Table of Content

1 INTRODUCTION
1.1 Study Assumptions and Market Definition
1.2 Scope of the Study


2 RESEARCH METHODOLOGY


3 EXECUTIVE SUMMARY


4 MARKET INSIGHTS
4.1 Market Overview
4.2 Industry Attractiveness - Porter’s Five Forces Analysis
4.2.1 Bargaining Power of Suppliers
4.2.2 Bargaining Power of Buyers
4.2.3 Threat of New Entrants
4.2.4 Threat of Substitutes
4.2.5 Intensity of Competitive Rivalry
4.3 Value Chain Analysis
4.4 Assessment of the Impact of COVID-19 on the Market


5 MARKET DYNAMICS
5.1 Market Drivers
5.1.1 Growing Consumption of Semiconductor Devices Across Several Industries
5.1.2 Increasing Demand for Compact, High Functionality Electronic Devices
5.2 Market Restraints
5.2.1 High Initial Investment and Increasing Complexity of Semiconductor IC Designs
5.3 Opportunities
5.3.1 Growing Adoption of High-End Computing, Servers, and Data Centers


6 MARKET SEGMENTATION
6.1 By Packaging Technology
6.1.1 3D
6.1.2 2.5D
6.1.3 3D Wafer-level Chip-scale Packaging (WLCSP) - Qualitative Analysis
6.2 By End-User Industry
6.2.1 Consumer Electronics
6.2.2 Medical Devices
6.2.3 Communications and Telecom
6.2.4 Automotive
6.2.5 Other End-User Industries
6.3 By Geography
6.3.1 United States
6.3.2 China
6.3.3 Taiwan
6.3.4 Korea
6.3.5 Japan
6.3.6 Rest of the World
6.3.7 Europe


7 COMPETITIVE LANDSCAPE
7.1 Company Profiles
7.1.1 ASE Group
7.1.2 Amkor Technology Inc.
7.1.3 Intel Corporation
7.1.4 Samsung Electronics Co. Ltd
7.1.5 Siliconware Precision Industries Co. Ltd (SPIL)
7.1.6 Powertech Technology Inc.
7.1.7 Jiangsu Changjiang Electronics Technology Co. Ltd.
7.1.8 TSMC Limited
7.1.9 GlobalFoundries Inc.
7.1.10 Tezzaron Semiconductor Corp.


8 INVESTMENT ANALYSIS


9 FUTURE OF THE MARKET