Table of Content

1 INTRODUCTION
1.1 Study Deliverables
1.2 Study Assumptions
1.3 Scope of the Study


2 RESEARCH METHODOLOGY


3 EXECUTIVE SUMMARY


4 MARKET DYNAMICS
4.1 Market Overview
4.2 Introduction to Market Drivers and Restraints
4.3 Market Drivers
4.3.1 Higher Adoption of Substrate-Like-PCB in Leading OEMs
4.3.2 Increasing Demand for Consumer Electronics & Smart Devices
4.4 Market Restraints
4.4.1 Higher Setup Cost Associated With Substrate-Like-PCB
4.5 Industry Attractiveness - Porter’s Five Force Analysis
4.5.1 Bargaining Power of Suppliers
4.5.2 Bargaining Power of Buyers/Consumers
4.5.3 Threat of New Entrants
4.5.4 Threat of Substitute Products
4.5.5 Intensity of Competitive Rivalry
4.6 Technology Snapshot


5 MARKET SEGMENTATION
5.1 By Application
5.1.1 Consumer Electronics
5.1.2 Automotives
5.1.3 Communication
5.1.4 Other Applications
5.2 Geography
5.2.1 North America
5.2.2 Europe
5.2.3 Asia-Pacific
5.2.4 Rest of the World


6 COMPETITIVE LANDSCAPE
6.1 Company Profiles
6.1.1 Kinsus Interconnect Technology Corp.
6.1.2 Ibiden Co.Ltd.
6.1.3 Compeq Manufacturing Co. Ltd.
6.1.4 Daeduck Electronics Co. Ltd.
6.1.5 Unimicron Technology Corporation
6.1.6 Zhen Ding Technology
6.1.7 TTM Technologies
6.1.8 Meiko Electronics
6.1.9 AT&S
6.1.10 Korea Circuit
6.1.11 LG Innotek
6.1.12 Samsung Electro-Mechanics


7 INVESTMENT ANALYSIS


8 MARKET OPPORTUNITIES AND FUTURE TRENDS