Table of Content

1 Introduction 6
1.1 Industry Definition and Research Scope 6
1.1.1 Industry Definition 6
1.1.2 Research Scope 7
1.2 Research Methodology 10
1.2.1 Overview of Market Research Methodology 10
1.2.2 Market Assumption 11
1.2.3 Secondary Data 11
1.2.4 Primary Data 11
1.2.5 Data Filtration and Model Design 12
1.2.6 Market Size/Share Estimation 13
1.2.7 Research Limitations 14
1.3 Executive Summary 15

2 Market Overview and Dynamics 17
2.1 Market Size and Forecast 17
2.1.1 Impact of COVID-19 on World Economy 18
2.1.2 Impact of COVID-19 on the Market 20
2.2 Major Growth Drivers 22
2.3 Market Restraints and Challenges 25
2.4 Emerging Opportunities and Market Trends 28
2.5 Porter’s Fiver Forces Analysis 32

3 Segmentation of North America Market by Product Type 36
3.1 Market Overview by Product Type 36
3.2 Active Packaging 38
3.3 Smart and Intelligent Packaging 39

4 Segmentation of North America Market by Packaging Platform 40
4.1 Market Overview by Packaging Platform 40
4.2 Flip-Chip Ball Grid Array 42
4.3 Flip Chip CSP 43
4.4 Wafer Level CSP 44
4.5 2.5D/3D Integrated Circuit 45
4.6 Fan Out Wafer Level Package (Fo-WLP) 46
4.7 Embedded Die 47
4.8 Fan In Wafer Level Package (Fi-WLP) 48
4.9 Other Packaging Platforms 49

5 Segmentation of North America Market by End User 50
5.1 Market Overview by End User 50
5.2 Consumer Electronics 52
5.3 IT and Telecom 53
5.4 Automotive and Transportation 54
5.5 Industrial Sector 55
5.6 Healthcare and Life Science 56
5.7 Aerospace and Defense 57
5.8 Other End Users 58

6 North America Market 2021-2031 by Country 59
6.1 Overview of North America Market 59
6.2 U.S. 62
6.3 Canada 65
6.4 Mexico 67

7 Competitive Landscape 69
7.1 Overview of Key Vendors 69
7.2 New Product Launch, Partnership, Investment, and M&A 72
7.3 Company Profiles 73
Advanced Semiconductor Engineering Inc. 73
Amkor Technology, Inc. 75
Brewer Science, Inc. 76
Chipbond Technology Corporation 77
Intel Corporation 78
International Business Machines Corporation (IBM) 79
Microchip Technology, Inc. 80
Qualcomm Technologies, Inc. 81
Renesas Electronics Corporation 82
Samsung Electronics Co., Ltd. 83
STATS ChipPAC Pte. Ltd 84
S?SS Microtec Se 85
Taiwan Semiconductor Manufacturing Company, Limited 86
Texas Instruments, Inc. 87
Universal Instruments Corporation 88
RELATED REPORTS 89



List of Figures

List of Figures:

Figure 1. Research Method Flow Chart 10
Figure 2. Bottom-up Approach and Top-down Approach for Market Estimation 13
Figure 3. North America Market Forecast in Optimistic, Conservative and Balanced Perspectives, 2021-2031 15
Figure 4. North America Advanced Packaging Market, 2021-2031, $ mn 17
Figure 5. Impact of COVID-19 on Business 20
Figure 6. Primary Drivers and Impact Factors of North America Advanced Packaging Market 22
Figure 7. Primary Restraints and Impact Factors of North America Advanced Packaging Market 25
Figure 8. Investment Opportunity Analysis 29
Figure 9. Porter’s Fiver Forces Analysis of North America Advanced Packaging Market 32
Figure 10. Breakdown of North America Advanced Packaging Market by Product Type, 2021-2031, % of Revenue 37
Figure 11. North America Addressable Market Cap in 2022-2031 by Product Type, Value ($ mn) and Share (%) 37
Figure 12. North America Advanced Packaging Market by Product Type: Active Packaging, 2021-2031, $ mn 38
Figure 13. North America Advanced Packaging Market by Product Type: Smart and Intelligent Packaging, 2021-2031, $ mn 39
Figure 14. Breakdown of North America Advanced Packaging Market by Packaging Platform, 2021-2031, % of Sales Revenue 41
Figure 15. North America Addressable Market Cap in 2022-2031 by Packaging Platform, Value ($ mn) and Share (%) 41
Figure 16. North America Advanced Packaging Market by Packaging Platform: Flip-Chip Ball Grid Array, 2021-2031, $ mn 42
Figure 17. North America Advanced Packaging Market by Packaging Platform: Flip Chip CSP, 2021-2031, $ mn 43
Figure 18. North America Advanced Packaging Market by Packaging Platform: Wafer Level CSP, 2021-2031, $ mn 44
Figure 19. North America Advanced Packaging Market by Packaging Platform: 2.5D/3D Integrated Circuit, 2021-2031, $ mn 45
Figure 20. North America Advanced Packaging Market by Packaging Platform: Fan Out Wafer Level Package (Fo-WLP), 2021-2031, $ mn 46
Figure 21. North America Advanced Packaging Market by Packaging Platform: Embedded Die, 2021-2031, $ mn 47
Figure 22. North America Advanced Packaging Market by Packaging Platform: Fan In Wafer Level Package (Fi-WLP), 2021-2031, $ mn 48
Figure 23. North America Advanced Packaging Market by Packaging Platform: Other Packaging Platforms, 2021-2031, $ mn 49
Figure 24. Breakdown of North America Advanced Packaging Market by End User, 2021-2031, % of Sales Revenue 51
Figure 25. North America Addressable Market Cap in 2022-2031 by End User, Value ($ mn) and Share (%) 51
Figure 26. North America Advanced Packaging Market by End User: Consumer Electronics, 2021-2031, $ mn 52
Figure 27. North America Advanced Packaging Market by End User: IT and Telecom, 2021-2031, $ mn 53
Figure 28. North America Advanced Packaging Market by End User: Automotive and Transportation, 2021-2031, $ mn 54
Figure 29. North America Advanced Packaging Market by End User: Industrial Sector, 2021-2031, $ mn 55
Figure 30. North America Advanced Packaging Market by End User: Healthcare and Life Science, 2021-2031, $ mn 56
Figure 31. North America Advanced Packaging Market by End User: Aerospace and Defense, 2021-2031, $ mn 57
Figure 32. North America Advanced Packaging Market by End User: Other End Users, 2021-2031, $ mn 58
Figure 33. Breakdown of North America Advanced Packaging Market by Country, 2021 and 2031, % of Revenue 60
Figure 34. Contribution to North America 2022-2031 Cumulative Market by Country, Value ($ mn) and Share (%) 61
Figure 35. U.S. Advanced Packaging Market, 2021-2031, $ mn 63
Figure 36. Canada Advanced Packaging Market, 2021-2031, $ mn 65
Figure 37. Advanced Packaging Market in Mexico, 2021-2031, $ mn 67
Figure 38. Growth Stage of North America Advanced Packaging Industry over the Forecast Period 69

List of Tables

List of Tables:

Table 1. Snapshot of North America Advanced Packaging Market in Balanced Perspective, 2021-2031 16
Table 2. World Economic Outlook, 2021-2031 19
Table 3. World Electrical and Electronics Market, 2021-2031, $ bn 24
Table 4. Main Product Trends and Market Opportunities in North America Advanced Packaging Market 28
Table 5. North America Advanced Packaging Market by Product Type, 2021-2031, $ mn 36
Table 6. North America Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 40
Table 7. North America Advanced Packaging Market by End User, 2021-2031, $ mn 50
Table 8. North America Advanced Packaging Market by Country, 2021-2031, $ mn 60
Table 9. U.S. Advanced Packaging Market by Product Type, 2021-2031, $ mn 64
Table 10. U.S. Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 64
Table 11. U.S. Advanced Packaging Market by End User, 2021-2031, $ mn 64
Table 12. Canada Advanced Packaging Market by Product Type, 2021-2031, $ mn 66
Table 13. Canada Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 66
Table 14. Canada Advanced Packaging Market by End User, 2021-2031, $ mn 66
Table 15. Mexico Advanced Packaging Market by Product Type, 2021-2031, $ mn 68
Table 16. Mexico Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 68
Table 17. Mexico Advanced Packaging Market by End User, 2021-2031, $ mn 68
Table 18. Advanced Semiconductor Engineering Inc.: Company Snapshot 73
Table 19. Advanced Semiconductor Engineering Inc.: Business Segmentation 74
Table 20. Advanced Semiconductor Engineering Inc.: Product Portfolio 74