Table of Content

1 INTRODUCTION 
    1.1 OBJECTIVES OF THE STUDY 
    1.2 MARKET DEFINITION 
    1.3 MARKET SCOPE 
           1.3.1 MARKETS COVERED
           1.3.2 YEARS CONSIDERED FOR THE STUDY
           1.3.3 INCLUSIONS AND EXCLUSIONS
    1.4 CURRENCY 
    1.5 LIMITATION 
    1.6 STAKEHOLDERS 
           1.6.1 IMPACT OF RECESSION
2 RESEARCH METHODOLOGY 
    2.1 RESEARCH DATA 
           2.1.1 SECONDARY DATA
                    2.1.1.1 Key Data from Secondary Sources
           2.1.2 PRIMARY DATA
                    2.1.2.1 Key Data from Primary Sources
                    2.1.2.2 Key Industry Insights
                    2.1.2.3 Breakdown of Primary Interviews
    2.2 MARKET SIZE ESTIMATION 
    2.3 DATA TRIANGULATION 
    2.4 IMPACT OF RECESSION 
    2.5 RESEARCH ASSUMPTIONS 
3 EXECUTIVE SUMMARY 
4 PREMIUM INSIGHTS 
5 MARKET OVERVIEW 
    5.1 INTRODUCTION 
    5.2 MARKET DYNAMICS 
           5.2.1 DRIVERS
           5.2.2 RESTRAINTS
           5.2.3 OPPORTUNITIES
           5.2.4 CHALLENGES
    5.3 TRENDS/DISRUPTIONS IMPACTING CUSTOMER’S BUSINESS 
    5.4 PRICING ANALYSIS 
           5.4.1 AVERAGE SELLING PRICE TREND, BY REGION
           5.4.2 INDICATIVE PRICING ANALYSIS BY PRODUCT TYPE
    5.5 SUPPLY/VALUE CHAIN ANALYSIS  
    5.6 INVESTMENT AND FUNDING SCENARIO 
    5.7 FUNDING BY USE-CASE APPLICATION 
    5.8 ECOSYSTEM/MARKET MAP 
    5.9 TECHNOLOGY ANALYSIS 
    5.1 PATENT ANALYSIS 
    5.11 TRADE ANALYSIS 
    5.12 KEY CONFERENCES AND EVENTS IN 2024-2025 
    5.13 REGULATORY LANDSCAPE 
           5.13.1 REGULATORY BODIES, GOVERNMENT AGENCIES AND OTHER ORGANIZATIONS
           5.13.2 SEMICONDUCTOR AND IC PACKAGING MATERIALS MARKET-GLOBAL FORECAST TO 2028
                    5.13.2.1 North America
                    5.13.2.2 US
                    5.13.2.3 Canda
                    5.13.2.4 Europe
                    5.13.2.5 Asia Pacific
    5.14 PORTER’S FIVE FORCES’ ANALYSIS 
           5.14.1 THREAT OF NEW ENTRANTS
           5.14.2 THREAT OF SUBSTITUTES
           5.14.3 BARGAINING POWER OF SUPPLIERS
           5.14.4 BARGAINING POWER OF BUYERS
           5.14.5 INTENSITY OF COMPETITION RIVALRY
    5.15 KEY STAKEHOLDERS AND BUYING CRITERIA 
           5.15.1 KEY STAKEHOLDERS IN THE BUYING PROCESS
           5.15.2 BUYING CRITERIA
    5.16 CASE STUDY ANALYSIS 
    5.17 MACRO-ECONOMIC ANALYSIS 
6 SEMICONDUCTOR & IC PACKAGING MATERIAL MARKET, BY TYPE – FORECAST TILL 2028 
    6.1 INTRODUCTION 
    6.2 ORGANIC SUBSTRATES 
    6.3 BONDING WIRES 
    6.4 LEADFRAMES  
    6.5 ENCAPSULATION RESNS  
    6.6 CERAMIC PACKAGES  
    6.7 DIE ATTACH MATERIALS 
    6.8 THERMAL INTERFACE MATERIALS 
    6.9 SOLDER BALLS  
    6.1 OTHERS  
7 SEMICONDUCTOR & IC PACKAGING MATERIAL MARKET, BY PACKAGING TECHNOLOGY– FORECAST TILL 2028 
    7.1 INTRODUCTION 
    7.2 SOP 
    7.3 GA  
    7.4 QFN 
    7.5 DFN 
    7.6 QFP 
    7.7 DIP 
    7.8 OTHERS 
8 SEMICONDUCTOR & IC PACKAGING MATERIAL MARKET, BY END USE INDUSTRY– FORECAST TILL 2028 
    8.1 INTRODUCTION 
    8.2 CONSUMER ELECTRONICS  
    8.3 AUTOMOTIVE  
    8.4 HEALTHCARE 
    8.5 IT & TELECOMMUNICATION  
    8.6 AEROSPACE AND DEFENSE  
    8.7 OTHERS 
9 SEMICONDUCTOR & IC PACKAGING MATERIAL MARKET, BY REGION – FORECAST TILL 2028 
    9.1 INTRODUCTION 
    9.2 NORTH AMERICA 
           9.2.1 IMPACT OF RECESSION
           9.2.2 US
           9.2.3 CANADA
           9.2.4 MEXICO
    9.3 ASIA PACIFIC 
           9.3.1 IMPACT OF RECESSION
           9.3.2 CHINA
           9.3.3 INDIA
           9.3.4 JAPAN
           9.3.5 TAIWAN
           9.3.6 SOUTH KOREA
           9.3.7 REST OF ASIA PACIFIC
    9.4 EUROPE 
           9.4.1 IMPACT OF RECESSION
           9.4.2 GERMANY
           9.4.3 FRANCE
           9.4.4 ITALY
           9.4.5 UK
           9.4.6 SPAIN
           9.4.7 REST OF EUROPE
    9.5 SOUTH AMERICA 
           9.5.1 IMPACT OF RECESSION
           9.5.2 BRAZIL
           9.5.3 ARGENTINA
           9.5.4 REST OF SOUTH AMERICA
    9.6 MIDDLE EAST & AFRICA 
           9.6.1 IMPACT OF RECESSION
           9.6.2 UAE
           9.6.3 REST OF GCC COUNTRIES 
           9.6.4 ISRAEL 
           9.6.5 SOUTH AFRICA
           9.6.6 REST OF MIDDLE EAST & AFRICA
*Note: This is a tentative list of countries that may change during study
10 COMPETITIVE LANDSCAPE 
     10.1 OVERVIEW 
     10.2 KEY PLAYER STRATEGIES/RIGHT TO WIN 
     10.3 REVENUE ANALYSIS  
             10.3.1 REVENUE ANALYSIS OF TOP 5 MARKET PLAYERS
     10.4 MARKET SHARE ANALYSIS 
             10.4.1 MARKET RANKING OF TOP 5 KEY PLAYERS
     10.5 COMPANY EVALUATION MATRIX, KEY PLAYERS, 2023 
             10.5.1 STARS
             10.5.2 EMERGING LEADERS
             10.5.3 PERVASIVE PLAYERS
             10.5.4 PARTICIPANTS
             10.5.5 COMPANY FOOTPRINT:KEY PLAYERS, 2023
                        10.5.5.1 Company Footprint
                        10.5.5.2 Region Footprint
                        10.5.5.3 Type Footprint
                        10.5.5.4 Application Footprint
     10.6 COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2023 
             10.6.1 PROGRESSIVE COMPANIES
             10.6.2 RESPONSIVE COMPANIES
             10.6.3 DYNAMIC COMPANIES
             10.6.4 STARTING BLOCKS
             10.6.5 COMPETITIVE BENCHMARKING:STARTUPS/SMES, 2023
                        10.6.5.1 Detailed List of Key Startups/SMEs
                        10.6.5.2 Competitive Benchmarking of Key Startups/SMEs
     10.7 COMPANY VALUATION  
     10.8 FINANCIAL METRICS 
     10.9 BRAND/ PRODUCT COMPARISON 
     10.1 COMPETITIVE SCENARIO AND TRENDS 
             10.10.1 EXPANSIONS & INVESTMENTS
             10.10.2 AGREEMENTS, COLLABORATIONS, AND JOINT VENTURES
             10.10.3 NEW PRODUCT LAUNCHES
             10.10.4 MERGERS & ACQUISITIONS
11 COMPANY PROFILE  
     11.1 MACDERMID, INC. 
             11.1.1 BUSINESS OVERVIEW
             11.1.2 PRODUCTS/SOLUTIONS/SERVICES OFFERED
             11.1.3 RECENT DEVELOPMENTS
             11.1.4 MNM VIEW
                        11.1.4.1 Key Strengths/Right to Win
                        11.1.4.2 Strategic Choice Made
                        11.1.4.3 Weaknesses and Competitive Threats
     11.2 LG CHEM 
             11.2.1 BUSINESS OVERVIEW
             11.2.2 PRODUCTS/SOLUTIONS/SERVICES OFFERED
             11.2.3 RECENT DEVELOPMENTS
             11.2.4 MNM VIEW
                        11.2.4.1 Key Strengths/Right to Win
                        11.2.4.2 Strategic Choice Made
                        11.2.4.3 Weaknesses and Competitive Threats
     11.3 AMKOR TECHNOLOGY  
             11.3.1 BUSINESS OVERVIEW
             11.3.2 PRODUCTS/SOLUTIONS/SERVICES OFFERED
             11.3.3 RECENT DEVELOPMENTS
             11.3.4 MNM VIEW
                        11.3.4.1 Key Strengths/Right to Win
                        11.3.4.2 Strategic Choice Made
                        11.3.4.3 Weaknesses and Competitive Threats
     11.4 POWERTECH TECHNOLOGY INC. 
             11.4.1 BUSINESS OVERVIEW
             11.4.2 PRODUCTS/SOLUTIONS/SERVICES OFFERED
             11.4.3 RECENT DEVELOPMENTS
             11.4.4 MNM VIEW
                        11.4.4.1 Key Strengths/Right to Win
                        11.4.4.2 Strategic Choice Made
                        11.4.4.3 Weaknesses and Competitive Threats
     11.5 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED 
             11.5.1 BUSINESS OVERVIEW
             11.5.2 PRODUCTS/SOLUTIONS/SERVICES OFFERED
             11.5.3 RECENT DEVELOPMENTS
             11.5.4 MNM VIEW
                        11.5.4.1 Key Strengths/Right to Win
                        11.5.4.2 Strategic Choice Made
                        11.5.4.3 Weaknesses and Competitive Threats
     11.6 HENKEL AG & CO. KGAA 
     11.7 KYOCERA CORPORATION 
     11.8 ASE  
     11.9 SILICONWARE PRECISION INDUSTRIES CO., LTD. (SPIL) 
     11.1 IBIDEN CO., LTD 
     11.11 OTHER KEY 15 PLAYERS 
*Note: This is a tentative list of companies, and it may change during study. Financial will only be provided for listed companies. 
12 APPENDIX 
     12.1 INSIGHTS FROM INDUSTRY EXPERTS 
     12.2 DISCUSSION GUIDE 
     12.3 AVAILABLE CUSTOMIZATIONS 
     12.4 CONNECTED MARKET 
     12.5 RELATED REPORTS