Wednesday 8 April 2015, Amsterdam
The new report recognizes the following companies as the key players in the Global 3D IC Market: Advanced Semiconductor Engineering (ASE), Samsung Electronics, STMicroelectronics and Taiwan Semiconductor Manufacturing Company (TSMC).
Other Prominent Vendors in the market are: 3M Company, IBM, Micron Technology, STATS ChipPAC, United Microelectronics and Xilinx.
Commenting on the report, an analyst from the report's team said: “One of the major trends upcoming in this market is the multi-chip packaging of 3D ICs, which allows the incorporation of numerous transistors. Multi-chip packaging has revolutionized the packaging method used for ICs.”
According to the report, one of the major growth drivers in this market is an increase in demand for 3D ICs in memory products such as flash memory and DRAM. 3D ICs improve the performance and reliability of memory products and also reduce their cost and size.
Further, the report states that one of the major challenges that the market faces is thermal conductivity issues associated with 3D ICs. The thermal conductivity of 3D ICs is low, which adversely affects the performance and durability of end-products.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.