Report Scope:
In this report, the 5G chipset market was segmented by component, industry and geography. The report provides an overview of the global 5G chipset market and analyzes market trends. Using 2022 as the base year, the report provides estimated market data for the forecast period 2023 through 2028.

Revenue forecasts for this period are segmented into -

  • Deployment type: network infrastructure, smart gadgets, smartphones, routers/modems and others.
  • Wafer material type: GaN (gallium nitride)-based chipsets, GaAs (gallium arsenide)-based chipsets, InP (indium phosphide)-based chipsets, SiN (silicon nitride)-based chipsets, Si-based chipsets and others.
  • IC type: RFIC, ASIC, cellular IC and mmWave IC.
  • End use: telecom infrastructure, automotive, building automation, industrial automation, retail, Energy and utilities, consumer electronics and others.
  • Region: North America is segmented into the U.S., Canada and Mexico; Europe is segmented into the U.K., France, Germany and Rest of Europe; the UK is further segmented into England, Wales, Scotland and Northern Ireland; Asia-Pacific (APAC) is segmented into China, Japan, India and the Rest of Asia-Pacific; Rest of the World is segmented into Middle East, Africa and Latin America.


COVID-19 had a massive impact on society beginning in 2020. This report considers the impact of COVID-19 and the economic slowdown it created. With people relying more on technology, the demand for 5G chipset will increase and boost market growth. The report also focuses on the main trends and challenges that affect the market and the vendor landscape.

This report has been prepared in a simple easy-to-understand format, with a number of tables and charts/figures. The scope of the report includes a detailed study of global and regional markets for 5G chipset, with reasons given for variations in the growth of the industry in certain regions. The report examines each component of 5G chipset technology, determines its current market size and estimates its future market. The report also analyzes the market from the manufacturers’ viewpoint, as well as that of the final consumer. A number of technical issues arising out of the use of 5G chipset technologies are discussed and solutions are indicated.

Report Includes:

  • 46 data tables and 20 additional tables
  • An overview and up-to-date analysis of the global markets for the 5G chipset technologies
  • Analyses of the global market trends, with historic market revenue data (sales figures) for 2022, estimates for 2023, forecasts for 2024, and projections of compound annual growth rates (CAGRs) through 2028
  • Discussion of the major growth drivers, industry-specific challenges, technology updates, and government policies and regulations for manufacturing of 5G semiconductor chipsets, that will shape the market as a basis for projecting demand in the next few years (2023-2028)
  • Estimation of the actual market size and revenue forecast for the global 5G chipset market, and corresponding market share analysis based on the type of deployment type, wafer material, integrated circuit (IC) type, end use, and region
  • Identification of viable technology drivers through a holistic review of various platform technologies, major types of end user markets, and adoption of 5G chipsets across a broad spectrum of industry verticals
  • Review of the major industry trends, upcoming technologies and emerging new developments in the global 5G chipset industry
  • A relevant patent analysis on the global supply chain management technologies, applications and solutions and review of recent key granted patents
  • Insight into the recent industry structure, competitive aspects of each product segment, increasing investment on R&D activities, market development strategies, and company value share analysis
  • Identification of the major stakeholders and analysis of the competitive landscape based on recent developments and segmental revenues
  • Company profiles of major players within the industry, including Broadcom Inc., Huawei Technologies Co. Ltd., Intel Corp., Qualcomm Technologies Inc., and Samsung Electronics Co. Ltd.