Table of Content

1 Overview of Automotive Cockpit SoCs
1.1 Performance Comparison between Cockpit SoCs
1.1.1 Overview of Cockpit SoCs
1.1.2 Composition of Cockpit SoCs
1.1.3 Design Process of Cockpit SoCs
1.1.4 Development History of Cockpit SoCs
1.1.5 Comparison between Main Cockpit SoCs (1)
1.1.6 Comparison between Main Cockpit SoCs (2)
1.1.7 Comparison between Main Cockpit SoCs (3)
1.1.8 Comparison between Main Cockpit SoCs (4)
1.1.9 Comparison between Main Cockpit SoCs (5)
1.1.10 Comparison between Main Cockpit SoCs (6)
1.1.11 Cockpit SoC Ranking by CPU Compute (1)
1.1.12 Cockpit SoC Ranking by CPU Compute (2)
1.1.13 Cockpit SoC Ranking by CPU Compute (3)
1.1.14 Cockpit SoC Ranking by CPU Compute (1)
1.1.15 Cockpit SoC Ranking by CPU Compute (2)
1.1.16 Cockpit SoC Ranking by NPU Compute
1.1.17 Specifications of Cockpit SoC Memory
1.1.18 Software Operating System Supported by Cockpit SoCs
1.1.19 Display and Cameras Supported by Cockpit SoCs
1.1.20 Automotive-grade Safety Certification of Cockpit SoCs
1.1.21 Functional Safety Certification and Implementation Methods of Cockpit SoCs

1.2 Summary of Cockpit SoC Market, 2023-2024
1.2.1 Cockpit SoC Development Planning of Major Companies: Overseas
1.2.2 Cockpit SoC Development Planning of Major Companies: China
1.2.3 Development Features of Cockpit SoC Market, 2023-2024 (1)
1.2.4 Development Features of Cockpit SoC Market, 2023-2024 (2)
1.2.5 Development Features of Cockpit SoC Market, 2023-2024 (3)
1.2.6 Development Features of Cockpit SoC Market, 2023-2024 (4)


2 Automotive Cockpit SoC Configuration and Strategy
2.1 Cockpit SoC Market Size
2.1.1 Global Intelligent Cockpit SoC Penetration
2.1.2 China’s Intelligent Cockpit SoC Penetration
2.1.3 China’s Intelligent Cockpit SoC Market Size
2.1.4 Intelligent Cockpit SoC Installations in China, 2022
2.1.5 Market Share of Intelligent Cockpit SoCs (by Supplier) in China, 2022
2.1.6 Market Share of Intelligent Cockpit SoCs (by Chip Model) in China, 2022
2.1.7 Levels of Intelligent Cockpit

2.2 Cockpit SoC Competitive Pattern
2.2.1 Overview of Cockpit SoC Competitive Pattern
2.2.2 Market Pattern of Cockpit SoCs for Low-to-mid-end Models
2.2.3 Cockpit SoC Market for Mid-to-high-end Models
2.2.4 Competitive Pattern of Foreign Cockpit SoC Vendors
2.2.5 Cockpit SoC Pattern of Chinese Companies
2.2.6 Cockpit SoC Vendors Provide "Hardware+Software" Integrated Solutions
2.2.7 Consumer-grade Chips Are Used in IVI Systems
2.2.8 The Cockpit SoC Supply of OEMs Is Still Mainly Based on the Tier1 Model
2.2.9 The Automotive Cockpit SoC Supply Model Has Gradually Changed
2.2.10 Cost Structure of Cockpit Domain Controllers
2.2.11 Cockpit SoC Shipment Price
2.2.12 Cockpit SoC Application Trends of Major OEMs

2.3 Intelligent Cockpit SoC Selection Strategy for Models by Price Range
2.3.1 Cockpit SoC Configuration Strategy for Models Priced at RMB500,000 and Above
2.3.1.1 Intelligent Cockpit SoC Configuration of Models Priced at above RMB500,000 in China, 2023
2.3.1.2 Intelligent Cockpit SoC Selection for Main Models Priced at above RMB500,000 in China, 2023-2024
2.3.2 Intelligent Cockpit SoC Configuration Strategy for Models Priced at RMB400,000-500,000
2.3.2.1 Intelligent Cockpit SoC Selection for Models Priced at RMB400,000-500,000 in China, 2023-2024
2.3.2.2 Intelligent Cockpit SoC Selection for Main Foreign Brand Models Priced at RMB400,000-500,000in China, 2023-2024
2.3.2.3 Intelligent Cockpit SoC Selection for Main Independent Brand Models Priced at above RMB500,000 in China, 2023-2024
2.3.3 Intelligent Cockpit SoC Configuration Strategy for Models Priced at RMB350,000-400,000
2.3.3.1 Intelligent Cockpit SoC Selection for Models Priced at RMB350,000-400,000 in China, 2023-2024
2.3.3.2 Intelligent Cockpit SoC Selection for Main Foreign Brand Models Priced at RMB350,000-400,000 in China, 2023-2024
2.3.3.3 Intelligent Cockpit SoC Selection for Main Independent Brand Models Priced at RMB350,000-400,000 in China, 2023-2024
2.3.4 Intelligent Cockpit SoC Configuration Strategy for Models Priced at RMB300,000-350,000
2.3.4.1 Intelligent Cockpit SoC Selection for Models Priced at RMB300,000-350,000 in China, 2023-2024
2.3.4.2 Intelligent Cockpit SoC Selection for Main Foreign Brand Models Priced at RMB300,000-350,000 in China, 2023-2024
2.3.4.3 Intelligent Cockpit SoC Selection for Main Independent Brand Models Priced at RMB300,000-350,000 in China, 2023-2024
2.3.5 Intelligent Cockpit SoC Configuration Strategy for Models Priced at RMB250,000-300,000
2.3.5.1 Intelligent Cockpit SoC Selection for Models Priced at RMB250,000-300,000 in China, 2023-2024
2.3.5.2 Intelligent Cockpit SoC Selection for Main Foreign Brand Models Priced at RMB250,000-300,000 in China, 2023-2024
2.3.5.3 Intelligent Cockpit SoC Selection for Main Independent Brand Models Priced at RMB250,000-300,000 in China, 2023-2024
2.3.6 Intelligent Cockpit SoC Configuration Strategy for Models Priced at RMB150,000-250,000
2.3.6.1 Intelligent Cockpit SoC Selection for Models Priced at RMB150,000-250,000 in China, 2023-2024
2.3.6.2 Intelligent Cockpit SoC Selection for Main Foreign Brand Models Priced at RMB150,000-250,000 in China, 2023-2024
2.3.6.3 Intelligent Cockpit SoC Selection for Main Independent Brand Models Priced at RMB150,000-250,000 in China, 2023-2024 (1)
2.3.6.4 Intelligent Cockpit SoC Selection for Main Independent Brand Models Priced at RMB150,000-250,000 in China, 2023-2024 (2)
2.3.7 Intelligent Cockpit SoC Configuration Strategy for Models Priced at RMB150,000 and Below
2.3.7.1 Intelligent Cockpit SoC Selection for Models Priced at RMB150,000 and Below in China, 2023-2024
2.3.7.2 Intelligent Cockpit SoC Selection for Main Foreign Brand Models Priced at RMB150,000 and Below in China, 2023-2024
2.3.7.3 Intelligent Cockpit SoC Selection for Main Independent Brand Models Priced at RMB150,000 and Below in China, 2023-2024 (1)
2.3.7.4 Intelligent Cockpit SoC Selection for Main Independent Brand Models Priced at RMB150,000 and Below in China, 2023-2024 (2)

2.4 Cockpit SoC Installation of Overseas Suppliers, 2023-2024
2.4.1 Qualcomm’s Cockpit SoC Installation in Models and Trend, 2023-2024
2.4.1.1 China’s TOP20 Brands by Installation of Qualcomm Cockpit SoCs in L1+ Intelligent Cockpit Vehicles, 2023
2.4.1.2 China’s TOP20 Models by Installation of Qualcomm Cockpit SoCs in L1+ Intelligent Cockpit Vehicles, 2023
2.4.1.3 Distribution of Qualcomm Cockpit SoCs in Models by Price Range, 2023
2.4.1.4 Models Announced to Adopt Qualcomm’s Next-generation Cockpit SoCs, 2024
2.4.2 AMD’s Cockpit SoC Installation in Models and Trend, 2023-2024
2.4.3 Samsung’s Cockpit SoC Installation in Models and Trend, 2023-2024

2.5 Cockpit SoC Installation and Trends of Chinese Suppliers, 2023-2024
2.5.1 SemiDrive’s Cockpit SoC Installation in Models and Trend, 2023-2024
2.5.2 Huawei’s Cockpit SoC Installation in Models and Trend, 2023-2024
2.5.3 MediaTek’s Cockpit SoC Installation in Models and Trend, 2023-2024
2.5.4 SiEngine’s Cockpit SoC Installation in Models and Trend, 2023-2024

3 Key Development Trends of Automotive Cockpit SoCs
3.1 Topic 1: Mass Production of Qualcomm 8295 Has Started, and Who Will Be the Next?
3.1.1 What Do OEMs or Tier1 Suppliers Value Most When Choosing A Cockpit SoC? (1)
3.1.2 What Do OEMs or Tier1 Suppliers Value Most When Choosing A Cockpit SoC? (2)
3.1.3 Logic behind Qualcomm Snapdragon 8155 Being Recognized
3.1.4 Business Model Logic of Fourth-generation Qualcomm Snapdragon SA8295P
3.1.5 The Upgrading of High-end Cockpit Chips Accelerates, and Mass Production of Qualcomm Snapdragon 8295 Starts
3.1.6 What Can Qualcomm Snapdragon 8295 Bring to Intelligent Vehicles?
3.1.7 Who are Laying out the Next-generation High-performance Cockpit SoCs?
3.1.8 Possible Ways to Surpass Qualcomm

3.2 Topic 2: Do Server/PC Solutions Buck the Next-generation Cockpit SoC?
3.2.1 AMD VS Qualcomm
3.2.2 ?ARM+Android? VS ?X86+Linux?
3.2.3 Do Server/PC Solutions Buck the Next-generation Cockpit SoC? (1)
3.2.4 Do Server/PC Solutions Buck the Next-generation Cockpit SoC? (2)
3.2.5 Main Products with X86 Architecture in the Cockpit Field (1)
3.2.6 Main Products with X86 Architecture in the Cockpit Field (1)
3.2.7 Optimal Combination of X86 Architecture and Self-developed Linux Desktop System in the Cockpit Field
3.2.8 AMD’s Cockpit Cases
3.2.9 X86 Architecture Cockpit Cases

3.3 Topic 3: Breakthroughs in Cockpit SoC Localization
3.3.1 Local Cockpit SoC Companies Work to Develop New Products amid the Localization Trend
3.3.2 Domestic Cockpit SoCs Are in the Phase of Mass Production and Deployment in Vehicles
3.3.3 Barriers to Cockpit SoC Localization
3.3 Ways to Cockpit SoC Localization
3.3.5 The Pace of Localization Quickens in the Trend towards Cost Reduction and Efficiency Improvement
3.3.6 Cases

3.4 Topic 4: How Will Cockpit SoCs Develop in the Trend towards Cockpit-driving Integration
3.4.1 As EEA Evolves, Cockpit-driving Integration Is around the Corner
3.4.2 Main Layout Modes of Automotive Central Computing Platforms
3.4.3 Vehicle Central Computing Platform Architecture Solution 1
3.4.4 Vehicle Central Computing Platform Architecture Solution 2
3.4.5 Intelligent Cockpit Development Forms in the Trend towards Cockpit-driving Integration
3.4.6 Requirements for Chips in the Trend towards Cockpit-driving Integration
3.4.7 Cockpit SoCs Are Moving towards Central Computing SoCs
3.4.8 Challenges to Central Computing SoCs
3.4.9 Progress in Cockpit-driving Integration Chips
3.4.10 Main Cases

3.5 Topic 5: Optional CPU, GPU and Other Modules for Next-generation Cockpit SoCs
3.5.1 Must-Have Capabilities for Cockpit SoCs
3.5.2 Cockpit SoC Processes Are Getting Ever Smaller, and 3nm Chips Have Been Released
3.5.3 Cockpit SoC Products Have Ever Requirements for CPU/GPU Compute (1)
3.5.4 Cockpit SoC Products Have Ever Requirements for CPU/GPU Compute (2)
3.5.5 Cockpit SoC Products Have Ever Requirements for CPU/GPU Compute (3)
3.5.6 Maximum AI Compute Required by Cockpit SoCs
3.5.7 How Many Functions Can Cockpit SoC Products Support
3.5.8 Cockpit SoC Design Schematic Diagram and Architecture
3.5.9 Main CPU Cores Adopted by Main Cockpit SoCs Currently
3.5.10 ARM Architecture CPU Core Used in Vehicles
3.5.11 Development of Qualcomm CPU Architecture and Cores Used in Cockpits
3.5.12 Optional CPU Cores for Next-generation Cockpit SoCs
3.5.13 Main GPU Cores Used in Main Cockpit SoCs Currently
3.5.14 Main GPU Cores Used in Main Cockpit SoC Products
3.5.15 Optional CPU Cores for Next-generation Cockpit SoCs

3.6 Topic 6: What Packaging Technologies Are Needed by Next-generation Cockpit SoCs?
3.6.1 High-performance Cockpit SoC Processes Become Ever More Advanced
3.6.2 Main Cockpit SoC Packaging Processes
3.6.3 Evolution of Cockpit SoC Packaging Technology (1)
3.6.4 Evolution of Cockpit SoC Packaging Technology (2)
3.6.5 Evolution of Cockpit SoC Packaging Technology (3)
3.6.6 The Evolution of Advanced Processes and the Slowdown of Moore’s Era Facilitate Technological Innovation of Chiplets
3.6.7 Chiplets Facilitate the Development of High-compute Automotive SoCs (1)
3.6.8 Chiplets Facilitate the Development of High-compute Automotive SoCs (2)
3.6.9 Cockpit SoC and Chiplet
3.6.10 Chiplet Advantages
3.6.11 Chiplet Challenges
3.6.12 How Much Cost Can Chiplet Technology Reduce
3.6.13 Advantages of Chiplet Used in Cockpit SoC
3.6.14 Main Companies That Use Chiplets to Lay out Cockpit SoCs
3.6.15 Chiplet Integration Case (1)
3.6.16 Future Development Trends of Chiplet
3.6.17 Conventional Packaging VS Advanced Packaging
3.6.18 Main Types of Advanced Packaging
3.6.19 Underlying Packaging Technologies Supporting Chiplets
3.6.20 Mainstream Packaging Technologies of Chiplet
3.6.21 Advanced Packaging Technology Ecosystem Has Been Built
3.6.22 Main Companies Deploying Advanced Packaging
3.6.23 New Dynamics
3.6.24 Cases of Deploying Companies
3.6.25 Die-to-Die Chip-level Interconnect Standards
3.6.26 Other Interconnect Technologies

3.7 Topic 7: Transformation in Development Models and Supply Models of Cockpit SoCs under the Impetus of Intelligence
3.7.1 Automotive Chip Development Process Transformation
3.7.2 Novel Automotive Chip Development Process
3.7.3 Cockpit SoC Supply Model Transformation
3.7.4 Changes in Cockpit SoC Supply Demand of OEMs
3.7.5 Cases of Cockpit SoC Supply Model Transformation


4 Foreign Cockpit SoC Vendors
4.1 NXP
4.1.1 Automotive Processor Roadmap
4.1.2 Parameters of i.MX 95
4.1.3 i.MX 95 Adopts the Self-developed NPU
4.1.4 i.MX 95 Can Be Used in the Low-to-mid-end Cockpit Field
4.1.5 i.MX 8 Applications Processor Family
4.1.6 Main Performance Indicators of i.MX 8 Family (1)
4.1.7 Main Performance Indicators of i.MX 8 Family (2)
4.1.8 i.MX8QM Software Stack Module
4.1.9 Typical Cockpit Application Solutions of i.MX
4.1.10 i.MX 6 for the Low-to-mid-end Market
4.1.11 i.MX Partner Ecosystem
4.1.12 Operating Systems Supported by i.MX
4.1.13 AI Algorithms Supported by i.MX
4.1.14 i.MX and Future Cockpit System
4.1.15 i.MX and Future Cockpit System
4.1.16 Latest Cockpit Dynamics

4.2 Texas Instruments
4.2.1 TI Cockpit Chip
4.2.2 J6
4.2.3 Texas Instruments Has a Place in the Mid-end Cockpit Processor Market
4.2.4 Parameters of Jacinto 6
4.2.5 Cockpit Solutions and Partners of Jacinto 6

4.3 Renesas
4.3.1 Profile
4.3.1 The Fifth-generation R-Car Planning
4.3.2 Chip Business
4.3.3 The Automotive Product Line Was Further Expanded through the Acquisition of Dialog
4.3.4 The Automotive Product Line Was Further Expanded through the Acquisition of Dialog
4.3.6 High-end Integrated Cockpit Solutions in Cooperation with Dialog
4.3.7 High-end Cockpit Solutions Featured with Tactile Sensing in Cooperation with Dialog
4.3.8 Chip Capacity Expansion Plan
4.3.9 Automotive Market Segment: R-Car Series
4.3.10 R-Car Series for Cockpit Processors
4.3.11 Cockpit SoC Product Line
4.3.12 Main Features of Cockpit SoCs
4.3.13 R-Car Gen3e
4.3.14 Digital Cluster with Integrated Driver ID on R-CARE 3e
4.3.15 Android Integrated Cockpit on R-Carm3e
4.3.16 Integrated Non-virtualized Intelligent Cockpit Solution
4.3.17 Low-Cost Digital Instrument Cluster Reference Design
4.3.18 Cockpit Trends
4.3.19 R-Car in Future Automotive Architectures
4.3.20 EEA Strategy
4.3.21 R-Car Software Development Kit (SDK)
4.3.22 Software Platform
4.3.23 Software-as-a-Service Platform
4.3.24 Virtual Development Environment
4.3.25 Integrated Development Environment
4.3.26 Dynamics

4.4 Qualcomm
4.4.1 Profile
4.4.2 Digital Chassis
4.4.3 Development History of Cockpit SoCs
4.4.4 The Evolving Snapdragon Cockpit Platform Integrates Rich Software Ecosystems
4.4.5 Cockpit Platform Integrates Multiple Functions
4.4.6 Scalable Software Ecosystem of Cockpit Platform
4.4.7 4th Generation Snapdragon Cockpit Platform
4.4.8 Common Software Architecture of 4th Generation Snapdragon Cockpit Platform
4.4.9 Parameters of SA8295P
4.4.10 4th Generation Snapdragon Cockpit Platform: QAM8255P
4.4.11 3rd Generation Snapdragon Cockpit SoC
4.4.12 3rd Generation Snapdragon Cockpit SoC
4.4.13 Parameters of Snapdragon SA8195P
4.4.14 1st and 2nd Generation Snapdragon Cockpit SoC
4.4.15 Major Cockpit Platform Customers
4.4.16 Snapdragon Ride Flex SoC (1)
4.4.17 Snapdragon Ride Flex SoC (2)
4.4.18 Functional Safety Layout of Snapdragon Ride Flex SoC
4.4.19 Software Reference Architecture of Snapdragon Ride Flex SoC
4.4.20 Central Computing Chip: SA8775
4.4.21 Software Reference Architecture of SA8775
4.4.22 Other Cockpit-related Chips: Industry-grade QCS8550/QCM8550
4.4.23 Latest Cockpit Dynamics

4.5 Intel
4.5.1 Cockpit Processor Layout
4.5.2 First-generation SDV SoC
4.5.3 Hardware Architecture of SDV SoC
4.5.4 Software Architecture of SDV SoC
4.5.5 SDV SoC’s Efficiency Advantages In Hardware-based Physical Separation
4.5.6 Launch of AI PC Processors
4.5.7 Chip Customization Service
4.5.8 A3900 Processor

4.6 Samsung
4.6.1 Cockpit Processors
4.6.2 Cockpit Processor: V920
4.6.3 Cockpit Processor: V9
4.6.4 Cockpit SoCs
4.6.5 Automotive SoC Roadmap
4.6.6 Strategic Cooperation with SemiDrive

4.7 NVIDIA
4.7.1 Revenue
4.7.2 Deep Learning Processors
4.7.3 Cooperation with MediaTek to Create Intelligent Cockpit Chips and Lay out the High-end Market
4.7.4 Automotive Central Computing Chips
4.7.5 Deep Learning Processors: Orin
4.7.6 Deep Learning Processors: Parker
4.7.7 Mercedes-Benz MBUX Used NVIDIA’s Chips

4.8 Telechips
4.8.1 Focus on Low-to-mid-end and LCD Clusters
4.8.2 Development History of Dolphin Cockpit Processor
4.8.3 Cockpit Chip: Dolphin 5
4.8.4 Cockpit Chip: Dolphin 3 Series
4.8.5 Cockpit Chip: Dolphin+ Series
4.8.6 Major Customers
4.8.7 Cockpit Application Solutions
4.8.8 Dolphin 3 Intelligent Cockpit Solution
4.8.9 iGentAI’s Intelligent Cockpit Platform Solution Based on Dolphin 3
4.8.10 iGentAI’s Intelligent Cockpit Solution Based on Dolphin 5
4.8.11 Cockpit Dynamics

4.9 AMD
4.9.1 Automotive Processor Layout
4.9.2 Automotive Digital Cockpit Chip Layout Roadmap
4.9.3 The Latest Cockpit Chip: V2000A
4.9.4 The Latest Cockpit Chip: V2000A
4.9.5 Application Cases of V2000A
4.9.2 The Cockpits of Tesla’s Full Range of Models Will Use AMD Processors
4.9.7 Embedded V1000 Series
4.9.8 Embedded V2000 Series
4.9.9 Major Automotive Intelligent Cockpit Customers


5 Chinese Cockpit SoC Vendors
5.1 SemiDrive
5.1.1 Profile
5.1.2 X9 Cockpit Series Products
5.1.3 Cockpit Chips: X9
5.1.4 Block Diagram of X9 Series Application Solution
5.1.5 Released the Latest Cockpit Product X9H 2.0G
5.1.6 Block Diagram of X9H 2.0G Reference Solution
5.1.7 X9SP All-scenario Cockpit Processors
5.1.8 Flagship Cockpit Processor: X9U
5.1.9 Block Diagram of X9U Application Solution
5.1.10 The Second-generation Central Computer Architecture
5.1.11 Cockpit-Parking Integrated System
5.1.12 Cockpit-driving Integrated Controllers Based on SemiDrive’s Chips
5.1.13 Domestic Centralized Central Computing Units Based on SemiDrive’s Chips
5.1.14 Cooperation Models (1)
5.1.15 Cooperation Models (2)
5.1.16 Overseas Business Layout
5.1.17 Application and Mass Production
5.1.18 Application and Mass Production: Cockpit Customers
5.1.19 Dynamics

5.2 MediaTek
5.2.1 Cockpit Chip Development
5.2.2 Launch of Dimensity Auto Platform
5.2.2 Launch of Dimensity Auto Cockpit Platform
5.2.4 Cooperation with NVIDIA in Creating Intelligent Cockpit Chips and Laying out the High-end Market
5.2.5 Released the Latest Dimensity Cockpit Chip
5.2.6 Released the Latest Dimensity Cockpit Chip
5.2.7 MT8666
5.2.8 MT8675
5.2.9 MT8675 Chip Platform Virtualized Intelligent Cockpit Solution
5.2.10 MT2715
5.2.11 MT2715 Cockpit Domain Controller Solution Based on Virtualized Isolation
5.2.12 MT2715-based Cockpit System Architecture
5.2.13 MT2712
5.2.14 Cooperation with ECARX
5.2.15 Cockpit Development Planning

5.3 Huawei Hisilicon
5.3.1 Cockpit Chip: Kirin 710A
5.3.2 Cockpit Chip: Kirin 990A

5.4 AutoChips
5.4.1 Cockpit SoC
5.4.2 Cockpit SoC Product Matrix
5.4.3 Cockpit Processors: AC8025
5.4.4 Example of Cockpit Design Architecture Based on AC8025
5.4.5 Cockpit Processors: AC8015
5.4.6 Cockpit Processor System Architecture
5.4.7 Integrated Light Cockpit Solution (1)
5.4.8 Integrated Light Cockpit Solution (2)
5.4.9 Architecture of Integrated Light Cockpit Solution
5.4.10 SoC Software and Hardware Integrated Cockpit Solution
5.4.11 Cockpit Chip Development Planning
5.4.12 Partners & Customers

5.5 SiEngine Technology
5.5.1 Profile
5.5.2 Development History
5.5.3 Intelligent Cockpit Chips: Longying No.1
5.5.4 Key Parameters of Intelligent Cockpit Chips
5.5.5 Cockpit Chip Software and Hardware Reference Design Platform
5.5.6 Development Planning
5.5.7 High-end Cockpit Solutions
5.5.8 Flagship Cockpit Solutions
5.5.9 Single-chip Cockpit-parking integration Solutions
5.5.10 Cockpit-driving Integration Solutions
5.5.11 Cooperation with ECARX and FAW to Develop an Intelligent Cockpit Platform based on Longying No.1

5.6 Rockchip
5.6.1 Profile
5.6.2 Development History
5.6.3 Automotive Solution Application - Passenger Car Series
5.6.4 Automotive Solution Application - Commercial Vehicle Series
5.6.5 Automotive Solution Application - Commercial Vehicle Series
5.6.6 Advantages of Self-developed IP
5.6.7 RK3588M - “One-chip + Multi-screen” Solution
5.6.8 RK3588M - “One-chip + Multi-screen” Solution
5.6.9 RK3568M - Center Console + AVM Integration Solution
5.6.10 RK3358M - Full LCD Cluster and Center Console
5.6.11 RK3308M - Automotive Audio and Voice Solutions
5.6.12 RV11 - DVR Solutions
5.6.13 Localized Cockpit Solutions (1)
5.6.14 Localized Cockpit Solutions (2)

5.7 UNISoC
5.7.1 Profile
5.7.2 Intelligent Cockpit Chip: A7870
5.7.3 Intelligent Cockpit Chip: A7862
5.7.4 Software and Hardware Platform-based Products Can Adapt to a Variety of User Scenarios
5.7.5 Intelligent Cockpit Domain Controller Platform

5.8 Allwinner Technology
5.8.1 Automotive Market Layout
5.8.2 Development History of Automotive SoCs
5.8.3 Cockpit Processors: T7
5.8.4 T7 Solution Architecture
5.8.5 Cockpit Processors: T5
5.8.6 SoC Development Route
5.8.7 Major Automotive SoC Customers


6 Cockpit SoC Application Trends of OEMs
6.1 BYD
6.1.1 Cockpit Chip Planning
6.1.2 New DiLink Cockpit Platform
6.1.3 Cockpit-driving Integration Layout
6.1.4 Development History of Cockpit SoCs
6.1.5 Use Qualcomm 5G Solution Chips for Effective Cost Reduction
6.1.6 Overseas Models Will Be Equipped with Qualcomm 8155 Cockpit Solution
6.1.7 Cockpit SoC Distribution by Brand
6.1.8 Cockpit SoCs of Dynasty Series
6.1.9 Cockpit SoCs of Ocean Series
6.1.10 Cockpit SoCs of Yangwang Brand
6.1.11 Cockpit SoCs of Denza Brand
6.1.12 Cockpit SoCs of Fangchengbao
6.1.13 Xuanji Architecture

6.2 Tesla Cockpit SoC
6.2.1 Intelligent Cockpit Hardware Iteration (1)
6.2.2 Intelligent Cockpit Hardware Iteration (2)
6.2.3 HW 4.0 Cockpit Domain
6.2.4 System Architecture of MCU3.0 Infotainment Control Unit
6.2.5 Hardware Configuration of MCU3.0 Infotainment Control Unit

6.3 BMW Cockpit SoC
6.3.1 Cockpit SoC Evolution
6.3.2 IDC23 (1)
6.3.3 IDC23 (2)
6.3.4 IDC23 VS MGU22
6.3.5 MGU22
6.3.6 MGU21
6.3.7 MGU
6.3.8 Cooperation with Qualcomm in Cockpit, Intelligent Driving and Other Technical Fields

6.4 Mercedes-Benz Cockpit SoC
6.4.1 Evolution of Cockpit Chips
6.4.2 CIVIC Cockpit Hardware (1)
6.4.3 CIVIC Cockpit Hardware (2)
6.4.4 NGT7
6.4.5 Third-generation MBUX
6.4.6 Second-generation MBUX
6.4.7 First-generation MBUX
6.4.8 NTG6 with Dual Architecture

6.5 Volkswagen Cockpit SoC
6.5.1 Cockpit SoC
6.5.2 ICAS3 Cockpit
6.5.3 ID.4 Cockpit
6.5.4 CNS 3.0 Architecture
6.5.5 Cooperation Dynamics (1)
6.5.6 Cooperation Dynamics (2)

6.6 Audi Cockpit SoC
6.6.1 Intelligent Cockpit SoC Evolution
6.6.2 MIB with Dual System Architecture
6.6.3 MMI System Architecture

6.7 GM Cockpit SoC
6.7.1 Intelligent Cockpit SoC
6.7.2 Chip Layout
6.7.3 Planning

6.8 Ford Cockpit SoC
6.8.1 SYNC Chip Evolution
6.8.2 The Next-generation Cockpit System Is Planned to Adopt Android Automotive System and NXP SoC
6.8.3 SYNC+ Chip Evolution
6.8.5 Cockpit SoCs of Main Models
6.8.2 New-generation Automotive Domain Controller
6.8.6 SYNC4.0 Hardware
6.8.7 Chip Layout Planning

6.9 Volvo Cockpit SoC
6.9.1 Cockpit SoC
6.9.2 Cockpit of XC90 BEV
6.9.3 Volvo and Qualcomm Cooperated to Deploy Intelligent Cockpits
6.9.4 Cockpit of EX90 SUV BEV

6.10 Toyota Cockpit SoC
6.10.1 Toyota Cockpit SoC
6.10.2 Dismantling of Tundra Cockpit
6.10.3 Intelligent Cockpit of GAC Toyota T-SMART
6.10.4 Intelligent Cockpit of FAW Toyota Space
6.10.5 Chip Layout

6.11 Hyundai Cockpit SoC
6.11.1 Cockpit SoC
6.11.2 The Cockpit System Will Use Samsung’s Chips
6.11.3 SDx Strategy

6.12 Nissan Renault
6.12.1 Cockpit of Nissan Flagship EV Ariya
6.12.2 Dismantling of Cockpit of Renault M?gane E-Tech Electric

6.13 Great Wall Motor Cockpit SoC
6.13.1 Intelligent Cockpit SoC Layout
6.13.2 Intelligent Cockpit SoC Configuration of Major Brands
6.13.3 Coffee Intelligence 2.0 - Intelligent Cockpit
6.13.4 Intelligent Cockpit Domain Layout Planning of Nobo Automotive Systems
6.13.5 Intelligent Cockpit Domain Products of Nobo Automotive Systems
6.13.6 Coffee OS - Intelligent Cockpit Planning

6.14 GAC Cockpit SoC
6.14.1 Intelligent Cockpit Layout
6.14.2 High-performance Immersed Cockpit: ADiGO PARK Metaverse
6.14.3 Cockpit SoCs of Main Models
6.14.6 Computing Unit SoC of GAC AION X-Soul Architecture

6.15 Changan Cockpit SoC
6.15.1 Intelligent Cockpit SoC
6.15.2 Changan UNIBrain
6.15.3 Super Digital Platform Architecture
6.15.4 Intelligent Cockpit SoC of Main Models

6.16 SAIC Cockpit SoC
6.16.1 Intelligent Cockpit SoC
6.16.2 Latest-generation Galaxy Intelligent Cockpit Solution of SAIC Z-ONE
6.16.3 Z-ONE’s Cockpit-driving Integrated HPC
6.16.4 Z-ONE’s Intelligent Cockpit Computing Platform: ZCM
6.16.5 Z-ONE Galaxy? Cockpit-driving Integrated Computing Platform
6.16.6 Mass Production of the First Cross-domain Fusion Central Brain
6.16.8 IM AI Cockpit
6.16.7 Ecosystem Partners
6.16.9 Intelligent Cockpit SoC Configuration of Main Models

6.17 Geely Cockpit SoC
6.17.1 Cockpit SoC
6.17.2 Cockpit SoC Configuration of ZEEKR
6.17.3 Cockpit SoC Configuration of Lynk & Co
6.17.4 Cockpit SoC Configuration of Other Brand Models
6.17.5 Cockpit Chip Layout
6.17.6 Smart, ECARX and Immersive Intelligent Cockpit
6.17.7 Cockpit SoC Planning in Smart Geely 2025

6.18 BAIC Cockpit SoC
6.18.1 Passenger Car Cockpit SoC
6.18.2 Cooperation between BAIC BluePark and Huawei

6.19 Hongqi Cockpit SoC
6.19.1 Cockpit SoC
6.19.2 Chip Application Planning
6.19.3 Intelligent Cockpit Platform Chip
6.19.4 Cockpit-driving Integration Chip and "Flag" Intelligent Architecture
6.19.5 Cockpit SoCs of Main Models
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