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Thermoset Molding Compound Market Report: Trends, Forecast and Competitive Analysis to 2031

Key data points: The market size in 2031 = $14.9 billion, growth forecast = 6.0% annually for the next 7 years. Scroll below to get more insights. This market report covers trends, opportunities, and forecasts in the global thermoset molding compound market to 2031 by type (phenolic resin, epoxy resin, polyester resin, urea formaldehyde, melamine formaldehyde, and others), end use (automotive, aerospace, electrical and electronics, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)

Published	Pages	Publisher	Report code
Feb 2025	150	Lucintel	ASDR-674307

Published: Feb 2025 - Pages : 150 - Publisher : Lucintel - Report code : ASDR-674307

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