Table of Content

1 INTRODUCTION
1.1 Study Deliverables
1.2 Study Assumptions
1.3 Scope of the Study


2 RESEARCH METHODOLOGY


3 EXECUTIVE SUMMARY


4 MARKET DYNAMICS
4.1 Market Overview
4.2 Introduction to Market Drivers and Restraints
4.3 Market Drivers
4.3.1 Increasing Need to Protect Highly Sensitive Electronic Components
4.4 Market Restraints
4.4.1 Strict Rules and Regulations Regarding Packaging Materials
4.5 Industry Attractiveness - Porter’s Five Force Analysis
4.5.1 Threat of New Entrants
4.5.2 Bargaining Power of Buyers/Consumers
4.5.3 Bargaining Power of Suppliers
4.5.4 Threat of Substitute Products
4.5.5 Intensity of Competitive Rivalry
4.6 Technology Snapshot
4.6.1 Glass to Metal Sealing (GTMS)
4.6.2 Ceramics to Metal Sealing (CERTMS)
4.6.3 Glass Micro Bonding


5 MARKET SEGMENTATION
5.1 By Type
5.1.1 Passivation Glass
5.1.2 Reed Glass
5.1.3 Transponder Glass
5.2 By End-user Industry
5.2.1 Petrochemical
5.2.2 Aerospace and Defense
5.2.3 Automotive Industry
5.2.4 Healthcare
5.2.5 Consumer Electronics
5.2.6 Other End-user Industry
5.3 Geography
5.3.1 North America
5.3.2 Europe
5.3.3 Asia-Pacific
5.3.4 Latin America
5.3.5 Middle East and Africa


6 COMPETITIVE LANDSCAPE
6.1 Company Profiles
6.1.1 Schott AG
6.1.2 Ametek Inc.
6.1.3 Kyocera Corporation
6.1.4 Micross Components Inc.
6.1.5 Willow Technologies Ltd.
6.1.6 SGA Technologies limited
6.1.7 CompleteHermetics
6.1.8 Special Hermetics products Inc.
6.1.9 Materion Corporation
6.1.10 Teledyne Technologies Incorporated
6.1.11 Egide SA


7 INVESTMENT ANALYSIS


8 MARKET OPPORTUNITIES AND FUTURE TRENDS