3D IC Market: Trends, Opportunities and Competitive Analysis (2023-2028)

Trends, opportunities, and forecast for the global 3D IC market from 2017 to 2028 by product (stacked 3D and monolithic 3D), component (through-silicon via (TSV), through glass via (TGV), and silicon interposer), application (logic, imaging & optoelectronics, memory, mems/sensors, and led), end use industry (consumer electronics, telecommunication, automotive, military & aerospace, medical devices, and industrial), and region (North America, Europe, Asia Pacific, and the Rest of the World)

Published	Pages	Publisher	Report code
Apr 2023	150	Lucintel	ASDR-619962

Published: Apr 2023 - Pages : 150 - Publisher : Lucintel - Report code : ASDR-619962

Tezzaron Semiconductor
3M Company Besang
IBM Corporation
Xilin
Monolithic 3D
Intel Corporation
Toshiba Corp
Amkor Technology
Samsung Electronic