Table of Content

1. Methodology and Scope
1.1. Research Methodology
1.2. Research Objective and Scope of the Report
2. Definition and Overview
3. Executive Summary
3.1. Snippet by Type
3.2. Snippet by Wafer Size
3.3. Snippet by Technology
3.4. Snippet by Application
3.5. Snippet by Region
4. Dynamics
4.1. Impacting Factors
4.1.1. Drivers
4.1.1.1. Rising in Aerospace and Defense Applications
4.1.1.2. Growing Demand for High-Power Applications
4.1.2. Restraints
4.1.2.1. High Investment Costs
4.1.3. Opportunity
4.1.4. Impact Analysis
5. Industry Analysis
5.1. Porter’s Five Force Analysis
5.2. Supply Chain Analysis
5.3. Pricing Analysis
5.4. Regulatory Analysis
5.5. Sustainable Analysis
5.6. DMI Opinion
6. By Type
6.1. Introduction
6.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
6.1.2. Market Attractiveness Index, By Type
6.2. SiC Discrete Devices*
6.2.1. Introduction
6.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
6.3. SiC Power Modules
6.4. SiC Substrates and Wafers
6.5. Others
7. By Wafer Size
7.1. Introduction
7.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Wafer Size
7.1.2. Market Attractiveness Index, By Wafer Size
7.2. 2-inch Wafers*
7.2.1. Introduction
7.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
7.3. 4-inch Wafers
7.4. 6-inch Wafers
7.5. 8-inch Wafers
8. By Technology
8.1. Introduction
8.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
8.1.2. Market Attractiveness Index, By Technology
8.2. Planar SiC Technology*
8.2.1. Introduction
8.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
8.3. Trench SiC Technology
9. By Application
9.1. Introduction
9.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
9.1.2. Market Attractiveness Index, By Application
9.2. Automotive*
9.2.1. Introduction
9.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
9.3. Consumer Electronics
9.4. Industrial
9.5. Aerospace & Defense
9.6. Telecommunications
9.7. Energy & Power
9.8. Others
10. Sustainability Analysis
10.1. Environmental Analysis
10.2. Economic Analysis
10.3. Governance Analysis
11. By Region
11.1. Introduction
11.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
11.1.2. Market Attractiveness Index, By Region
11.2. North America
11.2.1. Introduction
11.2.2. Key Region-Specific Dynamics
11.2.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
11.2.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Wafer Size
11.2.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
11.2.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
11.2.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
11.2.7.1. US
11.2.7.2. Canada
11.2.7.3. Mexico
11.3. Europe
11.3.1. Introduction
11.3.2. Key Region-Specific Dynamics
11.3.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
11.3.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Wafer Size
11.3.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
11.3.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
11.3.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
11.3.7.1. Germany
11.3.7.2. UK
11.3.7.3. France
11.3.7.4. Italy
11.3.7.5. Spain
11.3.7.6. Rest of Europe
11.4. South America
11.4.1. Introduction
11.4.2. Key Region-Specific Dynamics
11.4.3. Key Region-Specific Dynamics
11.4.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
11.4.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Wafer Size
11.4.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
11.4.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
11.4.8. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
11.4.8.1. Brazil
11.4.8.2. Argentina
11.4.8.3. Rest of South America
11.5. Asia-Pacific
11.5.1. Introduction
11.5.2. Key Region-Specific Dynamics
11.5.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
11.5.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Wafer Size
11.5.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
11.5.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
11.5.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
11.5.7.1. China
11.5.7.2. India
11.5.7.3. Japan
11.5.7.4. Australia
11.5.7.5. Rest of Asia-Pacific
11.6. Middle East and Africa
11.6.1. Introduction
11.6.2. Key Region-Specific Dynamics
11.6.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
11.6.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Wafer Size
11.6.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
11.6.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
12. Competitive Landscape
12.1. Competitive Scenario
12.2. Market Positioning/Share Analysis
12.3. Mergers and Acquisitions Analysis
13. Company Profiles
13.1. Infineon Technologies*
13.1.1. Company Overview
13.1.2. Product Portfolio and Description
13.1.3. Financial Overview
13.1.4. Key Developments
13.2. Littelfuse
13.3. ON Semiconductor
13.4. Wolfspeed Inc
13.5. Fuji Electric
13.6. X-FAB
13.7. GeneSiC Semiconductor
13.8. Mitsubishi Electric
13.9. STMicroelectronics
13.10. ROHM Semiconductor
LIST NOT EXHAUSTIVE
14. Appendix
14.1. About Us and Services
14.2. Contact Us