Table of Content

1 Overview of Automotive Power Management Integrated Circuits (PMIC)
1.1 Overview of Analog Chips
1.1.1 Analog Chips: Power Management Integrated Circuits (PMIC) and Signal Chain Integrated Circuits
1.1.2 Competitive Landscape of Global Analog Chip Market
1.1.3 Global Analog Chip Market Size
1.1.4 Competitive Landscape of Chinese Analog Chip Market: Emerging Localization
1.1.5 China’s Analog Chip Market Size
1.1.6 Main Factors for the Accelerated Development of Simulation Chips Made in China
1.1.7 Revenue Structure of Chinese Analog Chip Vendors and Comparison between Them
1.1.8 Application of Analog Chips in Automotive Electronics
1.2 Automotive PMIC
1.2.1 What Is Power Management?
1.2.2 Classification of PMICs
1.2.3 Global PMIC Competitive Landscape
1.2.4 Evolution of PMIC Localization in China
1.2.5 Some PMIC Vendors in China
1.2.6 Application of PMICs in Automotive Electronics
1.2.7 Automotive PMICs Require High Performance
1.2.8 Mass Production and Installation of Automotive PMICs
1.2.9 Chinese PMIC Companies Enter the Vehicle Supply Chain Quickly
1.2.10 Chinese PMIC Companies Launch Products Intensively
1.2.11 Automotive Business Layout of Chinese PMIC Companies
1.3 China’s Policies and Certification Standards for Automotive Chips
1.3.1 Status Quo and Orientation of Automotive Chip Standardization Policies in China
1.3.2 Interpretation of Automotive Chip Requirements
1.3.3 China’s Certification standards for Automotive PMICs
1.3.4 Functional Safety Standard for Automotive PMICs - ISO 26262
1.3.5 Certification Test Standard for Automotive PMICs - AEC-Q100
1.3.6 Production Testing of Automotive PMICs
1.4 Application of PMICs in Vehicles
1.4.1 Application of PMICs in Automotive Electronics
1.4.2 Automotive PMIC Application Scenario 1: Intelligent Cockpits
1.4.3 Application Solutions of PMIC Vendors for Intelligent Cockpits
1.4.4 Intelligent Cockpit PMIC Application Solutions: ETA Semiconductor Helps Tesla’s Automotive Wireless Microphone
1.4.5 Automotive PMIC Application Scenario 2: Motor Controllers
1.4.6 Motor Controller PMIC Application Solutions (1)
1.4.7 Motor Controller PMIC Application Solutions (2)
1.4.8 Automotive PMIC Application Scenario 3: On-board Chargers
1.4.9 Automotive PMIC Application Scenario 4: Domain Controllers
1.4.10 Application Solutions of PMIC Vendors for Domain Controllers
1.4.11 PMIC Solutions for Autonomous Driving Domains (1)
1.4.12 PMIC Solutions for Autonomous Driving Domains (2)
1.4.13 PMIC Solutions for Autonomous Driving Domains (3)
1.4.14 PMIC Solutions for Autonomous Driving Domains (4)
1.4.15 Automotive PMIC Application Scenario 4: Tail Lights and Ambient Lights
1.4.16 Application Solutions of PMIC Vendors for Automotive Electronic Lighting
1.4.17 Automotive Lighting PMIC Solutions: Microchip’s Automotive LED Lighting Solutions
1.4.18 Automotive PMIC Application Scenario 5: On-board Chargers
1.4.19 Development History of On-board Wired Charging
1.4.20 Development History of On-board Wireless Charging
1.4.21 Application Solutions of PMIC Vendors for On-board Charging
1.4.22 PMIC Application Solutions for On-board Wired Charging


2 Manufacturing Processes of Automotive PMICs
2.1 Production and Operation Models of Automotive PMIC Industry
2.1.1 Development History of Production Models in the Semiconductor Industry
2.1.2 Production and Operation Models of PMICs
2.1.3 IDM of PMICs Made in China
2.1.4 Streamlining of IDM Vendors toward Fab-lite Models
2.1.5 IDM Vendors Change to Fab-lite Strategies (1)
2.1.6 IDM Vendors Change to Fab-lite Strategies (2)
2.1.7 Fabless Vendors Change to Fab-lite Models
2.1.8 Fabless Vendors Deploy Fabless-lite
2.1.9 Virtual IDM Model: Proprietary Technology and Process Platforms
2.1.10 Comparison between IDM, Fabless and Virtual IDM Models
2.1.11 Development Path of Business Models of Chinese PMIC Vendors
2.2 Manufacturing of Automotive PMICs
2.2.1 Manufacturing of Automotive PMICs: Chip Design, Wafer Foundry, Packaging & Testing
2.2.2 IC Design of Automotive PMICs
2.2.2.1 Development of China’s Automotive PMIC Design Industry
2.2.2.2 Development of China’s PMIC Design Industry: Most Chinese Companies Are in the Stage of Small Batch Supply and R&D
2.2.2.3 Comparison between Foreign Automotive PMIC Vendors (1)
2.2.2.4 Comparison between Foreign Automotive PMIC Vendors (2)
2.2.2.5 Comparison between Chinese Automotive PMIC Vendors (1)
2.2.2.6 Comparison between Chinese Automotive PMIC Vendors (2)
2.2.2.7 Supply System of Automotive PMICs: The Bargaining Power of Upstream Chip Vendors Becomes Stronger
2.2.2.8 Reconstruction of China’s Automotive PMIC Industry Chain: from "Led by Automakers" to "Led by Companies That Master Core Technologies and Key Links"
2.2.3 Wafer Foundry of Automotive PMICs
2.2.3.1 Eight Manufacturing Processes of Automotive PMICs
2.2.3.2 Evolution of Analog Chip Process Platforms
2.2.3.3 Mainstream Manufacturing Processes of Automotive PMICs: BCD Process
2.2.3.4 Development Direction of BCD Process: High Voltage, High Power and High Density
2.2.3.5 Isolation Technology of BCD Process
2.2.3.6 Status Quo of Global BCD Process Platforms (1): BCD Process Evolution Diagram of Wafer Fabs
2.2.3.7 Status Quo of Global BCD Process Platforms (2): TSMC and UMC Rank among the First Echelon of BCD Process in the Field of Wafer Foundry
2.2.3.8 Status Quo of Global BCD Process Platforms (3): The BCD Process Platforms of Chinese Wafer Fabs Break through 55nm
2.2.3.9 BCD Process Platform Development of Chinese Wafer Fabs
2.2.3.10 Automotive PMIC Process Node: The 0.18-0.11?m Mature Process of 8-inch Production Lines is the Mainstream
2.2.3.11 Wafer Foundry of Automotive PMICs: 12-inch Production Lines Represent the Future Trend
2.2.3.12 Layout of 12-inch Production Lines of PMIC Vendors and Fabs
2.2.3.13 Gross Margin and Net Margin of major Wafer Fabs
2.2.4 Packaging and Testing of Automotive PMICs
2.2.4.1 Chip Packaging & Testing Process Flow
2.2.4.2 Packaging Types of PMICs: Mainly BGA, QFP, SO and DIP
2.2.4.3 Layout of Chinese PMIC Companies in the Field of Packaging and Testing: Fabless + Testing/Packaging


3 Automotive PMICs (by Type)
3.1 Classification and Functions of PMICs
3.2 PMIC Market Size (by Type)
3.3 AC/DC Chips
3.3.1 AC/DC Chips: Structure and Working Principle
3.3.2 AC/DC Chips: Classification by Isolation or Not
3.3.3 Competitive Landscape of Automotive AC/DC Chips
3.3.4 Application of AC/DC Chips in Automotive Electronics: Charging Piles
3.3.5 AC/DC Chips: AC Slow Charging
3.3.6 AC/DC Chips: DC Fast Charging
3.3.7 Charging Piles for New Energy Vehicles
3.3.8 Downstream Customer Base of AC/DC Converters for New Energy Vehicles
3.4 DC/DC Chips
3.4.1 DC/DC Converters
3.4.2 Application of DC/DC Converters in Electric Vehicles
3.4.3 Classification of DC/DC Converter Chips
3.4.4 Main Supporting Modes of DC/DC converters for New Energy Vehicles
3.4.5 Downstream Customer Base of Automotive DC/DC Chips (1)
3.4.6 Downstream Customer Base of Automotive DC/DC Chips (2)
3.4.7 Key Performance Indicators of DC/DC Chips
3.4.8 How to Select DC/DC Chips?
3.4.9 DC/DC Chips: Mainstream Buck, Boost and Buck-Boost Switching Regulators
3.4.10 Layout of Chinese Automotive Power Management DC/DC Chip Vendors (1)
3.4.11 Layout of Chinese Automotive Power Management DC/DC Chip Vendors (2)
3.4.12 DC/DC Chips: LDO Linear Regulators
3.4.13 Options of Automotive LDO Linear Regulators
3.4.14 Layout of Chinese Automotive LDO Linear Regulator Chip Vendors
3.5 Battery Monitoring Integrated Circuit (BMIC)
3.5.1 Battery Management System (BMS)
3.5.2 Working Principle of Automotive BMS
3.5.3 Comparison between BMS Solutions for New Energy Vehicles
3.5.4 BMS Architectures: BMS Architectures Develop toward Domain Controllers
3.5.5 Battery Monitoring Integrated Circuit (BMIC): Chip Composition Structure
3.5.6 Battery Monitoring Integrated Circuit (BMIC)
3.5.7 Wired BMS Chip Solutions (1): Tesla’s BMS Design
3.5.8 Wired BMS Chip Solutions (2): Tesla’s BMS Design
3.5.9 Wired BMS Chip Solutions (3): Tesla’s BMS Design
3.5.10 Wired BMS Chip Solutions (4): Summary
3.5.11 Wireless BMS Chip Solutions (1): GM’s wBMS
3.5.12 Wireless BMS Chip Solutions (2): GM’s wBMS
3.5.13 Wireless BMS Chip Solutions (3): LG Innotek Plans to Start Mass Production of the Wireless BMS in 2024
3.5.14 BMS IC Solutions (1): PI 12V Emergency Power Supply Solution
3.5.15 BMS IC Solutions (2)
3.5.16 BMS IC Solutions (3)
3.5.17 Application of SBC in BMS: Main Functional Components of SBC
3.5.18 Application of SBC in BMS: Application Advantages of SBC
3.5.19 Cases Reflecting Application Defects of SBC in BMS
3.5.20 AFE Chip in BMIC: Working Principle
3.5.21 AFE Chip in BMIC: Mainstream Automakers deploy 800V Platforms to Drive the Demand for AFE Chips to Grow
3.5.22 AFE Chip in BMIC: Global Market Size and ASP Estimation
3.5.23 AFE Chip in BMIC: Major Foreign Suppliers and Product Options (1)
3.5.24 AFE Chip in BMIC: Major Foreign Suppliers and Product Options (2)
3.5.25 AFE Chip in BMIC: Typical Foreign Automotive AFE Chips (1)
3.5.26 AFE Chip in BMIC: Typical Foreign Automotive AFE Chips (2)
3.5.27 Automotive BMIC Development in China: Preliminary Layout
3.5.28 Automotive BMIC Development in China: Deployment and Mass Production Cases of Chinese Automotive BMIC Vendors (1)
3.5.29 Automotive BMIC Development in China: Deployment and mass production Cases of Chinese Automotive BMIC Vendors (2)
3.5.30 China’s AFE Chip Solutions: Datang NXP Semiconductors (DNS) Introduced an Automotive Single-cell Monitoring Chip to Electric Vehicles
3.5.31 Chinese AFE Chip Solutions (1)
3.5.32 Chinese AFE Chip Solutions (2)
3.5.33 Automotive BMIC Development in China: Development Bottlenecks for Chinese Automotive BMIC
3.5.34 Downstream Customers of BMIC in China: TOP10 Companies in China by BMS Installed Capacity
3.6 Driver Chips
3.6.1 Driver Chips: Classification by Application Field
3.6.2 Working Principle of Motor Drive Chips
3.6.3 Motor Drive of Driver Chips: Types and application of DC Motors in Vehicles
3.6.4 Main Application Scenarios of DC Motors (1): Intelligent Chassis
3.6.5 Main Application Scenarios of DC Motors (2): Body Control
3.6.6 Evolution of Motor Drive Modes: Relay Drive ? Chip Drive
3.6.7 Automotive Motor Driver Chips: Strong Customer Stickiness
3.6.8 Major Downstream Customers of Automotive Motor Driver Chips (1)
3.6.9 Major Downstream Customers of Automotive Motor Driver Chips (2)
3.6.10 Automotive Motor Driver Chips: Major Foreign Suppliers and Product Options
3.6.11 Automotive Motor Driver Chips: Domestic development and Major suppliers
3.6.12 Motor Driver Chip Solutions (1)
3.6.13 Motor Driver Chip Solutions (2)


4 key Problems of Automotive PMICs
4.1 Chip Shortage
4.1.1 Factors Affecting the Shortage and Price Hike of Automotive PMICs: Squeezed Capacity, Increased Demand
4.1.2 Impact of Chip Shortage on the Automotive Industry: Reduced Output, Price Hike, Extended Delivery Cycle
4.1.3 Capacity Utilization Rate amid Chip Shortage
4.1.4 Capacity Utilization rate of Major Wafer Fabs
4.1.5 Production Expansion amid Chip Shortage: The New Capacity Will Be Gradually Released in 2024
4.1.6 Production Line Expansion and Construction of Wafer Fabs (1)
4.1.7 Production Line Expansion and Construction of Wafer Fabs (2)
4.1.8 Production Line Expansion and Construction of Wafer Fabs (3)
4.1.9 Capacity Forecast: Global Wafer Capacity and Growth Rate, 2021-2025E
4.1.10 Factors Limiting Capacity Expansion of Wafer Fabs: Silicon Wafers and Equipment
4.1.11 PMIC Shortage: Chinese Vendors Accelerate Localization
4.1.12 Future Supply of Automotive PMICs
4.2 Development Direction of Automotive PMIC Technology
4.2.1 Technology 1: High- and Low-voltage IC Technology
4.2.2 Technology 2: Ultra-low Current Burst Mode Technology
4.2.3 Technology 3: High-brightness LED Technology
4.2.4 Technology 4: Low EMI (Electromagnetic Interference)
4.2.5 Ways to Reduce EMI: A filter May Reduce the Switching Slew Rate
4.2.6 Low EMI Solutions: TI’s Low EMI Innovative Solution


5 Foreign Suppliers of Automotive PMICs
5.1 Texas Instruments
5.1.1 Profile
5.1.2 PMIC Layout
5.1.3 Automotive BMIC Layout
5.1.4 Capacity Expansion: Faster Deployment in the Field of Automotive Electronics
5.1.5 New Technical Breakthrough of Power Management Products in the Field of Low Static Power Consumption (1)
5.1.6 New Technical Breakthrough of Power Management Products in the Field of Low Static Power Consumption (2)
5.2 Infineon
5.2.1 Profile
5.2.2 Presence of Plants Worldwide
5.2.3 Distribution of Downstream Customers
5.2.4 BMS Solution: Highly Integrated System Solutions
5.2.5 Some New Automotive PMICs
5.3 ADI
5.3.1 Profile
5.3.2 Automotive PMIC Layout
5.3.3 Automotive PMIC Application Solutions
5.4 MPS
5.4.1 Profile
5.4.2 BCD Plus and Mesh Connect
5.4.3 Development History
5.4.4 Automotive PMIC Portfolio
5.4.5 Application Layout of Automotive PMICs
5.4.6 Integration of PMICs
5.5 STMicroelectronics
5.5.1 Profile
5.5.2 Business Layout
5.5.3 Core R&D Technology
5.5.4 BCD Process Flow Chart
5.5.5 Automotive PMIC Products
5.5.6 Roadmap of Automotive Linear Regulators
5.6 Onsemi
5.6.1 Profile
5.6.2 Capacity Expansion: Taking the Layout of SiC Devices in the Electric Drive Field as an Example
5.6.3 Layout in the Field of Automotive Electronics
5.6.4 Power Packaging Technology of Main Drive Modules
5.6.5 Some New Automotive PMICs
5.7 Renesas
5.7.1 Profile
5.7.2 Product Layout in the Field of Automotive Electronics
5.7.3 Electric Automotive BMS Layout
5.7.4 ASIL B Compliant Automotive Camera Solutions


6 Chinese Automotive PMIC Suppliers
6.1 Joulwatt
6.1.1 Profile
6.1.2 Development History of Products
6.1.3 Virtual IDM Operation Model
6.1.4 Three Process Platforms
6.1.5 Iteration of 7-55V BCD Process Platform
6.1.6 Iteration of 10-200V BCD Process Platform
6.1.7 Iteration of 10-700V BCD Process Platform
6.1.8 Revenue Contribution of Process Platforms, 2019-2021
6.1.9 PMIC Layout
6.1.10 Automotive PMIC Application Layout
6.1.11 Development Process of Automotive Chips
6.1.12 Certified Automotive Products
6.1.13 Automotive DC/DC Chip: JWQ5103
6.1.14 Average Selling Prices of Main Products
6.1.15 Main Application Technologies in the Field of Automotive Electronics
6.2 Halo Microelectronics
6.2.1 Profile
6.2.2 Supply Chain Model: Fabless Model
6.2.3 Stable Supply Chain Architecture
6.2.4 Gross margin of Products
6.2.5 Layout of Main PMIC Product Lines
6.2.6 Automotive Electronics Layout
6.2.7 Block Diagram of Power Management Application in Automotive Infotainment System
6.2.8 Automotive DC/DC Converter Chip: HL7509 FNQ
6.2.9 Proposed R&D projects for Automotive power management
6.3 Shanghai YCT Electronics
6.3.1 Profile
6.3.2 PMIC Supply Chain Model
6.3.3 Automotive PMIC Product Layout
6.4 SGMICRO
6.4.1 Profile
6.4.2 Electronic Analog Chip Layout
6.4.3 Electric Operation Model
6.4.4 Production Process of Main Products
6.4.5 PMICs (1)
6.4.6 PMICs (2)
6.4.7 Automotive Voltage Reference Chips
6.5 3PEAK
6.5.1 Profile
6.5.2 Production and Operation Model: Fabless Model
6.5.3 PMIC Layout
6.5.4 Automotive Product Layout: Transformation of Old Products, R&D of New Products
6.5.5 Application of Automotive Products in Minimum Basic System
6.5.6 Application Scenarios of Automotive PMIC Solutions (1)
6.5.7 Application Scenarios of Automotive PMIC Solutions (2)
6.5.8 Automotive PMICs
6.6 Silicon Content Technology
6.6.1 Profile
6.6.2 Four Product Lines in the Field of PMICs
6.6.3 Automotive PMIC Layout
6.6.4 PMIC Application Solutions for Automotive Intelligent Rearview Mirrors
6.7 Silergy
6.7.1 Profile
6.7.2 Application Scenarios of Automotive PMICs (1)
6.7.3 Application Scenarios of Automotive PMICs (2)
6.7.4 Some Automotive PMICs
6.7.5 Ultra-small PMIC Automotive Camera Solutions
6.8 Awinic
6.8.1 Profile
6.8.2 Automotive Electronics Layout
6.8.3 PMIC Production Model
6.8.4 Self-built Low-temperature, Normal-temperature and High-temperature Chip Prober Production Lines
6.9 ETA Semiconductor
6.9.1 Profile
6.9.2 Technology Development and Product Evolution
6.9.3 Business Model: Fabless
6.9.4 Unit Cost of Main Products
6.9.5 Automotive PMIC Layout
6.9.6 Ongoing Automotive Power Management Projects