Outsourced Semiconductor Assembly and Test Market: Trends, Forecast and Competitive Analysis

Trends, opportunities and forecast in outsourced semiconductor assembly and test (OSAT) market to 2027 by service type (assembly/packaging and testing), end use industry (telecommunication & devices, computer & networking, consumer electronics, industrial electronics, others), packaging type (wire bond, flip chip, wafer level, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)

Published	Pages	Publisher	Report code
Jun 2022	200	Lucintel	ASDR-607349

Published: Jun 2022 - Pages : 200 - Publisher : Lucintel - Report code : ASDR-607349

Advanced Semiconductor Engineering
Amkor
Jiangsu Changjiang Electronics Technology
Siliconware Precision Industries Co. ltd.
PTI(Powertech Technology Inc.)
Tianshui Huatian Technology co. Ltd
Tongfu Microelectronics co. Ltd
United test and assembly center Ltd
King Yuan Electronics co
Ltd.
ChipMOS

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Published: April, 2023 | Report code: ASDR-619601