Table of Content

1 INTRODUCTION
1.1 Study Deliverables
1.2 Study Assumptions
1.3 Scope of the Study


2 RESEARCH METHODOLOGY


3 EXECUTIVE SUMMARY


4 MARKET DYNAMICS
4.1 Market Overview
4.2 Introduction to Market Dynamics
4.3 Market Drivers
4.3.1 Growth of Telecommunications Market
4.3.2 Low Manufacturing Costs
4.4 Market Restraints
4.4.1 Technical Challenges Associated with Acoustic Sensors
4.5 Industry Value Chain Analysis
4.6 Industry Attractiveness - Porter’s Five Force Analysis
4.6.1 Threat of New Entrants
4.6.2 Bargaining Power of Buyers/Consumers
4.6.3 Bargaining Power of Suppliers
4.6.4 Threat of Substitute Products
4.6.5 Intensity of Competitive Rivalry


5 MARKET SEGMENTATION
5.1 By Type
5.1.1 Wired
5.1.2 Wireless
5.2 By Wave Type
5.2.1 Surface Wave
5.2.2 Bulk Wave
5.3 By Sensing Parameter
5.3.1 Temperature
5.3.2 Pressure
5.3.3 Torque
5.4 By Application
5.4.1 Automotive
5.4.2 Aerospace & Defense
5.4.3 Consumer Electronics
5.4.4 Healthcare
5.4.5 Industrial
5.4.6 Other Applications
5.5 Geography
5.5.1 North America
5.5.2 Europe
5.5.3 Asia-Pacific
5.5.4 Latin America
5.5.5 Middle East & Africa


6 COMPETITIVE LANDSCAPE
6.1 Company Profiles
6.1.1 Siemens AG
6.1.2 Transense Technologies plc
6.1.3 pro-micron GmbH
6.1.4 Honeywell Sensing and Productivity Solutions
6.1.5 Murata Manufacturing Co., Ltd.
6.1.6 Vectron International, Inc. (Microchip technology Incorporated)
6.1.7 ifm efector, inc.
6.1.8 Dytran Instruments, Inc.
6.1.9 Campbell Scientific, Inc.


7 MARKET OPPORTUNITIES AND FUTURE TRENDS


8 INVESTMENT ANALYSIS