Table of Content


1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Limitations
1.7. Assumptions
1.8. Stakeholders

2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview
4.1. Introduction
4.2. 3D IC & 2.5D IC Packaging Market, by Region

5. Market Insights
5.1. Market Dynamics
5.1.1. Drivers
5.1.1.1. Demand for advanced design in electronic products
5.1.1.2. Increasing inclination to miniaturization of electronic devices
5.1.1.3. Augment of gaming devices and tablet smartphones
5.1.2. Restraints
5.1.2.1. Greater levels of integration causes thermal issues
5.1.3. Opportunities
5.1.3.1. Rising demand for high-end computing, data centers, and servers
5.1.3.2. Advent of innovative products from manufacturers and advanced packaging
5.1.4. Challenges
5.1.4.1. High cost per unit of 3D IC and 2.5D IC
5.2. Market Segmentation Analysis
5.3. Market Trend Analysis
5.4. Cumulative Impact of High Inflation
5.5. Porter’s Five Forces Analysis
5.5.1. Threat of New Entrants
5.5.2. Threat of Substitutes
5.5.3. Bargaining Power of Customers
5.5.4. Bargaining Power of Suppliers
5.5.5. Industry Rivalry
5.6. Value Chain & Critical Path Analysis
5.7. Regulatory Framework

6. 3D IC & 2.5D IC Packaging Market, by Technology
6.1. Introduction
6.2. 2.5D
6.3. 3D TSV
6.4. 3D Wafer-Level Chip-Scale Packaging

7. 3D IC & 2.5D IC Packaging Market, by End User
7.1. Introduction
7.2. Automotive
7.3. Consumer Electronics
7.4. Industrial Sector
7.5. Medical Devices
7.6. Military & Aerospace
7.7. Smart Technologies
7.8. Telecommunication

8. 3D IC & 2.5D IC Packaging Market, by Application
8.1. Introduction
8.2. Imaging & Optoelectronics
8.3. LED
8.4. Logic
8.5. Memory
8.6. MEMS/Sensors
8.7. Photonics
8.8. RF

9. Americas 3D IC & 2.5D IC Packaging Market
9.1. Introduction
9.2. Argentina
9.3. Brazil
9.4. Canada
9.5. Mexico
9.6. United States

10. Asia-Pacific 3D IC & 2.5D IC Packaging Market
10.1. Introduction
10.2. Australia
10.3. China
10.4. India
10.5. Indonesia
10.6. Japan
10.7. Malaysia
10.8. Philippines
10.9. Singapore
10.10. South Korea
10.11. Taiwan
10.12. Thailand
10.13. Vietnam

11. Europe, Middle East & Africa 3D IC & 2.5D IC Packaging Market
11.1. Introduction
11.2. Denmark
11.3. Egypt
11.4. Finland
11.5. France
11.6. Germany
11.7. Israel
11.8. Italy
11.9. Netherlands
11.10. Nigeria
11.11. Norway
11.12. Poland
11.13. Qatar
11.14. Russia
11.15. Saudi Arabia
11.16. South Africa
11.17. Spain
11.18. Sweden
11.19. Switzerland
11.20. Turkey
11.21. United Arab Emirates
11.22. United Kingdom

12. Competitive Landscape
12.1. FPNV Positioning Matrix
12.2. Market Share Analysis, By Key Player
12.3. Competitive Scenario Analysis, By Key Player

13. Competitive Portfolio
13.1. Key Company Profiles
13.1.1. 3M Company
13.1.2. Amkor Technology, Inc.
13.1.3. ASE Technology Holding Co, Ltd.
13.1.4. Broadcom Inc.
13.1.5. Fujitsu Limited
13.1.6. Intel Corporation
13.1.7. International Business Machines Corporation
13.1.8. Jiangsu Changjiang Electronics Technology Co., Ltd.
13.1.9. MonolithIC 3D Inc.
13.1.10. Samsung Electronics Co. Ltd
13.1.11. STMicroelectronics NV
13.1.12. Texas Instruments Incorporated
13.1.13. Tezzaron Semiconductor Corporation
13.1.14. Toshiba Electronic Devices & Storage Corporation
13.1.15. United Microelectronics Corporation
13.1.16. Xilinx Inc.
13.2. Key Product Portfolio

14. Appendix
14.1. Discussion Guide
14.2. License & Pricing



List of Figures


FIGURE 1. 3D IC & 2.5D IC PACKAGING MARKET RESEARCH PROCESS
FIGURE 2. 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2023 VS 2030
FIGURE 3. 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
FIGURE 4. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY REGION, 2023 VS 2030 (%)
FIGURE 5. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 6. 3D IC & 2.5D IC PACKAGING MARKET DYNAMICS
FIGURE 7. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2023 VS 2030 (%)
FIGURE 8. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 9. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2023 VS 2030 (%)
FIGURE 10. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 11. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2030 (%)
FIGURE 12. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 13. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
FIGURE 14. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 15. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY STATE, 2023 VS 2030 (%)
FIGURE 16. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 17. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
FIGURE 18. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 19. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
FIGURE 20. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 21. 3D IC & 2.5D IC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023
FIGURE 22. 3D IC & 2.5D IC PACKAGING MARKET SHARE, BY KEY PLAYER, 2023

List of Tables


TABLE 1. 3D IC & 2.5D IC PACKAGING MARKET SEGMENTATION & COVERAGE
TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018–2023
TABLE 3. 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
TABLE 4. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
TABLE 5. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 6. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY 2.5D, BY REGION, 2018-2030 (USD MILLION)
TABLE 7. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY 3D TSV, BY REGION, 2018-2030 (USD MILLION)
TABLE 8. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY 3D WAFER-LEVEL CHIP-SCALE PACKAGING, BY REGION, 2018-2030 (USD MILLION)
TABLE 9. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 10. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2018-2030 (USD MILLION)
TABLE 11. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
TABLE 12. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY INDUSTRIAL SECTOR, BY REGION, 2018-2030 (USD MILLION)
TABLE 13. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MEDICAL DEVICES, BY REGION, 2018-2030 (USD MILLION)
TABLE 14. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MILITARY & AEROSPACE, BY REGION, 2018-2030 (USD MILLION)
TABLE 15. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY SMART TECHNOLOGIES, BY REGION, 2018-2030 (USD MILLION)
TABLE 16. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TELECOMMUNICATION, BY REGION, 2018-2030 (USD MILLION)
TABLE 17. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 18. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY IMAGING & OPTOELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
TABLE 19. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY LED, BY REGION, 2018-2030 (USD MILLION)
TABLE 20. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY LOGIC, BY REGION, 2018-2030 (USD MILLION)
TABLE 21. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MEMORY, BY REGION, 2018-2030 (USD MILLION)
TABLE 22. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MEMS/SENSORS, BY REGION, 2018-2030 (USD MILLION)
TABLE 23. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY PHOTONICS, BY REGION, 2018-2030 (USD MILLION)
TABLE 24. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY RF, BY REGION, 2018-2030 (USD MILLION)
TABLE 25. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 26. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 27. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 28. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
TABLE 29. ARGENTINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 30. ARGENTINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 31. ARGENTINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 32. BRAZIL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 33. BRAZIL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 34. BRAZIL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 35. CANADA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 36. CANADA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 37. CANADA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 38. MEXICO 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 39. MEXICO 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 40. MEXICO 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 41. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 42. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 43. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 44. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
TABLE 45. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 46. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 47. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 48. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
TABLE 49. AUSTRALIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 50. AUSTRALIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 51. AUSTRALIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 52. CHINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 53. CHINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 54. CHINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 55. INDIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 56. INDIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 57. INDIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 58. INDONESIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 59. INDONESIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 60. INDONESIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 61. JAPAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 62. JAPAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 63. JAPAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 64. MALAYSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 65. MALAYSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 66. MALAYSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 67. PHILIPPINES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 68. PHILIPPINES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 69. PHILIPPINES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 70. SINGAPORE 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 71. SINGAPORE 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 72. SINGAPORE 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 73. SOUTH KOREA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 74. SOUTH KOREA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 75. SOUTH KOREA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 76. TAIWAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 77. TAIWAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 78. TAIWAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 79. THAILAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 80. THAILAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 81. THAILAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 82. VIETNAM 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 83. VIETNAM 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 84. VIETNAM 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 85. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 86. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 87. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 88. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
TABLE 89. DENMARK 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 90. DENMARK 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 91. DENMARK 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 92. EGYPT 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 93. EGYPT 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 94. EGYPT 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 95. FINLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 96. FINLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 97. FINLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 98. FRANCE 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 99. FRANCE 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 100. FRANCE 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 101. GERMANY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 102. GERMANY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 103. GERMANY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 104. ISRAEL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 105. ISRAEL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 106. ISRAEL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 107. ITALY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 108. ITALY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 109. ITALY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 110. NETHERLANDS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 111. NETHERLANDS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 112. NETHERLANDS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 113. NIGERIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 114. NIGERIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 115. NIGERIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 116. NORWAY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 117. NORWAY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 118. NORWAY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 119. POLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 120. POLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 121. POLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 122. QATAR 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 123. QATAR 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 124. QATAR 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 125. RUSSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 126. RUSSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 127. RUSSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 128. SAUDI ARABIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 129. SAUDI ARABIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 130. SAUDI ARABIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 131. SOUTH AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 132. SOUTH AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 133. SOUTH AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 134. SPAIN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 135. SPAIN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 136. SPAIN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 137. SWEDEN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 138. SWEDEN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 139. SWEDEN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 140. SWITZERLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 141. SWITZERLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 142. SWITZERLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 143. TURKEY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 144. TURKEY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 145. TURKEY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 146. UNITED ARAB EMIRATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 147. UNITED ARAB EMIRATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 148. UNITED ARAB EMIRATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 149. UNITED KINGDOM 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 150. UNITED KINGDOM 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 151. UNITED KINGDOM 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 152. 3D IC & 2.5D IC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023
TABLE 153. 3D IC & 2.5D IC PACKAGING MARKET SHARE, BY KEY PLAYER, 2023
TABLE 154. 3D IC & 2.5D IC PACKAGING MARKET LICENSE & PRICING