3D IC Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, 2018-2028F

Table of Content

1. Product Overview
1.1. Market Definition
1.2. Scope of the Market
1.2.1. Markets Covered
1.2.2. Years Considered for Study
1.2.3. Key Market Segmentations
2. Research Methodology
2.1. Objective of the Study
2.2. Baseline Methodology
2.3. Formulation of the Scope
2.4. Assumptions and Limitations
2.5. Sources of Research
2.5.1. Secondary Research
2.5.2. Primary Research
2.6. Approach for the Market Study
2.6.1. The Bottom-Up Approach
2.6.2. The Top-Down Approach
2.7. Methodology Followed for Calculation of Market Size & Market Shares
2.8. Forecasting Methodology
2.8.1. Data Triangulation & Validation
3. Executive Summary
4. Impact of COVID-19 on Global 3D IC Market
5. Voice of Customer
6. Global 3D IC Market Overview
7. Global 3D IC Market Outlook
7.1. Market Size & Forecast
7.1.1. By Value
7.2. Market Share & Forecast
7.2.1. By Type (Stacked 3D and Monolithic 3D)
7.2.2. By Component (Through-Silicon Via (TSV), Through Glass Via (TGV), and Silicon Interposer)
7.2.3. By Application (Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, and Others)
7.2.4. By End User (Consumer Electronics, Telecommunication, Automotive, Military & Aerospace, Medical Devices, Industrial, and Others)
7.2.5. By Region (North America, Europe, South America, Middle East & Africa, Asia Pacific)
7.3. By Company (2022)
7.4. Market Map
8. North America 3D IC Market Outlook
8.1. Market Size & Forecast
8.1.1. By Value
8.2. Market Share & Forecast
8.2.1. By Type
8.2.2. By Component
8.2.3. By Application
8.2.4. By End User
8.2.5. By Country
8.3. North America: Country Analysis
8.3.1. United States 3D IC Market Outlook
8.3.1.1. Market Size & Forecast
8.3.1.1.1. By Value
8.3.1.2. Market Share & Forecast
8.3.1.2.1. By Type
8.3.1.2.2. By Component
8.3.1.2.3. By Application
8.3.1.2.4. By End User
8.3.2. Canada 3D IC Market Outlook
8.3.2.1. Market Size & Forecast
8.3.2.1.1. By Value
8.3.2.2. Market Share & Forecast
8.3.2.2.1. By Type
8.3.2.2.2. By Component
8.3.2.2.3. By Application
8.3.2.2.4. By End User
8.3.3. Mexico 3D IC Market Outlook
8.3.3.1. Market Size & Forecast
8.3.3.1.1. By Value
8.3.3.2. Market Share & Forecast
8.3.3.2.1. By Type
8.3.3.2.2. By Component
8.3.3.2.3. By Application
8.3.3.2.4. By End User
9. Europe 3D IC Market Outlook
9.1. Market Size & Forecast
9.1.1. By Value
9.2. Market Share & Forecast
9.2.1. By Type
9.2.2. By Component
9.2.3. By Application
9.2.4. By End User
9.2.5. By Country
9.3. Europe: Country Analysis
9.3.1. Germany 3D IC Market Outlook
9.3.1.1. Market Size & Forecast
9.3.1.1.1. By Value
9.3.1.2. Market Share & Forecast
9.3.1.2.1. By Type
9.3.1.2.2. By Component
9.3.1.2.3. By Application
9.3.1.2.4. By End User
9.3.2. France 3D IC Market Outlook
9.3.2.1. Market Size & Forecast
9.3.2.1.1. By Value
9.3.2.2. Market Share & Forecast
9.3.2.2.1. By Type
9.3.2.2.2. By Component
9.3.2.2.3. By Application
9.3.2.2.4. By End User
9.3.3. United Kingdom 3D IC Market Outlook
9.3.3.1. Market Size & Forecast
9.3.3.1.1. By Value
9.3.3.2. Market Share & Forecast
9.3.3.2.1. By Type
9.3.3.2.2. By Component
9.3.3.2.3. By Application
9.3.3.2.4. By End User
9.3.4. Italy 3D IC Market Outlook
9.3.4.1. Market Size & Forecast
9.3.4.1.1. By Value
9.3.4.2. Market Share & Forecast
9.3.4.2.1. By Type
9.3.4.2.2. By Component
9.3.4.2.3. By Application
9.3.4.2.4. By End User
9.3.5. Spain 3D IC Market Outlook
9.3.5.1. Market Size & Forecast
9.3.5.1.1. By Value
9.3.5.2. Market Share & Forecast
9.3.5.2.1. By Type
9.3.5.2.2. By Component
9.3.5.2.3. By Application
9.3.5.2.4. By End User
9.3.6. Belgium 3D IC Market Outlook
9.3.6.1. Market Size & Forecast
9.3.6.1.1. By Value
9.3.6.2. Market Share & Forecast
9.3.6.2.1. By Type
9.3.6.2.2. By Component
9.3.6.2.3. By Application
9.3.6.2.4. By End User
10. South America 3D IC Market Outlook
10.1. Market Size & Forecast
10.1.1. By Value
10.2. Market Share & Forecast
10.2.1. By Type
10.2.2. By Component
10.2.3. By Application
10.2.4. By End User
10.2.5. By Country
10.3. South America: Country Analysis
10.3.1. Brazil 3D IC Market Outlook
10.3.1.1. Market Size & Forecast
10.3.1.1.1. By Value
10.3.1.2. Market Share & Forecast
10.3.1.2.1. By Type
10.3.1.2.2. By Component
10.3.1.2.3. By Application
10.3.1.2.4. By End User
10.3.2. Colombia 3D IC Market Outlook
10.3.2.1. Market Size & Forecast
10.3.2.1.1. By Value
10.3.2.2. Market Share & Forecast
10.3.2.2.1. By Type
10.3.2.2.2. By Component
10.3.2.2.3. By Application
10.3.2.2.4. By End User
10.3.3. Argentina 3D IC Market Outlook
10.3.3.1. Market Size & Forecast
10.3.3.1.1. By Value
10.3.3.2. Market Share & Forecast
10.3.3.2.1. By Type
10.3.3.2.2. By Component
10.3.3.2.3. By Application
10.3.3.2.4. By End User
10.3.4. Chile 3D IC Market Outlook
10.3.4.1. Market Size & Forecast
10.3.4.1.1. By Value
10.3.4.2. Market Share & Forecast
10.3.4.2.1. By Type
10.3.4.2.2. By Component
10.3.4.2.3. By Application
10.3.4.2.4. By End User
10.3.5. Peru 3D IC Market Outlook
10.3.5.1. Market Size & Forecast
10.3.5.1.1. By Value
10.3.5.2. Market Share & Forecast
10.3.5.2.1. By Type
10.3.5.2.2. By Component
10.3.5.2.3. By Application
10.3.5.2.4. By End User
11. Middle East & Africa 3D IC Market Outlook
11.1. Market Size & Forecast
11.1.1. By Value
11.2. Market Share & Forecast
11.2.1. By Type
11.2.2. By Component
11.2.3. By Application
11.2.4. By End User
11.2.5. By Country
11.3. Middle East & Africa: Country Analysis
11.3.1. Saudi Arabia 3D IC Market Outlook
11.3.1.1. Market Size & Forecast
11.3.1.1.1. By Value
11.3.1.2. Market Share & Forecast
11.3.1.2.1. By Type
11.3.1.2.2. By Component
11.3.1.2.3. By Application
11.3.1.2.4. By End User
11.3.2. UAE 3D IC Market Outlook
11.3.2.1. Market Size & Forecast
11.3.2.1.1. By Value
11.3.2.2. Market Share & Forecast
11.3.2.2.1. By Type
11.3.2.2.2. By Component
11.3.2.2.3. By Application
11.3.2.2.4. By End User
11.3.3. South Africa 3D IC Market Outlook
11.3.3.1. Market Size & Forecast
11.3.3.1.1. By Value
11.3.3.2. Market Share & Forecast
11.3.3.2.1. By Type
11.3.3.2.2. By Component
11.3.3.2.3. By Application
11.3.3.2.4. By End User
11.3.4. Turkey 3D IC Market Outlook
11.3.4.1. Market Size & Forecast
11.3.4.1.1. By Value
11.3.4.2. Market Share & Forecast
11.3.4.2.1. By Type
11.3.4.2.2. By Component
11.3.4.2.3. By Application
11.3.4.2.4. By End User
11.3.5. Israel 3D IC Market Outlook
11.3.5.1. Market Size & Forecast
11.3.5.1.1. By Value
11.3.5.2. Market Share & Forecast
11.3.5.2.1. By Type
11.3.5.2.2. By Component
11.3.5.2.3. By Application
11.3.5.2.4. By End User
12. Asia Pacific 3D IC Market Outlook
12.1. Market Size & Forecast
12.1.1. By Type
12.1.2. By Component
12.1.3. By Application
12.1.4. By End User
12.1.5. By Country
12.2. Asia-Pacific: Country Analysis
12.2.1. China 3D IC Market Outlook
12.2.1.1. Market Size & Forecast
12.2.1.1.1. By Value
12.2.1.2. Market Share & Forecast
12.2.1.2.1. By Type
12.2.1.2.2. By Component
12.2.1.2.3. By Application
12.2.1.2.4. By End User
12.2.2. India 3D IC Market Outlook
12.2.2.1. Market Size & Forecast
12.2.2.1.1. By Value
12.2.2.2. Market Share & Forecast
12.2.2.2.1. By Type
12.2.2.2.2. By Component
12.2.2.2.3. By Application
12.2.2.2.4. By End User
12.2.3. Japan 3D IC Market Outlook
12.2.3.1. Market Size & Forecast
12.2.3.1.1. By Value
12.2.3.2. Market Share & Forecast
12.2.3.2.1. By Type
12.2.3.2.2. By Component
12.2.3.2.3. By Application
12.2.3.2.4. By End User
12.2.4. South Korea 3D IC Market Outlook
12.2.4.1. Market Size & Forecast
12.2.4.1.1. By Value
12.2.4.2. Market Share & Forecast
12.2.4.2.1. By Type
12.2.4.2.2. By Component
12.2.4.2.3. By Application
12.2.4.2.4. By End User
12.2.5. Australia 3D IC Market Outlook
12.2.5.1. Market Size & Forecast
12.2.5.1.1. By Value
12.2.5.2. Market Share & Forecast
12.2.5.2.1. By Type
12.2.5.2.2. By Component
12.2.5.2.3. By Application
12.2.5.2.4. By End User
12.2.6. Indonesia 3D IC Market Outlook
12.2.6.1. Market Size & Forecast
12.2.6.1.1. By Value
12.2.6.2. Market Share & Forecast
12.2.6.2.1. By Type
12.2.6.2.2. By Component
12.2.6.2.3. By Application
12.2.6.2.4. By End User
12.2.7. Vietnam 3D IC Market Outlook
12.2.7.1. Market Size & Forecast
12.2.7.1.1. By Value
12.2.7.2. Market Share & Forecast
12.2.7.2.1. By Type
12.2.7.2.2. By Component
12.2.7.2.3. By Application
12.2.7.2.4. By End User
13. Market Dynamics
13.1. Drivers
13.2. Challenges
14. Market Trends and Developments
15. Company Profiles
15.1. Taiwan Semiconductor Manufacturing Company Limited (TSMC)
15.1.1. Business Overview
15.1.2. Key Revenue and Financials
15.1.3. Recent Developments
15.1.4. Key Personnel/Key Contact Person
15.1.5. Key Product/Services Offered
15.2. Samsung Electronics Co., Ltd.
15.2.1. Business Overview
15.2.2. Key Revenue and Financials
15.2.3. Recent Developments
15.2.4. Key Personnel/Key Contact Person
15.2.5. Key Product/Services Offered
15.3. Intel Corporation
15.3.1. Business Overview
15.3.2. Key Revenue and Financials
15.3.3. Recent Developments
15.3.4. Key Personnel/Key Contact Person
15.3.5. Key Product/Services Offered
15.4. Advanced Micro Devices, Inc. (AMD)
15.4.1. Business Overview
15.4.2. Key Revenue and Financials
15.4.3. Recent Developments
15.4.4. Key Personnel/Key Contact Person
15.4.5. Key Product/Services Offered
15.5. Xilinx, Inc.
15.5.1. Business Overview
15.5.2. Key Revenue and Financials
15.5.3. Recent Developments
15.5.4. Key Personnel/Key Contact Person
15.5.5. Key Product/Services Offered
15.6. United Microelectronics Corporation (UMC)
15.6.1. Business Overview
15.6.2. Key Revenue and Financials
15.6.3. Recent Developments
15.6.4. Key Personnel/Key Contact Person
15.6.5. Key Product/Services Offered
15.7. GlobalFoundries Inc.
15.7.1. Business Overview
15.7.2. Key Revenue and Financials
15.7.3. Recent Developments
15.7.4. Key Personnel/Key Contact Person
15.7.5. Key Product/Services Offered
15.8. ASE Group
15.8.1. Business Overview
15.8.2. Key Revenue and Financials
15.8.3. Recent Developments
15.8.4. Key Personnel/Key Contact Person
15.8.5. Key Product/Services Offered
15.9. Amkor Technology, Inc.
15.9.1. Business Overview
15.9.2. Key Revenue and Financials
15.9.3. Recent Developments
15.9.4. Key Personnel/Key Contact Person
15.9.5. Key Product/Services Offered
15.10. Siliconware Precision Industries Co., Ltd. (SPIL)
15.10.1. Business Overview
15.10.2. Key Revenue and Financials
15.10.3. Recent Developments
15.10.4. Key Personnel/Key Contact Person
15.10.5. Key Product/Services Offered
15.11. Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET)
15.11.1. Business Overview
15.11.2. Key Revenue and Financials
15.11.3. Recent Developments
15.11.4. Key Personnel/Key Contact Person
15.11.5. Key Product/Services Offered
15.12. Powertech Technology Inc.
15.12.1. Business Overview
15.12.2. Key Revenue and Financials
15.12.3. Recent Developments
15.12.4. Key Personnel/Key Contact Person
15.12.5. Key Product/Services Offered
15.13. STATS ChipPAC Pte. Ltd.
15.13.1. Business Overview
15.13.2. Key Revenue and Financials
15.13.3. Recent Developments
15.13.4. Key Personnel/Key Contact Person
15.13.5. Key Product/Services Offered
16. Strategic Recommendations
17. About Us & Disclaimer