Table of Content

1. INTRODUCTION

1.1 Study Deliverables
1.2 Study Assumptions
1.3 Scope of the Study


2. RESEARCH METHODOLOGY


3. EXECUTIVE SUMMARY


4. MARKET DYNAMICS

4.1 Market Overview
4.2 Introduction to Market Drivers and Restraints
4.3 Market Drivers
4.3.1 Emerging Trend of Autonomous Driving and In-vehicle Infotainment
4.3.2 Increase in Demand for Smartphones
4.3.3 Memory Semiconductor Business Explosion
4.3.4 Continuous Developments in High-bandwidth Memory (HBM) and Redistribution Layer
4.3.5 Effective Space Utilization
4.4 Market Restraints
4.4.1 Harsh Reliability Requirements in the Automotive Environment
4.4.2 Changing landscape of the OSATs Industry
4.5 Industry Attractiveness - Porter’s Five Force Analysis
4.5.1 Threat of New Entrants
4.5.2 Bargaining Power of Buyers/Consumers
4.5.3 Bargaining Power of Suppliers
4.5.4 Threat of Substitute Products
4.5.5 Intensity of Competitive Rivalry
4.6 Industry Value Chain Analysis
4.7 Technology Roadmap


5. MARKET SEGMENTATION
5.1 Platform
5.1.1 Flip-chip
5.1.2 Lead-frame
5.1.3 Wafer-level Chip-scale Packaging(WLCSP)
5.1.4 Through-Silicon Via (TSV)
5.1.5 Wire-bond
5.2 Application
5.2.1 NAND Flash Packaging
5.2.2 NOR Flash Packaging
5.2.3 DRAM Packaging
5.2.4 Other Applications
5.3 End User
5.3.1 IT and Telecom
5.3.2 Consumer Electronics
5.3.3 Embedded Systems
5.3.4 Automotive
5.3.5 Other End Users
5.4 Geography
5.4.1 North America
5.4.1.1 US
5.4.1.2 Canada
5.4.2 Europe
5.4.2.1 UK
5.4.2.2 Germany
5.4.2.3 France
5.4.2.4 Rest of Europe
5.4.3 Asia Pacific
5.4.3.1 China
5.4.3.2 Japan
5.4.3.3 India
5.4.3.4 South Korea
5.4.3.5 Rest of Asia-Pacific
5.4.4 Latin America
5.4.5 Middle East & Africa


6. COMPETITIVE LANDSCAPE

6.1 Company Profiles
6.1.1 Tianshui Huatian Technology Co Ltd.
6.1.2 Hana Micron Inc.
6.1.3 lingsen precision industries Ltd.
6.1.4 Formosa Advanced Technologies Co. Ltd. (FATC)
6.1.5 Advanced Semiconductor Engineering Inc. (ASE Inc.)
6.1.6 Amkor Technology Inc.
6.1.7 Jiangsu Changjiang Electronics Technology Co. Ltd.
6.1.8 Powertech Technology
6.1.9 King Yuan Electronics Corp. Ltd.
6.1.10 ChipMOS Technologies Inc.
6.1.11 TongFu Microelectronics Co.
6.1.12 Signetics Corporation


7. INVESTMENT ANALYSIS


8. MARKET OPPORTUNITIES AND FUTURE TRENDS