: Jan 2022 - Pages : 138 - Publisher : Lucintel - Report code : ASDR-598107

Amkor Technology
Taiwan Semiconductor
Advanced Semiconductor Engineering Technology
Intel Corporation
Samsung Electronics
JCET Group
Texas Instruments
Toshiba Corporation
Renesas

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Published: May, 2025 | Report code: ASDR-676195