Chapter 1: INTRODUCTION

1.1. Report description
1.2. Key benefits for stakeholders
1.3. Key market segments
1.4. Research methodology

1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models

Chapter 2: EXECUTIVE SUMMARY

2.1. CXO perspective

Chapter 3: MARKET OVERVIEW

3.1. Market definition and scope
3.2. Key findings

3.2.1. Top impacting factors
3.2.2. Top investment pockets

3.3. Porter’s five forces analysis

3.3.1. Moderate-to-high bargaining power of suppliers
3.3.2. Moderate threat of new entrants
3.3.3. Moderate threat of substitutes
3.3.4. Moderate-to-high intensity of rivalry
3.3.5. Moderate-to-high bargaining power of buyers

3.4. Patent analysis

3.4.1. By region, 2011–2019
3.4.2. By applicant 2011–2019

3.5. Market dynamics

3.5.1. Drivers

3.5.1.1. Increase in demand for power electronics component across various industry verticals
3.5.1.2. Rise in need for power management devices
3.5.1.3. Rise in integration of power electronics components in electric vehicles

3.5.2. Restraint

3.5.2.1. Complex integration process of advanced electronics devices

3.5.3. Opportunities

3.5.3.1. Rise in demand for plug-in electric vehicles (PEVs)
3.5.3.2. Innovation in power metal–oxide–semiconductor field-effect transistor (MOSFET)

Chapter 4: POWER ELECTRONICS MARKET, BY DEVICE TYPE

4.1. Overview
4.2. Power discrete

4.2.1. Key market trends, growth factors, and opportunities

4.2.1.1. Diode
4.2.1.2. Transistors
4.2.1.3. Thyristor

4.2.2. Market size and forecast, by region
4.2.3. Market analysis, by country

4.3. Power modules

4.3.1. Key market trends, growth factors, and opportunities

4.3.1.1. Intelligent power module
4.3.1.2. Power integrated module

4.3.2. Market size and forecast, by region
4.3.3. Market analysis, by country

4.4. Power IC

4.4.1. Key market trends, growth factors, and opportunities

4.4.1.1. Power management integrated circuit (PMIC)
4.4.1.2. Application-specific integrated circuit (ASIC)

4.4.2. Market size and forecast, by region
4.4.3. Market analysis, by country

Chapter 5: POWER ELECTRONICS MARKET, BY MATERIAL

5.1. Overview
5.2. Silicon carbide (SiC)

5.2.1. Key market trends, growth factors, and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market analysis, by country

5.3. Gallium nitride (GaN)

5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market analysis, by country

5.4. Sapphire

5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market analysis, by country

5.5. Others

5.5.1. Key market trends, growth factors, and opportunities
5.5.2. Market size and forecast, by region
5.5.3. Market analysis, by country

Chapter 6: POWER ELECTRONICS MARKET, BY APPLICATION

6.1. Overview
6.2. Power management

6.2.1. Key market trends, growth factors, and opportunities
6.2.2. Market size and forecast, by region
6.2.3. Market analysis, by country

6.3. UPS

6.3.1. Key market trends, growth factors, and opportunities
6.3.2. Market size and forecast, by region
6.3.3. Market analysis, by country

6.4. Renewable

6.4.1. Key market trends, growth factors, and opportunities
6.4.2. Market size and forecast, by region
6.4.3. Market analysis, by country

6.5. Others

6.5.1. Key market trends, growth factors, and opportunities
6.5.2. Market size and forecast, by region
6.5.3. Market analysis, by country

Chapter 7: POWER ELECTRONICS MARKET, BY END USER

7.1. Overview
7.2. Telecommunication

7.2.1. Key market trends, growth factors, and opportunities
7.2.2. Market size and forecast, by region
7.2.3. Market analysis, by country

7.3. Industrial

7.3.1. Key market trends, growth factors, and opportunities
7.3.2. Market size and forecast, by region
7.3.3. Market analysis, by country

7.4. Automotive

7.4.1. Key market trends, growth factors, and opportunities
7.4.2. Market size and forecast, by region
7.4.3. Market analysis, by country

7.5. Consumer electronics

7.5.1. Key market trends, growth factors, and opportunities
7.5.2. Market size and forecast, by region
7.5.3. Market analysis, by country

7.6. Military & defense

7.6.1. Key market trends, growth factors, and opportunities
7.6.2. Market size and forecast, by region
7.6.3. Market analysis, by country

7.7. Energy & power

7.7.1. Key market trends, growth factors, and opportunities
7.7.2. Market size and forecast, by region
7.7.3. Market analysis, by country

7.8. Others

7.8.1. Key market trends, growth factors, and opportunities
7.8.2. Market size and forecast, by region
7.8.3. Market analysis, by country

Chapter 8: POWER ELECTRONICS MARKET, BY REGION

8.1. Overview
8.2. North America

8.2.1. Key market trends, growth factors, and opportunities
8.2.2. Market size and forecast, by device type
8.2.3. Market size and forecast, by material
8.2.4. Market size and forecast, by application
8.2.5. Market size and forecast, by End user
8.2.6. Market analysis, by country

8.2.6.1. U.S.

8.2.6.1.1. Market size and forecast, by device type
8.2.6.1.2. Market size and forecast, by material
8.2.6.1.3. Market size and forecast, by application
8.2.6.1.4. Market size and forecast, by end user

8.2.6.2. Canada

8.2.6.2.1. Market size and forecast, by device type
8.2.6.2.2. Market size and forecast, by material
8.2.6.2.3. Market size and forecast, by Application
8.2.6.2.4. Market size and forecast, by end user

8.2.6.3. Mexico

8.2.6.3.1. Market size and forecast, by device type
8.2.6.3.2. Market size and forecast, by material
8.2.6.3.3. Market size and forecast, by application
8.2.6.3.4. Market size and forecast, by end user

8.3. Europe

8.3.1. Key market trends, growth factors, and opportunities
8.3.2. Market size and forecast, by device type
8.3.3. Market size and forecast, by material
8.3.4. Market size and forecast, by application
8.3.5. Market size and forecast, by end user
8.3.6. Market analysis, by country

8.3.6.1. UK

8.3.6.1.1. Market size and forecast, by device type
8.3.6.1.2. Market size and forecast, by material
8.3.6.1.3. Market size and forecast, by application
8.3.6.1.4. Market size and forecast, by end user

8.3.6.2. Germany

8.3.6.2.1. Market size and forecast, by device type
8.3.6.2.2. Market size and forecast, by material
8.3.6.2.3. Market size and forecast, by application
8.3.6.2.4. Market size and forecast, by end user

8.3.6.3. France

8.3.6.3.1. Market size and forecast, by device type
8.3.6.3.2. Market size and forecast, by material
8.3.6.3.3. Market size and forecast, by application
8.3.6.3.4. Market size and forecast, by end user

8.3.6.4. Rest of Europe

8.3.6.4.1. Market size and forecast, by device type
8.3.6.4.2. Market size and forecast, by material
8.3.6.4.3. Market size and forecast, by application
8.3.6.4.4. Market size and forecast, by end user

8.4. Asia-Pacific

8.4.1. Key market trends, growth factors, and opportunities
8.4.2. Market size and forecast, by device type
8.4.3. Market size and forecast, by material
8.4.4. Market size and forecast, by application
8.4.5. Market size and forecast, by end user
8.4.6. Market analysis, by country

8.4.6.1. China

8.4.6.1.1. Market size and forecast, by device type
8.4.6.1.2. Market size and forecast, by material
8.4.6.1.3. Market size and forecast, by application
8.4.6.1.4. Market size and forecast, by end user

8.4.6.2. Japan

8.4.6.2.1. Market size and forecast, by device type
8.4.6.2.2. Market size and forecast, by material
8.4.6.2.3. Market size and forecast, by application
8.4.6.2.4. Market size and forecast, by end user

8.4.6.3. India

8.4.6.3.1. Market size and forecast, by device type
8.4.6.3.2. Market size and forecast, by material
8.4.6.3.3. Market size and forecast, by application
8.4.6.3.4. Market size and forecast, by end user

8.4.6.4. South Korea

8.4.6.4.1. Market size and forecast, by device type
8.4.6.4.2. Market size and forecast, by material
8.4.6.4.3. Market size and forecast, by application
8.4.6.4.4. Market size and forecast, by end user

8.4.6.5. Rest of Asia-Pacific

8.4.6.5.1. Market size and forecast, by device type
8.4.6.5.2. Market size and forecast, by material
8.4.6.5.3. Market size and forecast, by application
8.4.6.5.4. Market size and forecast, by end user

8.5. LAMEA

8.5.1. Key market trends, growth factors, and opportunities
8.5.2. Market size and forecast, by device type
8.5.3. Market size and forecast, by material
8.5.4. Market size and forecast, by application
8.5.5. Market size and forecast, by end user
8.5.6. Market analysis, by country

8.5.6.1. Latin America

8.5.6.1.1. Market size and forecast, by device type
8.5.6.1.2. Market size and forecast, by material
8.5.6.1.3. Market size and forecast, by application
8.5.6.1.4. Market size and forecast, by end user

8.5.6.2. Middle East

8.5.6.2.1. Market size and forecast, by device type
8.5.6.2.2. Market size and forecast, by material
8.5.6.2.3. Market size and forecast, by application
8.5.6.2.4. Market size and forecast, by end user

8.5.6.3. Africa

8.5.6.3.1. Market size and forecast, by device type
8.5.6.3.2. Market size and forecast, by material
8.5.6.3.3. Market size and forecast, by application
8.5.6.3.4. Market size and forecast, by end user

Chapter 9: COMPETITIVE LANDSCAPE

9.1. Introduction

9.1.1. Market player positioning, 2019

9.2. Top winning strategies
9.3. Product mapping of top 10 player
9.4. Competitive dashboard
9.5. Competitive heatmap

Chapter 10: COMPANY PROFILES

10.1. ABB, Ltd.

10.1.1. Company overview
10.1.2. Company snapshot
10.1.3. Operating business segments
10.1.4. Product portfolio
10.1.5. R&D expenditure
10.1.6. Business performance
10.1.7. Key strategic moves and developments

10.2. FUJI ELECTRIC CO, LTD.

10.2.1. Company overview
10.2.2. Company snapshot
10.2.3. Operating business segments
10.2.4. Product portfolio
10.2.5. R&D expenditure
10.2.6. Business performance
10.2.7. Key strategic moves and developments

10.3. INFINEON TECHNOLOGIES AG

10.3.1. Company overview
10.3.2. Company snapshot
10.3.3. Operating business segments
10.3.4. Product portfolio
10.3.5. R&D expenditure
10.3.6. Business performance
10.3.7. Key strategic moves and developments

10.4. MICROSEMI CORPORATION

10.4.1. Company overview
10.4.2. Company snapshot
10.4.3. Product portfolio
10.4.4. Key strategic moves and developments

10.5. MITSUBISHI ELECTRIC CORPORATION

10.5.1. Company overview
10.5.2. Company snapshot
10.5.3. Operating business segments
10.5.4. Product portfolio
10.5.5. R&D expenditure
10.5.6. Business performance
10.5.7. Key strategic moves and developments

10.6. RENESAS ELECTRONICS CORPORATION

10.6.1. Company overview
10.6.2. Company snapshot
10.6.3. Operating business segments
10.6.4. Product portfolio
10.6.5. R&D expenditure
10.6.6. Business performance
10.6.7. Key strategic moves and developments

10.7. Rockwell Automation, Inc.

10.7.1. Company overview
10.7.2. Company snapshot
10.7.3. Operating business segments
10.7.4. Product portfolio
10.7.5. R&D expenditure
10.7.6. Business performance
10.7.7. Key strategic moves and developments

10.8. STMICROELECTRONICS N.V.

10.8.1. Company overview
10.8.2. Company snapshot
10.8.3. Operating business segments
10.8.4. Product portfolio
10.8.5. R&D expenditure
10.8.6. Business performance
10.8.7. Key strategic moves and developments

10.9. TEXAS INSTRUMENTS INCORPORATED

10.9.1. Company overview
10.9.2. Company snapshot
10.9.3. Operating business segments
10.9.4. Product portfolio
10.9.5. R&D expenditure
10.9.6. Business performance
10.9.7. Key strategic moves and developments

10.10. TOSHIBA CORPORATION

10.10.1. Company overview
10.10.2. Company snapshot
10.10.3. Operating business segments
10.10.4. Product portfolio
10.10.5. Business performance
10.10.6. Key strategic moves and developments