Table of Content

1 INTRODUCTION
1.1 Study Assumptions
1.2 Scope of the Study


2 RESEARCH METHODOLOGY


3 EXECUTIVE SUMMARY


4 MARKET DYNAMICS
4.1 Market Overview
4.2 Market Drivers
4.2.1 Growing Miniaturization of Devices
4.2.2 Improved Electrical & Thermal Performance
4.3 Market Restraints
4.3.1 Difficulty to Inspect, Test and Rework
4.4 Industry Value Chain Analysis
4.5 Industry Attractiveness - Porter’s Five Force Analysis
4.5.1 Threat of New Entrants
4.5.2 Bargaining Power of Buyers/Consumers
4.5.3 Bargaining Power of Suppliers
4.5.4 Threat of Substitute Products
4.5.5 Intensity of Competitive Rivalry


5 TECHNOLOGY SNAPSHOT
5.1 PCB Miniaturization
5.2 Advanced Embedded Active System Integration


6 MARKET SEGMENTATION
6.1 By platform
6.1.1 Die in Rigid Board
6.1.2 Die in Flexible Board
6.1.3 IC Package Substrate
6.2 By End-User
6.2.1 Consumer Electronics
6.2.2 IT & Telecommunications
6.2.3 Automotive
6.2.4 Healthcare
6.2.5 Other End-Users
6.3 Geography
6.3.1 Americas
6.3.2 Europe & MEA
6.3.3 Asia-Pacific


7 COMPETITIVE LANDSCAPE
7.1 Company Profiles
7.1.1 Microsemi Corporation
7.1.2 Fujikura Ltd.
7.1.3 Infineon Technologies AG
7.1.4 ASE Group
7.1.5 AT&S Company
7.1.6 Schweizer Electronic AG
7.1.7 Intel Corporation
7.1.8 Taiwan Semiconductor Manufacturing Company
7.1.9 TDK Corporation
7.1.10 Shinko Electric Industries Co. Ltd.
7.1.11 Amkor Technology


8 INVESTMENT ANALYSIS


9 MARKET OPPORTUNITIES AND FUTURE TRENDS