IC Substrate in the Global PCB Market: Trends, Opportunities and Competitive Analysis (2023-2028)

Trends, opportunities, and forecast for the global IC substrate in the global PCB market from 2017 to 2028 by type (FC BGA and FC CSP), application (tablet PC, smartphones, laptops, wearable devices, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)

Published	Pages	Publisher	Report code
May 2023	150	Lucintel	ASDR-622602

Published: May 2023 - Pages : 150 - Publisher : Lucintel - Report code : ASDR-622602

ASE Group
TTM Technologies
Simmtech
Fujitsu Limited
Ibiden
JCET Group
Kinsus Interconnect Technology
Korea Circuit
KYOCERA Corporation
LG Innotek