IO-Link Market: Trends, Opportunities and Competitive Analysis (2023-2028)

Trends, opportunities, and forecast for the global IO-link market from 2017 to 2028 by type (IO-link wired, and IO-link wireless), application (machine tool, handling & assembly automation, intralogistic, and packaging), component (IO-link master, IO-link devices, sensor nodes, modules, actuators, and RFID read heads), and region (North America, Europe, Asia Pacific, and the Rest of the World)

Published	Pages	Publisher	Report code
Aug 2023	150	Lucintel	ASDR-624806

Published: Aug 2023 - Pages : 150 - Publisher : Lucintel - Report code : ASDR-624806

Balluff
ifm electronic
Banner
SICK
Siemens
Emerson
Rockwell Automation
Pepperl+Fuchs
Hans Turck
Omron Corporation