Table of Content




1. Executive Summary


2. Global 3D IC and 2.5D IC Packaging Market: Market Dynamics
2.1: Introduction, Background, and Classifications
2.2: Supply Chain
2.3: Industry Drivers and Challenges


3. Market Trends and Forecast Analysis from 2017 to 2028
3.1: Macroeconomic Trends (2017-2022) and Forecast (2023-2028)
3.2: Global 3D IC and 2.5D IC Packaging Market Trends (2017-2022) and Forecast (2023-2028)
3.3: Global 3D IC and 2.5D IC Packaging Market by Packaging Technology
3.3.1: 3D Wafer-Level Chip-Scale Packaging (WLCSP)
3.3.2: 3D Through-Silicon Via (TSV)
3.3.3: 2.5D
3.4: Global 3D IC and 2.5D IC Packaging Market by Application
3.4.1: Logic
3.4.2: Imaging & Optoelectronics
3.4.3: Memory
3.4.4: MEMS/Sensors
3.4.5: LED
3.4.6: Others
3.5: Global 3D IC and 2.5D IC Packaging Market by End Use Industry
3.5.1: Consumer Electronics
3.5.2: Industrial
3.5.3: Telecommunications
3.5.4: Automotive
3.5.5: Military & Aerospace
3.5.6: Medical Devices
3.5.7: Others


4. Market Trends and Forecast Analysis by Region from 2017 to 2028
4.1: Global 3D IC and 2.5D IC Packaging Market by Region
4.2: North American 3D IC and 2.5D IC Packaging Market
4.2.1: North American 3D IC and 2.5D IC Packaging Market by Application: Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, and Others
4.2.2: North American 3D IC and 2.5D IC Packaging Market by End Use Industry: Consumer Electronics, Industrial, Telecommunications, Automotive, Military & Aerospace, Medical Devices, and Others
4.3: European 3D IC and 2.5D IC Packaging Market
4.3.1: European 3D IC and 2.5D IC Packaging Market by Application: Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, and Others
4.3.2: European 3D IC and 2.5D IC Packaging Market by End Use Industry: Consumer Electronics, Industrial, Telecommunications, Automotive, Military & Aerospace, Medical Devices, and Others
4.4: APAC 3D IC and 2.5D IC Packaging Market
4.4.1: APAC 3D IC and 2.5D IC Packaging Market by Application: Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, and Others
4.4.2: APAC 3D IC and 2.5D IC Packaging Market by End Use Industry: Consumer Electronics, Industrial, Telecommunications, Automotive, Military & Aerospace, Medical Devices, and Others
4.5: ROW 3D IC and 2.5D IC Packaging Market
4.5.1: ROW 3D IC and 2.5D IC Packaging Market by Application: Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, and Others
4.5.2: ROW 3D IC and 2.5D IC Packaging Market by End Use Industry: Consumer Electronics, Industrial, Telecommunications, Automotive, Military & Aerospace, Medical Devices, and Others


5. Competitor Analysis
5.1: Product Portfolio Analysis
5.2: Operational Integration
5.3: Porter’s Five Forces Analysis


6. Growth Opportunities and Strategic Analysis
6.1: Growth Opportunity Analysis
6.1.1: Growth Opportunities for the Global 3D IC and 2.5D IC Packaging Market by Packaging Technology
6.1.2: Growth Opportunities for the Global 3D IC and 2.5D IC Packaging Market by Application
6.1.3: Growth Opportunities for the Global 3D IC and 2.5D IC Packaging Market by End Use Industry
6.1.4: Growth Opportunities for the Global 3D IC and 2.5D IC Packaging Market by Region
6.2: Emerging Trends in the Global 3D IC and 2.5D IC Packaging Market
6.3: Strategic Analysis
6.3.1: New Product Development
6.3.2: Capacity Expansion of the Global 3D IC and 2.5D IC Packaging Market
6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global 3D IC and 2.5D IC Packaging Market
6.3.4: Certification and Licensing


7. Company Profiles of Leading Players
7.1: Taiwan Semiconductor Manufacturing
7.2: Samsung Electronics
7.3: Toshiba
7.4: Advanced Semiconductor Engineering
7.5: Amkor Technology