Table of Content

1 INTRODUCTION
1.1 Study Deliverables
1.2 Study Assumptions
1.3 Scope of the Study


2 RESEARCH METHODOLOGY
2.1 Analysis Methodology
2.2 Research Phases


3 EXECUTIVE SUMMARY


4 MARKET DYNAMICS
4.1 Market Overview
4.2 Value Chain / Supply Chain Analysis
4.3 Introduction to Market Drivers and Restraints
4.4 Market Drivers
4.4.1 Demand for Data Centers Driven by Cloud and HPC Applications
4.4.2 Demand for High-performance and Low-power DRAM in Mobile Devices
4.5 Market Restraints
4.5.1 Storage Class Memory to Overcome High Costs and Less Memory of DRAM
4.6 Industry Attractiveness - Porter’s Five Force Analysis
4.6.1 Bargaining Power of Suppliers
4.6.2 Bargaining Power of Buyers/Consumers
4.6.3 Threat of New Entrants
4.6.4 Threat of Substitute Products
4.6.5 Intensity of Competitive Rivalry


5 MARKET SEGMENTATION
5.1 By Technology
5.1.1 DDR2
5.1.2 DDR3
5.1.3 DDR4
5.1.4 Mobile
5.1.5 Graphic
5.2 By Application
5.2.1 Mobile Devices
5.2.2 PC/Laptop
5.2.3 Server
5.2.4 Other Applications
5.3 Geography
5.3.1 North America
5.3.1.1 US
5.3.1.2 Canada
5.3.2 Europe
5.3.2.1 UK
5.3.2.2 Germany
5.3.2.3 France
5.3.2.4 Rest of Europe
5.3.3 Asia Pacific
5.3.3.1 China
5.3.3.2 India
5.3.3.3 Japan
5.3.3.4 Rest of Asia-Pacific
5.3.4 Rest of the World


6 COMPETITIVE LANDSCAPE
6.1 Company Profiles
6.1.1 SK Hynix Inc.
6.1.2 Micron Technology Inc.
6.1.3 Samsung Electronics Co. Ltd
6.1.4 Nanya Technology Corporation
6.1.5 Winbond Electronics Corporation
6.1.6 Intel Corporation
6.1.7 Powerchip Technology Corporation
6.1.8 Transcend Information


7 INVESTMENT ANALYSIS


8 MARKET OPPORTUNITIES AND FUTURE TRENDS