Table of Content

1 INTRODUCTION
1.1 Study Deliverables
1.2 Study Assumptions
1.3 Scope of the Study


2 RESEARCH METHODOLOGY


3 EXECUTIVE SUMMARY


4 MARKET DYNAMICS
4.1 Market Overview
4.2 Introduction to Market Drivers and Restraints
4.3 Market Drivers
4.3.1 Rising Demand for 3D-enabled Devices in Consumer Electronics
4.3.2 Increasing Use of 3D Sensing Technology in Gaming Applications
4.3.3 Integration of Optical and Electronic Components in Miniaturized Electronics Devices
4.4 Market Restraints
4.4.1 High Cost Required for the Maintenance of these Devices
4.4.2 Integration With Interfaces in Different Devices
4.5 Industry Value Chain Analysis
4.6 Industry Attractiveness - Porter’s Five Forces Analysis
4.6.1 Bargaining Power of Suppliers
4.6.2 Bargaining Power of Consumers
4.6.3 Threat of New Entrants
4.6.4 Threat of Substitute Products
4.6.5 Intensity of Competitive Rivalry


5 MARKET SEGMENTATION
5.1 By Product
5.1.1 Position Sensor
5.1.2 Image Sensor
5.1.3 Temperature Sensor
5.1.4 Accelerometer Sensor
5.1.5 Other Products
5.2 By Technology
5.2.1 Ultrasound
5.2.2 Structured Light
5.2.3 Time of Flight
5.2.4 Other Technologies
5.3 By End User Vertical
5.3.1 Consumer Electronics
5.3.2 Automotive
5.3.3 Healthcare
5.3.4 Other End User Verticals
5.4 By Geography
5.4.1 North America
5.4.1.1 United States
5.4.1.2 Canada
5.4.2 Europe
5.4.2.1 United Kingdom
5.4.2.2 Germany
5.4.2.3 France
5.4.2.4 Rest of Europe
5.4.3 Asia-Pacific
5.4.3.1 China
5.4.3.2 Japan
5.4.3.3 India
5.4.3.4 Rest of the Asia-Pacific
5.4.4 Latin America
5.4.4.1 Mexico
5.4.5 Middle East & Africa


6 COMPETITIVE LANDSCAPE
6.1 Company Profiles
6.1.1 Intel Corporation
6.1.2 Occipital Inc.
6.1.3 SoftKinetic SA
6.1.4 Sick AG
6.1.5 LMI Technologies
6.1.6 Infineon Technologies AG
6.1.7 XYZ Interactive Technologies
6.1.8 OmniVision Technologies
6.1.9 Panasonic Corporation
6.1.10 Cognex Corporation


7 MARKET OPPORTUNITIES AND FUTURE TRENDS


8 INVESTMENT ANALYSIS