Table of Content

1 Overview of Automotive Memory Chip Industry
1.1 Status Quo of Memory Chip Industry
1.1.1 Global Chip Industry Statistics in 2022 and Forecast for 2023
1.1.2 Global Memory Chip Development Trend: Market Size
1.1.3 Global Memory Chip Development Trend: Market Size: ASP (Average Selling Price) over the Years
1.1.4 Size of Memory Chip Market Segments and Market Share of Vendors
1.1.5 Composition of NAND SSD Industry Chain
1.1.6 Composition of Embedded NAND (eMMC, UFS) Industry Chain
1.1.7 Composition of DRAM (DDR memory) Industry Chain
1.1.8 Global Major Flash OEMs (with Fab Capabilities) (1)
1.1.9 Global Major Flash OEMs (with Fab Capabilities) (2)
1.1.10 Global Major Flash OEMs (with Fab Capabilities) (3)
1.1.11 Competition between Chinese Memory Chip Vendors
1.1.12 Comparison between Chinese Memory Chip Vendors in Revenue
1.1.13 Four Types of Chinese Memory Chip Vendors (1)
1.1.14 Four Types of Chinese Memory Chip Vendors (2)
1.1.15 Summary of 30 Chinese Memory and Master Chip Vendors
1.1.16 Details of 30 Chinese Memory and Master Chip Vendors (1)
1.1.17 Details of 30 Chinese Memory and Master Chip Vendors (2)
1.1.18 Details of 30 Chinese Memory and Master Chip Vendors (3)
1.1.19 Details of 30 Chinese Memory and Master Chip Vendors (4)
1.1.20 Details of 30 Chinese Memory and Master Chip Vendors (5)
1.2 Status Quo of Automotive Memory Chip Industry
1.2.1 Classification of Automotive Chips
1.2.2 Classification and Application of Automotive Memory Chips
1.2.3 Application Scenarios of Automotive Memory Chips
1.2.4 Global Automotive Memory Chip Market Size, 2021- 2025E
1.2.5 Application and Forecast of Automotive Memory Chips in ADAS, Cockpits and Other Scenarios
1.2.6 Overall Technical Evolution of Automotive Memory Chips
1.2.7 The Storage Capacity of DRAM and NAND of Various Models Will Double in the Next Few Years
1.2.8 Automotive Storage Technology Transformation (1)
1.2.9 Automotive Storage Technology Transformation (2)
1.2.10 Major Automotive Memory Chip Enterprises at Home and Abroad
1.3 Demand for and Application Prospect of Automotive Memory Chips
1.3.1 Storage Requirements of Intelligent Vehicles by Sub-module
1.3.2 Sources of In-vehicle Data
1.3.3 Requirements of L3-L5 Autonomous Driving for Bandwidth and Capacity of Automotive Memory Chips (1)
1.3.4 Requirements of L3-L5 Autonomous Driving for Bandwidth and Capacity of Automotive Memory Chips (2)
1.3.5 Requirements of Sensor Data for Automotive Memory Chips (1)
1.3.6 Requirements of Sensor Data for Automotive Memory Chips (2)
1.3.7 Requirements of Sensor Data for Automotive Memory Chips (3)
1.3.8 Event Data Recorders (EDR) Require GB Storage (1)
1.3.9 Event Data Recorders (EDR) Require GB Storage (2)
1.3.10 Software-defined Vehicles, E/E Architecture Evolution and Terminal-Roadside-Cloud Collaboration Propose Further Storage Requirements
1.3.11 2TB+ NAND Storage Will Be Required in 2025 under the Trend of Multi-domain Fusion and Centralized EEA
1.4 Competitive Landscape of Automotive Memory Chip Market
1.4.1 Competitive Landscape of Automotive Memory Chip Market
1.4.2 Competitive Landscape of Automotive Memory Chip Market at Home and Abroad (1)
1.4.3 Competitive Landscape of Automotive Memory Chip Market at Home and Abroad (2)
1.5 Automotive-grade Standards and Certification for Automotive Storage
1.5.1 Vehicle Supply Chain Access and Certification Process for Automotive Memory Chips
1.5.2 Automotive-grade Standards and Certification Specifications for Automotive Memory Chips (1)
1.5.3 Automotive-grade Standards and Certification Specifications for Automotive Memory Chips (2)
1.5.4 Vehicle Supply Chain Standard System Specifications for Automotive Memory Chips
1.5.5 AEC-Q100 for Automotive Memory Chips
1.5.6 AEC-Q100 Test Items
1.5.7 ISO 26262 for Automotive Chip Supply Chain
1.5.8 ISO 26262 ASIL for Automotive Chips
1.5.9 Semiconductor Classification by ISO 26262
1.6 Supply Chain Security of Automotive Memory Chips amid Chip Sanctions
1.6.1 The U.S. Restricts Exports of Advanced Computing Chips to China
1.6.2 Status Quo of China’s Memory Chip Supply Chain (1): Semiconductor Materials and Equipment
1.6.3 Status Quo of China’s Memory Chip Supply Chain (2): Design, Manufacturing, Packaging and Testing
1.6.4 Status Quo of China’s Memory Chip Supply Chain (3): Memory Chip IP
1.6.5 The Localization Rate of Memory Chips Gradually Increases (1)
1.6.6 The Localization Rate of Memory Chips Gradually Increases (2)
1.6.7 Xtacking? 3D NAND of Yangtze Memory
1.6.8 Yangtze Memory Mass-produces Xtacking? 3D NAND


2 Types and Application of Automotive Memory Chips
2.1 Classification of Memory Units
2.1.1 Classification of Storage Technologies (1)
2.1.2 Positions of Different Memory Units in the Computing Unit
2.1.3 Type 1: Volatile Memory (RAM)
2.1.4 Type 2: Non-Volatile Memory (ROM)
2.1.5 Type 2: Non-Volatile Memory (ROM): Classification of Flash Memory
2.1.6 Application of Memory Chips in Automobiles by Type (1)
2.1.7 Application of Memory Chips in Automobiles by Type (2)
2.1.8 Application of Memory Chips in Automobiles by Type (3)
2.2 DRAM Technology and Its Application in Automobiles
2.2.1 Technical Principle of DRAM
2.2.2 Three Development Directions of DRAM
2.2.3 Automotive DRAM Demand and Value in a Single Vehicle
2.2.4 The Demand for Automotive DRAM Capacity Is Constantly Increasing
2.2.5 Global Automotive DRAM Market Size (1)
2.2.6 Global Automotive DRAM Market Size (2)
2.2.7 Competitive Landscape of Automotive DRAM Market
2.2.8 Main Vendors and Product Layout in Automotive DRAM Market
2.2.9 Evolution of Automotive DRAM Technology
2.2.10 Evolution of Automotive DRAM Technology: Technology Roadmap of Suppliers
2.2.11 Application of In-vehicle DRAM: (1)
2.2.12 Application of In-vehicle DRAM: (2)
2.2.13 Application of In-vehicle DRAM: (3)
2.2.14 Application of In-vehicle DRAM: (4)
2.2.15 Application of In-vehicle DRAM: (5)
2.2.16 Application of In-vehicle DRAM: (6)
2.2.17 Application of In-vehicle DRAM: (7)
2.2.18 Application of In-vehicle DRAM: (8)
2.2.19 Application of In-vehicle DRAM: (9)
2.2.20 Application of In-vehicle DRAM: (10)
2.3 SRAM Technology and Its Application in Automobiles
2.3.1 Technical Principle of SRAM
2.3.2 Technical Features, Clock Frequency and Power Consumption of SRAM
2.3.3 In-vehicle application of SRAM: Application in Automotive ECU
2.3.4 In-vehicle Application of SRAM: Advantages of NXP S32G2 adopting on-chip SRAM
2.3.5 In-vehicle Application of SRAM: NXP S32G3 adopts on-chip SRAM
2.3.6 In-vehicle Application of SRAM: NPU core of Tesla FSD chip
2.4 NAND Flash Technology and Automotive Application
2.4.1 Classification and Technical Features of four NAND Flash Technologies.
2.4.2 Purposes of NAND Flash with Different Architectures
2.4.3 NAND Storage Architecture: Flash Storage Particle + Externally Packaged Controller
2.4.4 Evolution Direction of NAND Technology (1)
2.4.5 Evolution Direction of NAND Technology (2)
2.4.6 Competitive Landscape of Global NAND Flash market
2.4.7 Yangtze Memory Has Mass-produced 128-layer NAND Flash
2.4.8 Demand of Intelligent Cockpits and ADAS for NAND
2.4.9 NAND: A Single Vehicle Requires 2TB
2.4.10 Types of Mainstream NAND Flash Products
2.4.11 NAND: Technical Innovation Is Accelerating, and Domestic Vendors Are Dabbling in Automotive-grade Application
2.4.12 Global Automotive NAND Flash Market Space Estimation
2.4.13 Competitive Landscape of Global Automotive NAND Flash Market
2.5 NOR Flash Technology and Automotive Application
2.5.1 Technical Principle of NOR Flash
2.5.2 Technical features of NOR Flash
2.5.3 NOR Flash Finds a Huge Application Space in ADAS
2.5.4 Global Automotive-grade NOR Flash Market Size Estimation
2.5.5 Competitive Landscape of Global NOR Flash Market (1)
2.5.6 Competitive Landscape of Global NOR Flash Market (2)
2.5.7 Layout of Global NOR Flash Giants
2.5.8 GigaDevice’s GD25SPI NOR Flash Automotive Digital Combined Cluster Solution
2.6 EEPROM Technology and Its Application in Automobiles
2.6.1 Technical Principle and Classification of ROM
2.6.2 Technical Advantages of EEPROM
2.6.3 Broad Automotive Application Prospect of EEPROM
2.6.4 Chinese Vendors Speed up the Layout in the Relatively Small Global EEPROM Market
2.6.5 Competitive Landscape of Global Automotive EEPROM Market (1)
2.6.6 Competitive Landscape of Global Automotive EEPROM Market (2)
2.7 FRAM Technology and Its Application in Automobiles
2.7.1 Technical Advantages of FRAM
2.7.2 Automotive Application Scenarios of FRAM (1)
2.7.3 Automotive Application Scenarios of FRAM (2)
2.7.4 Application of FRAM in VCU


3 Automotive Application Scenarios of Memory Chips

3.1 Memory Chip Application Scenario: Cockpit
3.1.1 Requirements of Liquid Crystal Cluster for eMMC Storage Capacity
3.1.2 Requirements of Center Console Navigation Host for eMMC Storage Capacity
3.1.3 Requirements of Cockpit Domain Controller for Storage Capacity
3.1.4 Cockpit Domain Controller System Framework and Storage Requirements
3.1.5 Intelligent Cockpit Storage Requirements: Memory Chips Must Meet Automotive Regulations
3.1.6 Intelligent Cockpit Storage Requirements: The Reading Speed Should Be Faster, and the Memory Chip Interface of the Intelligent Cockpit Should Be Gradually Upgraded to UFS (1)
3.1.7 Intelligent Cockpit Storage Requirements: The Reading Speed Should Be Faster, and the Memory Chip Interface of the Intelligent Cockpit Should Be Gradually Upgraded to UFS (2)
3.1.8 Intelligent Cockpit Storage Requirements: Comparison between eMMC and UFS (1)
3.1.9 Intelligent Cockpit Storage Requirements: Comparison between eMMC and UFS (2)
3.1.10 Intelligent Cockpit Storage Requirements: Comparison between eMMC and UFS (3)
3.1.11 Intelligent Cockpit Storage Requirements: Comparison between eMMC and UFS (4)
3.1.12 Intelligent Cockpit Storage Requirements: Comparison between eMMC and UFS (5): Measured Performance Comparison between UFS and eMMC
3.1.13 Intelligent Cockpit Storage Requirements: Storage Requirements of Driving Recorder (Event Data Recorder) (1)
3.1.14 Intelligent Cockpit Storage Requirements: Storage Requirements of Driving Recorder (Event Data Recorder) (2)
3.1.15 Intelligent Cockpit Storage Requirements: Repeatable Erasing & Writing and Dynamic Wear Leveling
3.1.16 Cockpit Storage Case: Tesla Recalls Vehicles to Replace eMMC Memory (1)
3.1.17 Cockpit Storage Case: Tesla Recalls Vehicles to Replace eMMC Memory (2)
3.1.18 Cockpit Storage Case: Tesla Recalls Vehicles to Replace eMMC Memory (3)
3.2 Memory Chip Application Scenario: Autonomous Driving
3.2.1 ADAS Storage Requirements Generated by ADAS Sensors
3.2.2 Data Storage Requirements of L4 Autonomous Vehicles
3.2.3 Local Data Storage Requirements of Different Autonomous Driving Levels (GB)
3.2.4 Autonomous Driving Data Flow and Types
3.2.5 Autonomous Driving Hierarchical Storage Solutions
3.2.6 Storage Capacity Requirements of Different Autonomous Driving Levels
3.3 Memory Chip Application Scenario: Driving Data Recording
3.3.1 Development Trend of Global EDR Standards
3.3.2 Implementation Roadmap of Compulsory National EDR Standards (1)
3.3.3 Implementation Roadmap of Compulsory National EDR Standards (2)
3.3.4 Implementation Roadmap of Compulsory National EDR Standards (3)
3.3.5 Local EDR Laws and Regulations
3.3.6 Application of FRAM in EDR
3.4 Memory Chip Application Scenarios: Cloud Computing and Storage
3.4.1 Automotive Cloud Storage Facilitates Data Processing in Autonomous Driving R&D
3.4.2 Cloud Storage of Vehicle Data May Face Regulatory Issues in "Data Privacy and Security”
3.4.3 Limitations of Automotive Cloud Storage: Traffic Costs and Data Security Regulatory Issues
3.4.4 Workflow of Autonomous Driving AI Learning Scenario
3.4.5 Challenges for Data Storage in Autonomous Driving AI Learning System
3.4.6 XSKY’s Cloud Storage Solution and Efficient Data Platform for Autonomous Driving
3.4.7 Autonomous Driving Distributed Storage Product of Yan Rong Tech: YRCloudFile
3.4.8 Cases of WD My Cloud
3.4.9 “Storage + Computing” Autonomous Driving Solution of Sugon ParaStor


4 Overseas Automotive Memory Chip Vendors

4.1 Samsung
4.1.1 Operation
4.1.2 Automotive Storage Product Line
4.1.3 Roadmap of DRAM and NAND
4.2 SK Hynix
4.2.1 Operation
4.2.2 Automotive Storage Product Line
4.2.3 Automotive LPDDR5
4.2.4 Mass Production of HBM3
4.3 Micron
4.3.1 Operation
4.3.2 Automotive Storage Product Line
4.3.3 Automotive-grade LPDDR5X Certified by ASIL D
4.3.4 Automotive-grade UFS 3.1 Is Widely Used in ADAS and IVI Systems
4.3.5 Latest Automotive Application Cases
4.4 Kioxia (Toshiba)
4.4.1 Operation
4.4.2 Automotive Storage Products
4.4.3 Technical Features of Automotive UFS2.1 Products
4.4.4 Technical Features of Automotive UFS3.1 Products
4.4.5 Automotive-grade UFS3.1 Uses BiCS Flash 3D Technology.
4.4.6 Technical Features of Automotive eMMC Products
4.5 Fujitsu
4.5.1 Product Lineup: FRAM, ReRAM and NRAM
4.5.2 Technical Advantages of FRAM
4.5.3 Wide Application of FRAM
4.5.4 Technical Features of Automotive-grade FRAM Products
4.5.5 Application of FRAM in Battery Management System (BMS)
4.5.6 Application of FRAM in Vehicle Control Unit (VCU)
4.5.7 4Mbit High-capacity FRAM Empowers Future Cars
4.5.8 Novel NRAM Has the Advantages of Both FRAM and NOR Flash.
4.5.9 Novel Non-volatile ReRAM (Resistive Memory)
4.5.10 Parameter comparison between EEPROM, NOR Flash, FRAM, NRAM and ReRAM.
4.6 Western Digital
4.6.1 Automotive Storage Product Line (1)
4.6.2 Automotive Storage Product Line (2)
4.6.3 iNAND AT EU312 UFS (mainly used for intelligent cockpit storage)
4.7 Dell EMC
4.7.1 Automotive Storage Business
4.7.2 PowerScale Storage System (used in ADAS/AD R&D platforms)
4.8 Silicon Motion
4.8.1 Operation
4.8.2 Automotive Storage Solutions
4.8.1 Automotive Storage Product Line (1)
4.8.2 Automotive Storage Product Line (2)
4.8.5 Automotive PCIe NVMe SSD Controller
4.8.6 Ferri Automotive Single Chip Storage Solution


5 Chinese Automotive Memory Chip Vendors

5.1 Yangtze Memory
5.1.1 Business
5.1.2 Global Market Share
5.1.3 UFS 3.1
5.1.4 3D NAND technology
5.2 CXMT
5.2.1 Business
5.2.2 DRAM Technology Roadmap
5.3 XMC
5.3.1 Business
5.3.2 NOR Flash Foundry Business
5.3.3 NOR Flash Products
5.4 GigaDevice
5.4.1 Business
5.4.2 NOR Flash Product Series
5.4.3 Automotive-grade NOR Flash GD25
5.4.4 DRAM DDR4 Products
5.5 Ingenic
5.5.1 Business
5.5.2 Overview of Segmented Business
5.5.3 Automotive-grade DDR4 SDRAM Products
5.5.4 Automotive-grade SRAM Products
5.6 Giantec Semiconductor
5.6.1 Semiconductor Business
5.6.2 Automotive-grade EEPROM Product Series
5.6.3 Automotive-grade A1 EEPROM GT24C512B
5.6.4 Automotive-grade EEPROM GT25A1024A
5.6.5 Automotive-grade SPI NOR Flash Memory Chip
5.6.6 SPD Product Series
5.7 Puya Semiconductor
5.7.1 Business
5.7.2 Automotive-grade NOR Flash Product Line
5.7.3 Automotive-grade EEPROM Product Line
5.8 Fudan Microelectronics
5.8.1 Business
5.8.2 Automotive-grade Storage Product Planning
5.8.3 Automotive EEPROM Memory Chip
5.9 Longsys
5.9.1 Business
5.9.2 Self-developed Low and Medium-capacity Memory Chips
5.9.3 Automotive Memory Chip Product Line
5.9.4 FORESEE Automotive-grade UFS (1)
5.9.5 FORESEE Automotive-grade UFS (2)
5.9.6 FORESEE Automotive-grade eMMC Certified by AEC-Q100
5.9.7 Automotive Electronic Storage - Overall Solution for Personal Cloud Services
5.9.8 Automotive Electronic Storage - Automotive Data Backup Disk
5.9.9 Open Innovation Lab Boosts Automotive Storage Business
5.9.10 Self-developed 10nm ASIC Memory Chip Test System
5.9.11 Total Quality Management Creates High-quality Automotive-grade Storage
5.10 Macronix
5.10.1 Business
5.10.2 Automotive-grade NOR Flash Product Line
5.10.3 Automotive-grade NAND Product Line
5.10.4 ArmorFlash Memory Application
5.11 BIWIN Storage Technology
5.11.1 Storage Business
5.11.2 Automotive Storage Solutions (1)
5.11.3 Automotive Storage Solutions (2)
5.11.4 Automotive Storage Product Line