Table of Content

1 INTRODUCTION
1.1 Study Deliverables
1.2 Study Assumptions
1.3 Scope of the Study


2 RESEARCH METHODOLOGY


3 EXECUTIVE SUMMARY


4 MARKET DYNAMICS
4.1 Market Overview
4.2 Introduction to Market Drivers and Restraints
4.3 Market Drivers
4.3.1 Increasing Need for Miniaturization of Semiconductors
4.3.2 Increasing Use of MEMS & NEMS is Fueling the Growth of the CMP Market
4.3.3 Increasing Need for Miniaturization of Semiconductors
4.4 Market Restraints
4.4.1 Complexity Regarding Manufacturing
4.5 Industry Attractiveness - Porter’s Five Force Analysis
4.5.1 Threat of New Entrants
4.5.2 Bargaining Power of Buyers/Consumers
4.5.3 Bargaining Power of Suppliers
4.5.4 Threat of Substitute Products
4.5.5 Intensity of Competitive Rivalry
4.6 Technology Snapshot


5 MARKET SEGMENTATION
5.1 By Type
5.1.1 CMP Equipment
5.1.2 CMP Consumable
5.1.2.1 Slurry
5.1.2.2 PAD
5.1.2.3 PAD Conditioner
5.1.2.4 Other Consumable Types
5.2 By Application
5.2.1 Compound Semiconductors
5.2.2 Integrated Circuits
5.2.3 MEMS & NEMS
5.2.4 Other Applications
5.3 Geography
5.3.1 North America
5.3.2 Europe
5.3.3 Asia Pacific
5.3.4 Rest of World


6 COMPETITIVE LANDSCAPE
6.1 Company Profiles
6.1.1 Applied Materials, Inc.
6.1.2 Cabot Microelectronics Corporation
6.1.3 Ebara Corporation
6.1.4 Lapmaster Wolters GmbH
6.1.5 DuPont de Nemours, Inc.
6.1.6 Fujimi Incorporated
6.1.7 Revasum Inc.
6.1.8 LAM Research Corporation
6.1.9 Okamoto Corporation
6.1.10 Strasbaugh Inc.
6.1.11 Tokyo Seimitsu Co. Ltd. (Accretech Create Corp.)


7 INVESTMENT ANALYSIS


8 MARKET OPPORTUNITIES AND FUTURE TRENDS