Table of Content

1 INTRODUCTION
1.1 Study Deliverables
1.2 Study Assumptions
1.3 Scope of the Study


2 RESEARCH METHODOLOGY


3 EXECUTIVE SUMMARY


4 MARKET DYNAMICS
4.1 Market Overview
4.2 Introduction to Market Drivers and Restraints
4.3 Market Drivers
4.3.1 Rapid Advancement in AI along with Innovation & Extended R&D
4.3.2 Rising Demand of IoT and Connected Working Ecosystem
4.4 Market Restraints
4.4.1 Complex Fabrication Process Owing to Decreasing Chip Size
4.5 Industry Value Chain Analysis
4.6 Industry Attractiveness - Porter’s Five Force Analysis
4.6.1 Threat of New Entrants
4.6.2 Bargaining Power of Buyers/Consumers
4.6.3 Bargaining Power of Suppliers
4.6.4 Threat of Substitute Products
4.6.5 Intensity of Competitive Rivalry
4.7 Technology Snapshot


5 MARKET SEGMENTATION
5.1 By Type
5.1.1 Discrete Components
5.1.2 Integrated Circuits
5.2 By End-user Industry
5.2.1 Consumer Electronics
5.2.2 Healthcare
5.2.3 Automotive
5.2.4 Industrial
5.2.5 Telecommunication
5.2.6 Other End-user Industries
5.3 Geography
5.3.1 North America
5.3.1.1 United States
5.3.1.2 Canada
5.3.2 Europe
5.3.2.1 Germany
5.3.2.2 United Kingdom
5.3.2.3 France
5.3.2.4 Rest of Europe
5.3.3 Asia-Pacific
5.3.3.1 China
5.3.3.2 Japan
5.3.3.3 South Korea
5.3.3.4 Taiwan
5.3.3.5 Rest of Asia-Pacific
5.3.4 Latin America
5.3.5 Middle East and Africa


6 COMPETITIVE LANDSCAPE
6.1 Company Profiles
6.1.1 Intel Resale Corporation (Intel Corporation)
6.1.2 Qualcomm Technologies Inc.
6.1.3 KYOCERA Corporation
6.1.4 Micron Technology Inc.
6.1.5 Toshiba Electronic Devices & Storage Corporation (Toshiba Corporation)
6.1.6 Texas Instruments Incorporated
6.1.7 Taiwan Semiconductor Manufacturing Company Limited
6.1.8 SK Hynix Inc.
6.1.9 Samsung Electronics Co. Ltd.
6.1.10 NXP Semiconductors N.V.
6.1.11 Fujitsu Semiconductor Ltd. (Fujitsu Ltd.)
6.1.12 Semiconductor Components Industries LLC (ON Semiconductor)
6.1.13 Infineon Technologies AG
6.1.14 Renesas Electronics Corporation


7 INVESTMENT ANALYSIS


8 MARKET OPPORTUNITIES AND FUTURE TRENDS