3D-Plus
Advanced Semiconductor Engineering, Inc.
Aizu Fujitsu Semiconductor Manufacturing Limited
Amkor Technology, Inc
Analog Devices
Apple
Applied Materials, Inc
ASE
ASM Pacific Technology Ltd.
ASML Holding N.V.
Bosch
Broadcom
Carl Zeiss SMT
China Wafer Level CSP Co. Ltd.
Convector, Inc.
Datacon
Deca Technologies Inc.
Dialog Semiconductor
Dow
EVGroup
Freescale (NXP)
Fujitsu Limited
Google
Hi Silicon
Huawei
Ibiden
IME
Infineon Technologies AG
Intel
J-Devices Corporation
Jiangsu Changjiang Electronics Technology Co., Ltd.
Jiangyin Changdian Advanced Packaging
KLA-Tencor Corporation
Lam Research Corporation
Marvell Technology Group Ltd.
Mediatek
Medtronic
Nagase ChemteX
Nanium, S.A.
Nepes
Nitto Denko
Nokia
NXP
ON Semiconductor Corporation
Orbotech Ltd.
Qualcomm Technologies, Inc.
Rudolph Technologies, Inc.
Samsung
SEMCO
Shinko Electric
Siliconware Precision Industries Co., Ltd.
SPIL
SPTS (Orbotech)
STATS ChipPAC Ltd.
STMicroelectronics
SÜSS Microtec
TDK Corporation
TEL NEXX, Inc.
Tesla
Tokyo Electron Limited
Toray Chemical
Toshiba Electronic Devices & Storage Corporation
Towa
Toyota
Tsinghua Unigroup Ltd.
TSMC
Ultratech, Inc
UTAC
Veeco Instruments Inc.

List of Other Organisations Mentioned in this Report
European Semiconductor Industry Association (ESIA)
India Electronics and Semiconductor Association (IESA)
IWLPC
Korea Semiconductor Industry Association (KSIA)
Semiconductor Industry Association
Taiwan Semiconductor Industry Association (TSIA)