Companies mentioned in the report (non-exhaustive)
Cree/Wolfspeed, Sumitomo Electric, Qorvo, Fujitsu, CETC (China Electronics Technology Group Corporation), Toshiba, MACOM, Mitsubishi Electric, Intel, Northrop Grumman, Panasonic, NXP/Freescale, Raytheon, Infineon/International Rectifier, HiWafer, NTT (Nippon Telegraph & Telephone), Beijing Huajin Chuangwei Electronics, Dynax Semiconductor, NGK Insulators, Samsung Electronics, NEC, HRL Laboratories, Japan Radio, TSMC, US Navy, WIN Semiconductors, BAE Systems, Lockheed Martin, Tiger Microwave, Boeing, UMS, Eridan Communications, OMMIC, Remec, Rockwell Collins, Sarda Technologies, Thales, US Monolithics, Jiangsu Broadwave Electronics Technology, UBE Industries, Xidian University, Institute of Semiconductors – Chinese Academy of Sciences, IMECAS (Institute of Microelectronics of Chinese Academy of Sciences), ETRI (Electronics & Telecommunications Research Institute), UESTC (University of Electronic Science & Technology of China), University of California, Fudan University, South China University of Technology, SINANO (Suzhou Institute of Nano Technology & Nano Bionics – Chinese Academy of Sciences), Hangzhou Dianzi University, KETI (Korea Electronics Technology Institute), CEA (French Alternatives Energies and Atomic Energy Commission), etc.
Cree/Wolfspeed, Sumitomo Electric, Qorvo, Fujitsu, CETC (China Electronics Technology Group Corporation), Toshiba, MACOM, Mitsubishi Electric, Intel, Northrop Grumman, Panasonic, NXP/Freescale, Raytheon, Infineon/International Rectifier, HiWafer, NTT (Nippon Telegraph & Telephone), Beijing Huajin Chuangwei Electronics, Dynax Semiconductor, NGK Insulators, Samsung Electronics, NEC, HRL Laboratories, Japan Radio, TSMC, US Navy, WIN Semiconductors, BAE Systems, Lockheed Martin, Tiger Microwave, Boeing, UMS, Eridan Communications, OMMIC, Remec, Rockwell Collins, Sarda Technologies, Thales, US Monolithics, Jiangsu Broadwave Electronics Technology, UBE Industries, Xidian University, Institute of Semiconductors – Chinese Academy of Sciences, IMECAS (Institute of Microelectronics of Chinese Academy of Sciences), ETRI (Electronics & Telecommunications Research Institute), UESTC (University of Electronic Science & Technology of China), University of California, Fudan University, South China University of Technology, SINANO (Suzhou Institute of Nano Technology & Nano Bionics – Chinese Academy of Sciences), Hangzhou Dianzi University, KETI (Korea Electronics Technology Institute), CEA (French Alternatives Energies and Atomic Energy Commission), etc.
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