Table of Content

1 INTRODUCTION
1.1 Study Deliverables
1.2 Study Assumptions
1.3 Scope of the Study


2 RESEARCH METHODOLOGY


3 EXECUTIVE SUMMARY


4 MARKET DYNAMICS
4.1 Market Overview
4.2 Introduction to Market Drivers and Restraints
4.3 Market Drivers
4.3.1 Increase in Demand for Microelectronics and Semiconductor Devices
4.3.2 Rise in Application of the Technology for Several End-Users
4.4 Market Restraints
4.4.1 High Investment for the Technology
4.5 CVD Processes Technology Snapshot
4.5.1 Atmospheric-Pressure Chemical Vapor Deposition (AP CVD)
4.5.2 Density-Plasma Chemical Vapor Deposition (LP CVD)
4.5.3 Low-pressure Chemical Vapor Deposition (LP CVD)
4.5.4 Metal-organic Chemical Vapor Phase Deposition (MO CVD)
4.6 Industry Value Chain Analysis
4.7 Industry Attractiveness - Porter’s Five Force Analysis
4.7.1 Threat of New Entrants
4.7.2 Bargaining Power of Buyers/Consumers
4.7.3 Bargaining Power of Suppliers
4.7.4 Threat of Substitute Products
4.7.5 Intensity of Competitive Rivalry


5 MARKET SEGMENTATION
5.1 By Application
5.1.1 Foundry
5.1.2 Integrated Device Manufacturer (IDM)
5.1.3 Memory Manufacturers
5.1.4 Other Applications
5.2 Geography
5.2.1 North America
5.2.2 Europe
5.2.3 Asia-Pacific
5.2.4 Rest of the World


6 COMPETITIVE LANDSCAPE
6.1 Company Profiles
6.1.1 AIXTRON SE
6.1.2 Applied Materials, Inc.
6.1.3 ASM International
6.1.4 CVD Equipment Corporation
6.1.5 Kokusai Semiconductor Equipment Corporation (KSEC)
6.1.6 Lam Research Corporation
6.1.7 Tokyo Electron Limited
6.1.8 ULVAC, Inc.
6.1.9 Veeco Instruments Inc.


7 INVESTMENT ANALYSIS


8 MARKET OPPORTUNITIES AND FUTURE TRENDS