The Global Atomic Layer Deposition (ALD) Market size is expected to reach $2.3 billion by 2023, rising at a market growth of 13% CAGR during the forecast period. Atomic Layer Deposition (ALD) is among the superior forms of deposition methods which are used to produce thin and conformal films. The technology is used in the fabrication of semiconductor devices, and is also a part of the set of tools available for the synthesis of nano-technology materials. ALD?s are used in the manufacturing of semiconductor categories various deposition instruments such as copper electrodes, High-K dielectric gate stacks, and copper barrier/seed layers are used to manufacture semiconductor categories. Demand for electronic components in automotive industry significantly contributes to the demand for semiconductors, influencing the atomic layer deposition market positively.
Based on Product, the market report segments the market into Aluminium Oxide ALD, Metal ALD, Plasma Enhanced ALD, Catalytic ALD, and Others. Based on End User, the Global Atomic Layer Deposition (ALD) market segments the market into Aluminium Oxide ALD, Metal ALD, Plasma Enhanced ALD, Catalytic ALD, and Others. Based on Regions, the Global Atomic Layer Deposition (ALD) market segments the market into North America, Europe, Asia Pacific, Latin America, Middle East and Africa. The market research report covers the analysis of key stake holders of the Global Atomic Layer Deposition (ALD) Market. Key companies profiled in the report include Adeka Corporation, Aixtron SE, Applied Materials, Inc., ASM International NV, Lam Research Corporation, Tokyo Electron Limited, Denton Vacuum, Kurt J. Lesker Company, Beneq Oy, and Veeco Instruments.