Table of Content

1 INTRODUCTION
1.1 Study Assumptions
1.2 Scope of the Study


2 RESEARCH METHODOLOGY


3 EXECUTIVE SUMMARY


4 MARKET DYNAMICS
4.1 Drivers
4.1.1 Increasing Applications for Electronics
4.1.2 Growing Demand from the Automobile Industry
4.2 Restraints
4.2.1 Impact of COVID-19
4.2.2 Other Restraints
4.3 Industry Value Chain Analysis
4.4 Porter’s Five Forces Analysis
4.4.1 Threat of New Entrants
4.4.2 Bargaining Power of Buyers
4.4.3 Bargaining Power of Suppliers
4.4.4 Threat of Substitute Products
4.4.5 Degree of Competition


5 MARKET SEGMENTATION
5.1 Type
5.1.1 I-line and g-line
5.1.2 Positive 248 nm
5.1.3 Positive 193 nm Dry Resist
5.1.4 TARC
5.1.5 Other Types
5.2 Applications
5.2.1 Integrated Circuits and PCBs
5.2.2 MEMS and NEMS Devices
5.2.3 Sensors
5.2.4 Dynamic Random Access Memory
5.2.5 Other Applications
5.3 Geography
5.3.1 Asia-Pacific
5.3.1.1 China
5.3.1.2 India
5.3.1.3 Japan
5.3.1.4 South Korea
5.3.1.5 Rest of Asia-Pacific
5.3.2 North America
5.3.2.1 United States
5.3.2.2 Canada
5.3.2.3 Mexico
5.3.3 Europe
5.3.3.1 Germany
5.3.3.2 United Kingdom
5.3.3.3 France
5.3.3.4 Italy
5.3.3.5 Rest of Europe
5.3.4 Rest of the World


6 COMPETITIVE LANDSCAPE
6.1 Mergers and Acquisitions, Joint Ventures, Collaborations, and Agreements
6.2 Market Share/Ranking Analysis**
6.3 Strategies Adopted by Leading Players
6.4 Company Profiles
6.4.1 Applied Materials, Inc
6.4.2 Fujifilm Holdings Corporation
6.4.3 Honeywell Electronic Materials, Inc
6.4.4 JSR Micro, Inc
6.4.5 MacDermid, Inc
6.4.6 Merck KGaA
6.4.7 Microchem Corporation
6.4.8 Shin-Etsu Chemical Co., Ltd
6.4.9 DuPont
6.4.10 Tokyo Ohka Kogyo Co., Ltd


7 MARKET OPPORTUNITIES AND FUTURE TRENDS