Table of Content

1 INTRODUCTION
1.1 Study Assumptions and Market Definition
1.2 Scope of the Study


2 RESEARCH METHODOLOGY


3 EXECUTIVE SUMMARY


4 MARKET INSIGHT
4.1 Market Overview
4.2 Industry Attractiveness - Porter’s Five Forces Analysis
4.2.1 Threat of New Entrants
4.2.2 Bargaining Power of Buyers/Consumers
4.2.3 Bargaining Power of Suppliers
4.2.4 Threat of Substitute Products
4.2.5 Intensity of Competitive Rivalry
4.3 Value Chain Analysis
4.4 Assessment of the Impact of COVID-19 on the Market


5 MARKET DYNAMICS
5.1 Market Drivers
5.1.1 Growing Advanced Architecture in Electronic Products
5.1.2 Miniaturization of Electronics Devices
5.2 Market Challenges/Restrains
5.2.1 High Initial Investment and Increasing Complexity of Semiconductor IC Designs


6 MARKET SEGMENTATION
6.1 Packaging Technology
6.1.1 3D wafer-level chip-scale packaging
6.1.2 3D TSV
6.2 End-User Industry
6.2.1 Consumer electronics
6.2.2 Aerospace and Defense
6.2.3 Medical Devices
6.2.4 Communications and Telecom
6.2.5 Automotive
6.2.6 Others
6.3 Geography
6.3.1 North America
6.3.2 Europe
6.3.3 Asia-Pacific
6.3.4 Latin America
6.3.5 Middle-East


7 COMPETITIVE LANDSCAPE
7.1 Company Profiles
7.1.1 Taiwan Semiconductor Manufacturing Company Limited
7.1.2 Samsung Electronics Co., Ltd.
7.1.3 ASE Group
7.1.4 Amkor Technology
7.1.5 Intel Corporation
7.1.6 Siliconware Precision Industries Co. Ltd (SPIL)
7.1.7 GlobalFoundries
7.1.8 Invensas
7.1.9 Powertech Technology Inc.


8 INVESTMENT ANALYSIS


9 FUTURE OF THE MARKET