Global Hermetic packaging Market is valued approximately at USD 3.4 billion in 2019 and is anticipated to grow with a healthy growth rate of more than 4.3 % over the forecast period 2020-2027. Hermetic packaging is characterized as an advanced packaging methodology with primary applications in passive and active electronic devices as well as in the semiconductor and electronics industries. Growing demand for products mainly for high durability and sometimes innovative performance applications, and widespread use in defense, aerospace and industrial applications, along with commercial applications, drive the market for hermetic packaging in various regions. Hermetic materials guard against different environmental factors such as soil / grim, moisture / moisture, variations in air pressure and other natural hazards that may otherwise affect fragile electronics or interrupt electrical contacts within hermetic materials. Numerous applications areas of hermetic packaging such as space, telecommunications, aeronautics and automotive parts are helping to fuel global Hermetic packaging growth. The existence of alternate packaging solutions is likely to impede the development of the Hermetic Packaging industry. Apart from this, the key players of global Hermetic packaging market have adopted various strategies to gain competitive advantage including product launch, mergers and acquisition, partnerships and agreements, investment, funding and others. For instance, In June 2019, SCHOTT introduced new SCHOTT HEATAN feedthroughs to extend its product range of hermetic sensors. SCHOTT HEATAN feed-throughs can be done efficiently in corrosive, high-heat conditions above 1000 ? C. In February 2019, AMETEK Coining the Electronic Components and Packaging division of AMETEK launched the Copper-Core cConnect a cost-effective, creative solution to heavy-duty electronic packaging.
The regional analysis of global Hermetic packaging market is considered for the key regions such as Asia Pacific, North America, Europe, Latin America and Rest of the World. North America is the leading/significant region across the world in terms of market share owing to presence of numerous aerospace companies and early technology adoption in the region. Whereas, Asia-Pacific is also anticipated to exhibit highest growth rate / CAGR over the forecast period 2020-2027. Factors such increasing energy needs, emerging economies, and increasing defense spending would create lucrative growth prospects for the Hermetic packaging market across Asia-Pacific region.
Major market player included in this report are:
Amkor Technology, Inc.
Texas Instruments Incorporated
Micross Components Inc.
Legacy Technologies Inc.
The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming eight years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within each of the regions and countries involved in the study. Furthermore, the report also caters the detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, the report shall also incorporate available opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:
Multilayer Ceramic Packages
Pressed Ceramic Packages
Metal Can Packages
Glass-Metal Sealing (GTMS)
Ceramic-Metal Sealing (CERTM)
Military & Defense
Aeronautics & Space
Energy & Nuclear Safety
Rest of the World
Furthermore, years considered for the study are as follows:
Historical year – 2017, 2018
Base year – 2019
Forecast period – 2020 to 2027
Target Audience of the Global Hermetic packaging Market in Market Study:
Key Consulting Companies & Advisors
Large, medium-sized, and small enterprises
Value-Added Resellers (VARs)
Third-party knowledge providers