Table of Content

1 INTRODUCTION
1.1 Study Deliverables
1.2 Study Assumptions
1.3 Scope of the Study


2 RESEARCH METHODOLOGY


3 EXECUTIVE SUMMARY


4 MARKET DYNAMICS
4.1 Market Overview
4.2 Market Drivers
4.2.1 Increased Applications of Semiconductors in Automotive
4.2.2 Increase in IoT Devices
4.2.3 Increase in the Demand for Smartphones
4.3 Market Restraints
4.3.1 Increasing Raw Material Cost
4.4 Industry Value Chain Analysis
4.5 Industry Attractiveness - Porter’s Five Forces Analysis
4.5.1 Threat of New Entrants
4.5.2 Bargaining Power of Buyers/Consumers
4.5.3 Bargaining Power of Suppliers
4.5.4 Threat of Substitute Products
4.5.5 Intensity of Competitive Rivalry


5 MARKET SEGMENTATION
5.1 By Services
5.1.1 Testing
5.1.2 Packaging
5.2 By Type of Packaging
5.2.1 Ball Grid Array Packaging
5.2.2 Chip Scale Packaging
5.2.3 Stacked Die Packaging
5.2.4 Multi-chip Packaging
5.2.5 Quad and Dual Packaging
5.3 By End-user Industry
5.3.1 Automotive
5.3.2 Consumer Electronics
5.3.3 Computing and Networking
5.3.4 Industrial Applications
5.3.5 Telecommunication
5.3.6 Other End-user Industries
5.4 Geography
5.4.1 North America
5.4.1.1 United States
5.4.1.2 Canada
5.4.2 Europe
5.4.2.1 United Kingdom
5.4.2.2 Germany
5.4.2.3 France
5.4.2.4 Rest of Europe
5.4.3 Asia-Pacific
5.4.3.1 China
5.4.3.2 India
5.4.3.3 Japan
5.4.3.4 Rest of Asia-Pacific
5.4.4 Rest of the World


6 COMPETITIVE LANDSCAPE
6.1 Company Profiles
6.1.1 ASE Technology Holding Co., Ltd.
6.1.2 Amkor Technology, Inc.
6.1.3 STATS ChipPAC Pte. Ltd.
6.1.4 Greatek Electronics Inc.
6.1.5 ChipMOS technologies Inc.
6.1.6 SK Hynix Inc.
6.1.7 LG Innotek
6.1.8 Formosa Advanced Technologies Co., Ltd.
6.1.9 Jiangsu Changjiang Electronics Technology Co., Ltd.
6.1.10 UTAC holdings Ltd.
6.1.11 Lingsen Precision Industries Ltd.
6.1.12 Nantong Fujitsu Microelectronics Co. Ltd
6.1.13 Walton Advanced Engineering Inc.


7 INVESTMENT ANALYSIS


8 MARKET OPPORTUNITIES AND FUTURE TRENDS