The Latin America, Middle East and Africa Board-to-Board Connectors Market would witness market growth of 8.2% CAGR during the forecast period (2023-2030). In the year 2026, the LAMEA market’s volume is expected to surge to 127.8 million units, showcasing a growth of 7.9% (2023-2030).
The use of cell phones, laptop computers, and video cameras has grown, which has raised the demand for BTB connectors. In medical devices, wearable technology, data centers, and security solution systems, usage and demand for BTB connectors have expanded due to digitization across all industrial verticals.
Modern technology that depends on BTB connectors for proper operation has emerged as a result of the growing demand for automation. With the introduction of impending electric vehicles, the expanding automotive industry has created the potential for BTB connectors. The highest BTB connector usage has been seen in the consumer electronics sector.
The Dubai Health Authority (DHA) offers an excellent healthcare infrastructure in Dubai by establishing and carrying out medical policies and procedures in public & private hospitals and clinics. Additionally, DHA creates a Dubai health strategy that addresses future demands, ensures collaborations between both private & public health service providers, and authorizes and oversees the Dubai Health Sector. Additionally, it helps the healthcare system become more open and accountable. This strategy aims to continually uphold quality, clinical competence, patient safety, and rights protection objectives. The board-to-board connectors market is therefore anticipated to expand in the LAMEA region.
The Brazil market dominated the LAMEA Board-to-Board Connectors Market by Country in 2022 and would continue to be a dominant market till 2030; thereby, achieving a market value of $336.5 million by 2030. The Argentina market is exhibiting a CAGR of 8.8% during (2023 - 2030). Additionally, The UAE market would experience a CAGR of 7.9% during (2023 - 2030).
Based on Type, the market is segmented into Pin Headers (Stacked Header, and Shrouded Header), and Socket. Based on Pitch, the market is segmented into 1 mm to 2 mm, Greater Than 2 mm, and Less Than 1 mm. Based on Application, the market is segmented into Consumer Electronics, Automotive, Industrial Automation, Healthcare, Telecommunication, and Others. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.
The market research report covers the analysis of key stakeholders of the market. Key companies profiled in the report include Amphenol Corporation, TE Connectivity Ltd., Molex, LLC (Koch Industries, Inc.), Kyocera Corporation, HARTING Technology Group, Omron Corporation, Japan Aviation Electronics Industry, Limited, Hirose Electric Co., Ltd, Samtec, FIT Hon Teng Limited (Foxconn (Far East) Limited).
Scope of the Study
Market Segments covered in the Report:
By Type (Volume, Million Units, USD Million, 2019-2030)

  • Pin Headers


o Stacked Header
o Shrouded Header

  • Socket


By Pitch (Volume, Million Units, USD Million, 2019-2030)

  • 1 mm to 2 mm
  • Greater Than 2 mm
  • Less Than 1 mm


By Application (Volume, Million Units, USD Million, 2019-2030)

  • Consumer Electronics
  • Automotive
  • Industrial Automation
  • Healthcare
  • Telecommunication
  • Others


By Country (Volume, Million Units, USD Million, 2019-2030)

  • Brazil
  • Argentina
  • UAE
  • Saudi Arabia
  • South Africa
  • Nigeria
  • Rest of LAMEA


Companies Profiled

  • Amphenol Corporation
  • TE Connectivity Ltd.
  • Molex, LLC (Koch Industries, Inc.)
  • Kyocera Corporation
  • HARTING Technology Group
  • Omron Corporation
  • Japan Aviation Electronics Industry, Limited
  • Hirose Electric Co., Ltd
  • Samtec
  • FIT Hon Teng Limited (Foxconn (Far East) Limited)


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