The semiconductor manufacturing equipment market is anticipated to record notable growth by 2027 on account of soaring adoption of electric vehicles worldwide. In addition, increasing prevalence of IoT devices is set to drive market expansion over the forecast period.

Semiconductor manufacturing equipment refers to equipment that are typically used to produce semiconductor devices. Booming consumer demand for higher performing semiconductors has stimulated constant improvements in the technology employed in the products. Moreover, increasing focus on R&D activities to develop high-quality semiconductor manufacturing equipment to match the fast-paced progress in chip technology has fostered product outlook in recent years.

Furthermore, industry players are employing lucrative strategies to gain a competitive edge in the market, which has positively impacted the overall business landscape. For instance, in September 2021, Applied Materials, Inc., a key software, services, and equipment manufacturer for semiconductor devices, launched its novel products namely, the VIISta 900 3D hot ion implant system and the Mirra Durum CMP system.

The VIISta 900 injects ions while minimizing the damage caused to the lattice structure, thereby providing 40 times lesser resistivity as compared to a room temperature implant. Meanwhile, the Mirra Durum CMP system combines cleaning, polishing, drying, and material removal measurement in a single system to produce consistent wafers with the finest quality surfaces. Both products have been designed to assist silicon carbide (SiC) chipmakers in achieving 200mm production.

In another instance, in November 2020, ASML, a leading manufacturer of chipmaking equipment, completed the acquisition of Berliner Glas Group, a major manufacturing technology provider that specializes in optical systems. The deal enabled ASML to broaden its product portfolio and production capacity significantly.

The semiconductor manufacturing equipment market has been segmented on the basis of supply chain process, product, dimension, and region. With respect to product, the market has further been categorized into back-end equipment (test equipment, wafer manufacturing equipment, assembly & packaging equipment, and others) and front-end equipment (water surface conditioning equipment, lithography, polishing & grinding, and others).

Under back-end equipment, the assembly & packaging equipment segment is projected to amass substantial gains by 2027, progressing at a CAGR of approximately 7.0% over the forecast timeframe. Mounting demand for advanced packaging-based chipsets in consumer electronics products and connected devices is likely to bolster segmental growth over 2021-2027.

From the regional point of view, the LAMEA semiconductor manufacturing equipment market is expected to register around 6.0% CAGR through the analysis period to reach a sizable valuation by the end of 2027. Rising number of government initiatives supporting the development of the semiconductor manufacturing industry across LAMEA is estimated to boost regional market expansion over the following years.