Table of Content

1 INTRODUCTION
1.1 Study Assumptions and Market Definition
1.2 Scope of the Study


2 RESEARCH METHODOLOGY


3 EXECUTIVE SUMMARY


4 MARKET INSIGHTS
4.1 Market Overview
4.2 Industry Attractiveness - Porter’s Five Forces Analysis
4.2.1 Bargaining Power of Suppliers
4.2.2 Bargaining Power of Buyers
4.2.3 Threat of Substitutes
4.2.4 Threat of New Entrants
4.2.5 Intensity of Competitive Rivalry
4.3 Industry Value Chain Analysis
4.4 Applications - Copper and Barrier, Cobalt, Tungsten, Oxide, Ceria, and Other Applications
4.5 Assessment of COVID-19 Impact on the Market


5 MARKET DYNAMICS
5.1 Market Drivers
5.1.1 Increased Use of 3D Structures in ICs and Growing Importance of CMP Technology
5.2 Market Challenges
5.2.1 Technical Challenges Pertaining to CMP Technique


6 MARKET SEGMENTATION
6.1 By Device Type
6.1.1 Memory
6.1.2 Logic
6.2 By Country
6.2.1 South Korea
6.2.2 Taiwan
6.2.3 United States
6.2.4 Japan
6.2.5 Europe
6.2.6 China
6.2.7 Rest of the World


7 COMPETITIVE LANDSCAPE
7.1 Vendor Ranking Analysis
7.2 Company Profiles
7.2.1 Cabot Microelectronics Corporation
7.2.2 Showa Denko Materials Co. Ltd
7.2.3 Hitachi Chemical Co. Ltd
7.2.4 Fujifilm Corporation
7.2.5 Fujimi Corporation
7.2.6 Dow Inc.
7.2.7 Merck KGaA (Including Versum Materials)
7.2.8 Saint-Gobain Ceramics & Plastics Inc.
7.2.9 BASF


8 INVESTMENT ANALYSIS


9 MARKET OUTLOOK AND OPPORTUNITIES