Table of Content

1 INTRODUCTION
1.1 Study Assumptions and Market Definition
1.2 Scope of the Study


2 RESEARCH METHODOLOGY


3 EXECUTIVE SUMMARY


4 MARKET INSIGHTS
4.1 Market Overview
4.2 Market Attractiveness - Porter’s Five Forces Analysis
4.2.1 Bargaining Power of Suppliers
4.2.2 Bargaining Power of Buyers
4.2.3 Threat of New Entrants
4.2.4 Threat of Substitutes
4.2.5 Intensity of Competitive Rivalry
4.3 Industry Value Chain Analysis
4.4 Impact of COVID-19 on the Market


5 Market Dynamics
5.1 Market Driver
5.1.1 Increasing Investment by Semiconductor Manufacturers to Expand their Manufacturing Capacity
5.1.2 Rising Demand for Semiconductor Chips across Various Application
5.2 Market Restraints
5.2.1 High Cost of Ownership
5.2.2 Increased Complexity Owing to Miniaturization of Circuits


6 MARKET SEGMENTATION
6.1 By Type
6.1.1 Permanent Bonding Equipment
6.1.2 Temporary Bonding Equipment
6.1.3 Hybrid Bonding Equipment
6.2 By Application
6.2.1 Advanced Packaging
6.2.2 Power IC and Power Discrete
6.2.3 Photonic Devices
6.2.4 MEMS Sensors and Actuators
6.2.5 Engineered Substrates
6.2.6 CMOS Image Sensors (CIS)
6.3 By Geography
6.3.1 North America
6.3.2 Asia Pacific
6.3.3 Europe
6.3.4 Rest of the World


7 COMPETITIVE LANDSCAPE
7.1 Company Profiles
7.1.1 EV Group
7.1.2 ASMPT Semiconductor Solutions
7.1.3 MRSI Systems. (Myronic AB)
7.1.4 WestBond Inc.
7.1.5 Panasonic Industry Co. Ltd.
7.1.6 Palomar Technologies
7.1.7 Dr. Tresky AG
7.1.8 BE Semiconductor Industries NV
7.1.9 Fasford Technology Co.Ltd (Fuji Group)
7.1.10 Kulicke and Soffa Industries Inc.
7.1.11 DIAS Automation (HK) Ltd
7.1.12 Shibaura Mechatronics Corporation
7.1.13 SUSS MicroTec SE
7.1.14 Tokyo Electron Limited


8 INVESTMENT ANALYSIS


9 FUTURE OF THE MARKET