The Smart Packaging Market size was estimated at USD 56.17 billion in 2022 and expected to reach USD 59.83 billion in 2023, at a CAGR 7.31% to reach USD 98.81 billion by 2030.

Market Segmentation & Coverage:

This research report analyzes various sub-markets, forecasts revenues, and examines emerging trends in each category to provide a comprehensive outlook on the Smart Packaging Market.

  • Based on Technology, market is studied across Active Packaging, Intelligent Packaging, Modified Atmosphere Packaging, and Sustainable Smart Packaging. The Active Packaging is further studied across Antimicrobial, Corrosion Control, Gas Scavengers, and Moisture Control. The Gas Scavengers is further studied across Ethylene (Ethene) Scavengers and Oxygen Scavengers. The Intelligent Packaging is further studied across Connected Tracking and Indicators. The Connected Tracking is further studied across Near-Field Communication, QR Code, and Radio Frequency Identification Detection. The Indicators is further studied across Quality Indicators and Time-Temperature Indicators. The Sustainable Smart Packaging is projected to witness significant market share during forecast period.

  • Based on Application, market is studied across Automotive, Consumer Goods and Electronics, Food & Beverages, and Healthcare. The Consumer Goods and Electronics is projected to witness significant market share during forecast period.

  • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom. The Americas commanded largest market share of 37.06% in 2022, followed by Europe, Middle East & Africa.

Market Statistics:

The report provides market sizing and forecasts across 7 major currencies - USD, EUR, JPY, GBP, AUD, CAD, and CHF; multiple currency support helps organization leaders to make well-informed decisions. In this report, 2018 to 2021 are considered as historical years, 2022 is base year, 2023 is estimated year, and years from 2024 to 2030 are considered as forecast period.

FPNV Positioning Matrix:

The FPNV Positioning Matrix is an indispensable tool for assessing the Smart Packaging Market. It comprehensively evaluates vendors, analyzing key metrics related to Business Strategy and Product Satisfaction. This enables users to make informed decisions tailored to their specific needs. Through advanced analysis, vendors are categorized into four distinct quadrants, each representing a different level of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V). Be assured that this insightful framework empowers decision-makers to navigate the market with confidence.

Market Share Analysis:

The Market Share Analysis offers invaluable insights into the vendor landscape Smart Packaging Market. By evaluating their impact on overall revenue, customer base, and other key metrics, we provide companies with a comprehensive understanding of their performance and the competitive environment they confront. This analysis also uncovers the level of competition in terms of market share acquisition, fragmentation, dominance, and industry consolidation during the study period.

Key Company Profiles:

The report delves into recent significant developments in the Smart Packaging Market, highlighting leading vendors and their innovative profiles. These include 3M Company, Amcor Limited, American Thermal Instruments (ATI), Avery Dennison Corporation, BASF SE, DuPont de Nemours, Inc., Emerson Electric Co., Huhtamaki Group, International Paper Company, Multisorb Technologies Inc., R.R. Donnelley & Sons Company, Sealed Air Corporation, Sonoco Products Company, Stora Enso OYJ, Temptime Corporation, Thin Film Electronics ASA, UPM-Kymmene Corporation, and WestRock Company.

The report offers valuable insights on the following aspects:

  1. Market Penetration: It provides comprehensive information about key players’ market dynamics and offerings.
  2. Market Development: In-depth analysis of emerging markets and penetration across mature market segments, highlighting lucrative opportunities.
  3. Market Diversification: Detailed information about new product launches, untapped geographies, recent developments, and investments.
  4. Competitive Assessment & Intelligence: Exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of leading players.
  5. Product Development & Innovation: Intelligent insights on future technologies, R&D activities, and breakthrough product developments.

The report addresses key questions such as:

  1. What is the market size and forecast for the Smart Packaging Market?
  2. Which products, segments, applications, and areas hold the highest investment potential in the Smart Packaging Market?
  3. What is the competitive strategic window for identifying opportunities in the Smart Packaging Market?
  4. What are the latest technology trends and regulatory frameworks in the Smart Packaging Market?
  5. What is the market share of the leading vendors in the Smart Packaging Market?
  6. Which modes and strategic moves are suitable for entering the Smart Packaging Market?