Table of Content


1 Overview and Development History of Automotive Semiconductor Power Devices
1.1 Overview of IGBT
1.1.1 Overview of Power Semiconductor
1.1.2 Definition of IGBT
1.1.3 Structure, Working Principle and Electrical Properties of IGBT
1.2 IGBT Chip Technology
1.2.1 IGBT Chip Iteration
1.2.2 Development Trends of IGBT Chip Technology
1.3 IGBT Module Technology
1.3.1 IGBT Module Packaging Process
1.3.2 Structure and Upgrade Trends of IGBT Module
1.4 Application of IGBT in New Energy Vehicles
1.4.1 Application Fields of IGBT
1.4.2 Application of IGBT in New Energy Vehicles
1.5 Overview of 3rd-generation Semiconductor Materials SiC and GaN
1.5.1 Overview of SiC and GaN
1.6 Application Scenarios of SiC and GaN
1.6.1 Application Scenarios of SiC and GaN
1.6.2 Application Trends of SiC in Automotive Field
1.7 Policies and Trends for 3rd-generation Semiconductor Materials
1.7.1 Policies for SiC and GaN
1.7.2 Power Semiconductor Development Trend 1: High Power, Low Thermal Energy, and Low Cost
1.7.3 Power Semiconductor Development Trend 2: SiC Is in the Early Stage of Boom
1.7.4 Power Semiconductor Development Trend 3: SiC MOSFETs Will Replace Si-Based IGBTs


2 Global and Chinese New Energy Vehicle IGBT Markets
2.1 IGBT Industry Chain
2.1.1 IGBT Industry Chain and Business Model
2.2 Global IGBT Market
2.2.1 Global IGBT Supply and Demand
2.2.2 Global IGBT Industry Chain Layout and Planning
2.2.3 Competitive Landscape of Global IGBT Market
2.2.4 IGBT Delivery Time and Prices of Global Mainstream Companies
2.3 Chinese IGBT Market
2.3.1 Chinese IGBT Supply and Demand
2.3.2 IGBT Industry Chain Layout and Trends in China
2.4 Chinese New Energy Vehicle IGBT Market
2.4.1 IGBT Value per New Energy Vehicle
2.4.2 China’s New Energy Vehicle IGBT Market Size
2.4.3 Competitive Landscape of China’s New Energy Vehicle IGBT Market
2.4.4 The Latest Developments of Chinese Automotive IGBT Companies
2.4.5 China’s New Energy Vehicle IGBT Standards
2.5 Summary of IGBT Companies


3 Global and Chinese New Energy Vehicle SiC Markets
3.1 SiC Industry Chain
3.1.1 SiC Industry Chain
3.1.2 SiC Substrate
3.2 Global SiC Market
3.2.1 Global SiC Industrialization Pattern
3.2.2 Global New Energy Vehicle SiC Market Size
3.3 Chinese SiC Market
3.3.1 China’s New Energy Vehicle Market Size
3.3.2 China’s New Energy Vehicle SiC Market Size
3.4 SiC Layout of Companies
3.4.1 SiC Layout of Suppliers
3.4.2 SiC Layout of Automakers
3.5 Summary of SiC Companies
3.5.1 Summary of Global SiC Companies
3.5.2 8-inch Wafer R&D of Global SiC Companies
3.5.3 3rd-generation Semiconductor Companies in China


4 Global Companies
4.1 Infineon
4.1.1 Profile
4.1.2 Operation in 2021
4.1.3 Business Layout
4.1.4 Product System of Automotive Electronics
4.1.5 History of IGBT Technology
4.1.6 IGBT Product System
4.1.7 Automotive IGBT Products
4.1.8 New Energy Vehicle IGBT Customers in China
4.1.9 CoolSiC? Products
4.1.10 Application and Customers of SiC Products
4.1.11 GaN Products
4.1.12 Main Products and Technology Planning in 2022
4.1.13 Customers in Automotive Fields
4.1.14 Industry Dynamics
4.2 Semikron
4.2.1 Profile
4.2.2 Power Semiconductor Products
4.2.3 IGBT Modules
4.2.4 7th-generation EV IGBT Module Products
4.2.5 The Latest EV IGBT Module Products
4.2.6 SiC Modules
4.3 Fuji Electric
4.3.1 Profile
4.3.2 Operation in 2021
4.3.3 Power Semiconductor Products and Application
4.3.4 History of IGBT Technology
4.3.5 7th-generation X Series IGBT Modules
4.3.6 Intelligent Power Modules (IPM)
4.3.7 History of RC-IGBT Technology
4.3.8 EV/HEV RC-IGBT Modules
4.3.9 SiC Modules
4.3.10 Industry Dynamics
4.4 Mitsubishi Electric
4.4.1 Profile
4.4.2 Operation in 2021
4.4.3 Global and China Layout
4.4.4 Power Semiconductor Products and Application
4.4.5 History of IGBT Technology
4.4.6 IGBT Modules
4.4.7 EV IGBT Modules
4.4.8 SiC Products and Application
4.4.9 Power Semiconductor Business Planning
4.5 ON Semiconductor
4.5.1 Profile
4.5.2 Operation in 2021
4.5.3 Power Module Products
4.5.4 IGBT Module Products
4.5.5 EV IGBT Modules
4.5.6 SiC Products
4.5.7 Automotive Electronics and Customers
4.5.8 Strategic Transformation
4.5.9 Industry Dynamics
4.6 Denso
4.6.1 Profile
4.6.2 Business System
4.6.3 Operation in 2021
4.6.4 SiC Products
4.6.5 Industry Dynamics
4.7 ROHM
4.7.1 Profile
4.7.2 Operation in 2021
4.7.3 Layout in China
4.7.4 Power Device Products and Application
4.7.5 History of IGBT Technology
4.7.6 New IGBT Products
4.7.7 History of SiC Technology
4.7.8 4th-generation SiC MOSFET Products
4.7.9 EV Power Products and Solutions
4.7.10 Industry Dynamics
4.8 Hitachi Power Semiconductor Device
4.8.1 Profile
4.8.2 Global Layout
4.8.3 Products and Application
4.8.4 Product Features
4.8.5 IGBT Chip Technology
4.8.6 IGBT Module Technology
4.8.7 IGBT Module Products
4.8.8 EV IGBT Products
4.8.9 SiC Product Families
4.8.10 Industry Dynamics
4.9 STMicroelectronics
4.9.1 Profile
4.9.2 Operation in 2021
4.9.3 Global Layout
4.9.4 IGBT Products
4.9.5 Automotive IGBT Modules
4.9.6 History of SiC Technology
4.9.7 SiC Products
4.9.8 EV SiC Products and Application by Tesla
4.9.9 EV Power Module Products and Solutions
4.9.10 Industry Dynamics
4.10 Renesas
4.10.1 Profile
4.10.2 Operation in 2021
4.10.3 Iteration of IGBT Products
4.10.4 8th-generation IGBT Products
4.10.5 Application of IGBT in Electric Vehicles
4.10.6 Products and Solutions in Automotive Fields
4.10.7 Electric Vehicle Strategy
4.10.8 Industry Dynamics


5 Chinese Companies
5.1 BYD Semiconductor
5.1.1 Profile
5.1.2 Development History
5.1.3 Products and Application
5.1.4 IGBT Products
5.1.5 New Energy Vehicle IGBT Products
5.1.6 SiC Module Products
5.1.7 New Energy Vehicle SiC Modules
5.1.8 Revenue and Net Income
5.1.9 Unit Price and Cost of Products
5.1.10 Capacity, Output and Sales
5.1.11 Top Five Customers
5.1.12 Procurements and Suppliers
5.1.13 Industry Dynamics
5.2 StarPower Semiconductor
5.2.1 Profile
5.2.2 Development History
5.2.3 IGBT Module Product System
5.2.4 Product Application
5.2.5 New Energy Vehicle IGBT Module Products
5.2.6 Revenue and Net Income
5.2.7 Capacity, Output and Sales of IGBT Modules
5.2.8 Major Customers
5.2.9 Procurement of IGBT Module Raw Materials
5.2.10 Independent R&D and Procurement of Chips
5.2.11 Industry Dynamics
5.3 CRRC Times Electric
5.3.1 Profile
5.3.2 Development History
5.3.3 Power Semiconductor Business
5.3.4 IGBT Products
5.3.5 SiC Products
5.3.6 Automotive IGBT and SiC Modules
5.3.7 Capacity and Customers of Automotive IGBT Modules
5.3.8 Industry Dynamics
5.4 MacMic
5.4.1 Profile
5.4.2 Development History
5.4.3 Products and Application
5.4.4 EV Power Module Solutions
5.4.5 Revenue and Net Income
5.4.6 Capacity, Output and Sales/Output Ratio
5.4.7 Independent R&D and Procurement of Chips
5.4.8 Customers
5.4.9 Industry Dynamics
5.5 CAS-IGBT Technology
5.5.1 Profile
5.5.2 Products and Application
5.5.3 IGBT Products
5.5.4 IGBT Modules and Automotive IGBT Modules
5.5.5 Partners
5.5.6 Industry Dynamics
5.6 Sino-Microelectronics
5.6.1 Profile
5.6.2 Development History
5.6.3 IGBT Technology Route
5.6.4 Main IGBT Products
5.6.5 Customers
5.6.6 Product Operation Plan
5.6.7 Industry Dynamics
5.7 Hua Hong Semiconductor
5.7.1 Profile
5.7.2 Process and Products
5.7.3 Development History of Power Devices
5.7.4 Power Devices and IGBT Products
5.7.5 Operation in 2021
5.7.6 Fabs and Capacity Layout
5.7.7 Capacity and Capacity Utilization
5.7.8 Industry Dynamics
5.8 Silan Microelectronics
5.8.1 Profile
5.8.2 Development History
5.8.3 Products and Application
5.8.4 IGBT Technology Route
5.8.5 New Energy Vehicle IGBT Modules
5.8.6 Operation in 2021
5.8.7 Output, Sales and Capacity
5.8.8 Industry Dynamics