Table of Content

1 INTRODUCTION
1.1 Study Assumptions
1.2 Scope of the Study


2 RESEARCH METHODOLOGY


3 EXECUTIVE SUMMARY


4 MARKET DYNAMICS
4.1 Drivers
4.1.1 Growing Consumer Electronics Industry
4.1.2 High Cost of Surface Finishing
4.1.3 Augmented Functionality of Electronic Devices
4.1.4 Increasing Demand from the Gaming Module Industry
4.2 Restraints
4.2.1 Reduction in Size of Mobile Handsets
4.2.2 Reduced Demand in Japan
4.2.3 Development of Non-silicone Substitutes
4.3 Industry Value-Chain Analysis
4.4 Porter’s Five Forces Analysis
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Consumers
4.4.3 Threat of New Entrants
4.4.4 Threat of Substitute Products and Services
4.4.5 Degree of Competition
4.5 Raw Material Analysis
4.6 Patent Analysis


5 MARKET SEGMENTATION
5.1 By Conductive Type
5.1.1 Electrically Conductive
5.1.2 Non-electrically Conductive
5.2 By Binder Type
5.2.1 Paraffin
5.2.2 Non-paraffin (organic)
5.2.3 Eutectic salts
5.2.4 Salt hydrates
5.3 By Filler Type
5.3.1 Aluminum Oxide
5.3.2 Boron Nitride
5.3.3 Aluminum Nitride
5.3.4 Zinc Oxide
5.3.5 Other Filler Types
5.4 By End-user Industry
5.4.1 Computers
5.4.2 Electrical and Electronics
5.4.3 Telecommunication
5.4.4 Automotive
5.4.5 Other End-user Industries
5.5 Geography
5.5.1 Asia-Pacific
5.5.1.1 China
5.5.1.2 India
5.5.1.3 Japan
5.5.1.4 South Korea
5.5.1.5 Rest of Asia-Pacific
5.5.2 North America
5.5.2.1 United States
5.5.2.2 Canada
5.5.2.3 Mexico
5.5.3 Europe
5.5.3.1 Germany
5.5.3.2 United Kingdom
5.5.3.3 Italy
5.5.3.4 France
5.5.3.5 Rest of Europe
5.5.4 Rest of World
5.5.4.1 Brazil
5.5.4.2 Saudi Arabia
5.5.4.3 South Africa
5.5.4.4 Rest of the World


6 COMPETITIVE LANDSCAPE
6.1 Mergers and Acquisitions, Joint Ventures, Collaborations, and Agreements
6.2 Market Share Analysis**
6.3 Strategies Adopted by Leading Players
6.4 Company Profiles
6.4.1 3M
6.4.2 Aavid Thermalloy
6.4.3 AI Technology
6.4.4 Arctic Silver
6.4.5 Croda International PLC
6.4.6 Datum Phase Change Ltd
6.4.7 Dow
6.4.8 Enerdyne Thermal Solutions
6.4.9 GrafTech
6.4.10 Henkel AG & Co. KGaA
6.4.11 Honeywell International Inc.
6.4.12 Laird Technologies
6.4.13 Microtek Laboratories Inc.
6.4.14 NuSil Technology
6.4.15 Parker Chomerics
6.4.16 Phase Change Energy Solutions Inc. (PCES)
6.4.17 Specialty Silicone Products (SSP)
6.4.18 Stockwell Elastomerics
6.4.19 TCP Reliable Inc.
6.4.20 Wakefield-Vette


7 MARKET OPPORTUNITIES AND FUTURE TRENDS
7.1 Opportunities
7.1.1 Replacement of Thermal Greases
7.1.2 Technological Improvements
7.1.3 Use in Notebook Computers
7.1.4 Growing Use in the Automotive Industry
7.1.5 Dual Phase Change Thermal Interface Materials
7.2 Future of the Market