Table of Content

1 INTRODUCTION
1.1 Study Deliverables
1.2 Study Assumptions
1.3 Scope of the Study


2 RESEARCH METHODOLOGY


3 EXECUTIVE SUMMARY


4 MARKET DYNAMICS
4.1 Market Overview
4.2 Introduction to Market Drivers and Restraints
4.3 Market Drivers
4.3.1 Increasing Demand from Industrial and Consumer Electronics Segment
4.3.2 Rising Demand for Energy-efficient Devices
4.4 Market Restraints
4.4.1 Slow Adoption of New Technologies Derailing Innovation
4.5 Industry Attractiveness - Porter’s Five Force Analysis
4.5.1 Threat of New Entrants
4.5.2 Bargaining Power of Buyers/Consumers
4.5.3 Bargaining Power of Suppliers
4.5.4 Threat of Substitute Products
4.5.5 Intensity of Competitive Rivalry
4.6 TECHNOLOGY SNAPSHOT


5 MARKET SEGMENTATION
5.1 By Technology
5.1.1 Substrate
5.1.2 Baseplate
5.1.3 Die Attach
5.1.4 Substrate Attach
5.1.5 Encapsulations
5.1.6 Interconnections
5.2 Geography
5.2.1 North America
5.2.2 Europe
5.2.3 Asia-Pacific
5.2.4 Rest of the World


6 COMPETITIVE LANDSCAPE
6.1 Company Profiles
6.2 Fuji Electric Co. Ltd
6.3 Infineon Technologies AG
6.4 Mitsubishi Electric Corporation (Powerex Inc)
6.5 SEMIKRON
6.6 Amkor Technology Inc.
6.7 Hitachi Ltd
6.8 STMicroelectronics N.V


7 INVESTMENT ANALYSIS


8 MARKET OPPORTUNITIES AND FUTURE TRENDS