Table of Content

1 Introduction 8
1.1 Industry Definition and Research Scope 8
1.1.1 Industry Definition 8
1.1.2 Research Scope 9
1.2 Research Methodology 12
1.2.1 Overview of Market Research Methodology 12
1.2.2 Market Assumption 13
1.2.3 Secondary Data 13
1.2.4 Primary Data 13
1.2.5 Data Filtration and Model Design 14
1.2.6 Market Size/Share Estimation 15
1.2.7 Research Limitations 16
1.3 Executive Summary 17

2 Market Overview and Dynamics 20
2.1 Market Size and Forecast 20
2.1.1 Impact of COVID-19 on World Economy 22
2.1.2 Impact of COVID-19 on the Market 25
2.1.3 Impact of Russia-Ukraine Conflict: War Slows Economic Recovery 27
2.2 Major Growth Drivers 31
2.3 Market Restraints and Challenges 36
2.4 Emerging Opportunities and Market Trends 39
2.5 Porter’s Fiver Forces Analysis 43

3 Segmentation of Asia Pacific Market by Packaging Type 47
3.1 Market Overview by Packaging Type 47
3.2 FC BGA 49
3.3 FC CSP 50
3.4 Other Packaging Types 51

4 Segmentation of Asia Pacific Market by Material Type 52
4.1 Market Overview by Material Type 52
4.2 Rigid Integrated Circuit Substrate 54
4.3 Flex Integrated Circuit Substrate 55
4.4 Ceramic Integrated Circuit Substrate 56

5 Segmentation of Asia Pacific Market by Manufacturing Method 57
5.1 Market Overview by Manufacturing Method 57
5.2 Subtraction Process (SP) 59
5.3 Addition Process (AP) 60
5.4 Modified Semi-additive Process (MSAP) 61

6 Segmentation of Asia Pacific Market by Bonding Technology 62
6.1 Market Overview by Bonding Technology 62
6.2 Wire Bonding 64
6.3 FC Bonding 66
6.4 Tape Automated Bonding (TAB) 68

7 Segmentation of Asia Pacific Market by Application 69
7.1 Market Overview by Application 69
7.2 Mobile and Consumer Electronics 71
7.3 Automotive and Transportation 72
7.4 IT and Telecom 73
7.5 Other Applications 74

8 Asia-Pacific Market 2021-2031 by Country/Region 75
8.1 Overview of Asia-Pacific Market 75
8.2 Japan 78
8.3 China 81
8.4 Australia 83
8.5 Taiwan 85
8.6 South Korea 87
8.7 Rest of APAC Region 89

9 Competitive Landscape 91
9.1 Overview of Key Vendors 91
9.2 New Product Launch, Partnership, Investment, and M&A 94
9.3 Company Profiles 95
ASE Group 95
AT&S Austria Technologie & Systemtechnik AG 97
Fujitsu Ltd. 100
IBIDEN Co., Ltd. 104
Kinsus Interconnect Technology Corp. 106
Korea Circuit Co., Ltd. 108
KYOCERA Corporation 109
LG Innotek Co., Ltd. 112
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation) 113
Shenzhen Fastprint Circuit Tech 114
Shinko Electric Industries Co., Ltd. 115
Siliconware Precision Industries Co., Ltd. 118
STATS ChipPAC Pte. Ltd. (JCET GROUP CO. LTD) 120
TTM Technologies Inc. 123
Unimicron Corporation 126
Zhen Ding Technology Holding Ltd. 129
Zhuhai ACCESS Semiconductor 130
RELATED REPORTS 131



List of Figures

List of Figures:

Figure 1. Research Method Flow Chart 12
Figure 2. Bottom-up Approach and Top-down Approach for Market Estimation 15
Figure 3. Asia Pacific Market Forecast in Optimistic, Conservative and Balanced Perspectives, 2022-2031 17
Figure 4. Industry Value Chain Analysis 20
Figure 5. Asia Pacific Advanced IC Substrates Market, 2021-2031, $ mn 21
Figure 6. Impact of COVID-19 on Business 25
Figure 7. Primary Drivers and Impact Factors of Asia Pacific Advanced IC Substrates Market 31
Figure 8. World 5G Devices Market by Value, 2019-2030, $ bn 35
Figure 9. World Autonomous Vehicle Market, 2019-2030, $ mn 35
Figure 10. Primary Restraints and Impact Factors of Asia Pacific Advanced IC Substrates Market 36
Figure 11. Investment Opportunity Analysis 40
Figure 12. Porter’s Fiver Forces Analysis of Asia Pacific Advanced IC Substrates Market 43
Figure 13. Breakdown of Asia Pacific Advanced IC Substrates Market by Packaging Type, 2021-2031, % of Revenue 48
Figure 14. Asia Pacific Addressable Market Cap in 2023-2031 by Packaging Type, Value ($ mn) and Share (%) 48
Figure 15. Asia Pacific Advanced IC Substrates Market by Packaging Type: FC BGA, 2021-2031, $ mn 49
Figure 16. Asia Pacific Advanced IC Substrates Market by Packaging Type: FC CSP, 2021-2031, $ mn 50
Figure 17. Asia Pacific Advanced IC Substrates Market by Packaging Type: Other Packaging Types, 2021-2031, $ mn 51
Figure 18. Breakdown of Asia Pacific Advanced IC Substrates Market by Material Type, 2021-2031, % of Sales Revenue 53
Figure 19. Asia Pacific Addressable Market Cap in 2023-2031 by Material Type, Value ($ mn) and Share (%) 53
Figure 20. Asia Pacific Advanced IC Substrates Market by Material Type: Rigid Integrated Circuit Substrate, 2021-2031, $ mn 54
Figure 21. Asia Pacific Advanced IC Substrates Market by Material Type: Flex Integrated Circuit Substrate, 2021-2031, $ mn 55
Figure 22. Asia Pacific Advanced IC Substrates Market by Material Type: Ceramic Integrated Circuit Substrate, 2021-2031, $ mn 56
Figure 23. Breakdown of Asia Pacific Advanced IC Substrates Market by Manufacturing Method, 2021-2031, % of Sales Revenue 58
Figure 24. Asia Pacific Addressable Market Cap in 2023-2031 by Manufacturing Method, Value ($ mn) and Share (%) 58
Figure 25. Asia Pacific Advanced IC Substrates Market by Manufacturing Method: Subtraction Process (SP), 2021-2031, $ mn 59
Figure 26. Asia Pacific Advanced IC Substrates Market by Manufacturing Method: Addition Process (AP), 2021-2031, $ mn 60
Figure 27. Asia Pacific Advanced IC Substrates Market by Manufacturing Method: Modified Semi-additive Process (MSAP), 2021-2031, $ mn 61
Figure 28. Breakdown of Asia Pacific Advanced IC Substrates Market by Bonding Technology, 2021-2031, % of Revenue 63
Figure 29. Asia Pacific Addressable Market Cap in 2023-2031 by Bonding Technology, Value ($ mn) and Share (%) 63
Figure 30. Asia Pacific Advanced IC Substrates Market by Bonding Technology: Wire Bonding, 2021-2031, $ mn 64
Figure 31. Picture of Wire Bonding Illustrated in a DIP Package 65
Figure 32. Asia Pacific Advanced IC Substrates Market by Bonding Technology: FC Bonding, 2021-2031, $ mn 66
Figure 33. Picture of a Flipped Chip (IC) on a Passive Substrate 67
Figure 34. Asia Pacific Advanced IC Substrates Market by Bonding Technology: Tape Automated Bonding (TAB), 2021-2031, $ mn 68
Figure 35. Breakdown of Asia Pacific Advanced IC Substrates Market by Application, 2021-2031, % of Revenue 70
Figure 36. Asia Pacific Addressable Market Cap in 2023-2031 by Application, Value ($ mn) and Share (%) 70
Figure 37. Asia Pacific Advanced IC Substrates Market by Application: Mobile and Consumer Electronics, 2021-2031, $ mn 71
Figure 38. Asia Pacific Advanced IC Substrates Market by Application: Automotive and Transportation, 2021-2031, $ mn 72
Figure 39. Asia Pacific Advanced IC Substrates Market by Application: IT and Telecom, 2021-2031, $ mn 73
Figure 40. Asia Pacific Advanced IC Substrates Market by Application: Other Applications, 2021-2031, $ mn 74
Figure 41. Breakdown of APAC Advanced IC Substrates Market by Country/Region, 2022 and 2031, % of Revenue 76
Figure 42. Contribution to APAC 2023-2031 Cumulative Market by Country/Region, Value ($ mn) and Share (%) 77
Figure 43. Advanced IC Substrates Market in Japan, 2021-2031, $ mn 79
Figure 44. Advanced IC Substrates Market in China, 2021-2031, $ mn 81
Figure 45. Advanced IC Substrates Market in Australia, 2021-2031, $ mn 83
Figure 46. Advanced IC Substrates Market in Taiwan, 2021-2031, $ mn 85
Figure 47. Advanced IC Substrates Market in South Korea, 2021-2031, $ mn 87
Figure 48. Advanced IC Substrates Market in Rest of APAC, 2021-2031, $ mn 89
Figure 49. Growth Stage of Asia Pacific Advanced IC Substrates Industry over the Forecast Period 91

List of Tables

List of Tables:

Table 1. Snapshot of Asia Pacific Advanced IC Substrates Market in Balanced Perspective, 2021-2031 18
Table 2. World Economic Outlook, 2021-2031 23
Table 3. World Economic Outlook, 2021-2023 24
Table 4. Scenarios for Economic Impact of Ukraine Crisis 28
Table 5. World Semiconductor Market, 2021-2031, $ bn 34
Table 6. Main Product Trends and Market Opportunities in Asia Pacific Advanced IC Substrates Market 39
Table 7. Asia Pacific Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 47
Table 8. Asia Pacific Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 52
Table 9. Asia Pacific Advanced IC Substrates Market by Manufacturing Method, 2021-2031, $ mn 57
Table 10. Asia Pacific Advanced IC Substrates Market by Bonding Technology, 2021-2031, $ mn 62
Table 11. Asia Pacific Advanced IC Substrates Market by Application, 2021-2031, $ mn 69
Table 12. APAC Advanced IC Substrates Market by Country/Region, 2021-2031, $ mn 76
Table 13. Japan Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 80
Table 14. Japan Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 80
Table 15. Japan Advanced IC Substrates Market by Application, 2021-2031, $ mn 80
Table 16. China Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 82
Table 17. China Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 82
Table 18. China Advanced IC Substrates Market by Application, 2021-2031, $ mn 82
Table 19. Australia Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 84
Table 20. Australia Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 84
Table 21. Australia Advanced IC Substrates Market by Application, 2021-2031, $ mn 84
Table 22. Taiwan Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 86
Table 23. Taiwan Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 86
Table 24. Taiwan Advanced IC Substrates Market by Application, 2021-2031, $ mn 86
Table 25. South Korea Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 88
Table 26. South Korea Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 88
Table 27. South Korea Advanced IC Substrates Market by Application, 2021-2031, $ mn 88
Table 28. Advanced IC Substrates Market in Rest of APAC by Country/Region, 2021-2031, $ mn 90
Table 29. ASE Group: Company Snapshot 95
Table 30. ASE Group: Business Segmentation 96
Table 31. ASE Group: Product Portfolio 96
Table 32. AT&S Austria Technologie & Systemtechnik AG: Company Snapshot 97
Table 33. AT&S Austria Technologie & Systemtechnik AG: Breakdown of Revenue by Business Segment 98
Table 34. Fujitsu Limited: Company Snapshot 100
Table 35. Fujitsu Limited: Business Segmentation and Share 101
Table 36. Fujitsu Limited: Revenue Distribution by Region in 2021 102
Table 37. IBIDEN Co., Ltd.: Company Snapshot 104
Table 38. IBIDEN Co., Ltd.: Breakdown of Revenue by Business Segment 105
Table 39. Kinsus Interconnect Technology Corp..: Company Snapshot 106
Table 40. Kinsus Interconnect Technology Corp.: Breakdown of Revenue by Business Segment 107
Table 41. Korea Circuit Co., Ltd.: Company Snapshot 108
Table 42. KYOCERA Corporation: Company Snapshot 109
Table 43. KYOCERA Corporation: Breakdown of Revenue by Business Segment 110
Table 44. LG Innotek Co., Ltd.: Company Snapshot 112
Table 45. Nan Ya PCB Co., Ltd.: Company Snapshot 113
Table 46. Shenzhen Fastprint Circuit Tech: Company Snapshot 114
Table 47. Shinko Electric Industries Co., Ltd.: Company Snapshot 115
Table 48. Shinko Electric Industries Co., Ltd.: Breakdown of Revenue by Business Segment 116
Table 49. Siliconware Precision Industries Co., Ltd.: Company Snapshot 118
Table 50. Siliconware Precision Industries Co., Ltd.: Breakdown of Revenue by Business Segment 119
Table 51. STATS ChipPAC Pte. Ltd.: Company Snapshot 120
Table 52. STATS ChipPAC Pte. Ltd.: Breakdown of Revenue by Business Segment 121
Table 53. TTM Technologies Inc.: Company Snapshot 123
Table 54. TTM Technologies Inc.: Breakdown of Revenue by Business Segment 124
Table 55. Unimicron Corporation: Company Snapshot 126
Table 56. Unimicron Corporation: Breakdown of Revenue by Business Segment 127
Table 57. Zhen Ding Technology Holding Ltd.: Company Snapshot 129
Table 58. Zhuhai ACCESS Semiconductor: Company Snapshot 130