Wednesday 29 July 2015, Amsterdam
The report recognizes the following companies as the key players in the Global System-on-Chip (SoC) Market: Apple Inc., Intel Corp., MediaTek Inc., Qualcomm Inc. and Samsung Electronics Co. Ltd.
Other Prominent Vendors in the market are: ARM Holdings, Broadcom, Freescale Semiconductors, Infineon Technologies and Marvell Technology Group and Texas Instruments
Commenting on the report, an analyst said: “The need to differentiate so as to compete in the increasingly competitive printer market has led to the innovation of 3D printers. 3D printers are increasingly being adopted in key technology-driven markets such as aerospace, automotive, educational, healthcare, and manufacturing sectors.”
According to the report, with the increase in the number of functions per IC, ICs have become denser, which helps manufacturers to add more functionalities. Miniaturization also helps reduce the overall cost of a SoC.
Further, the report states that the market is facing a tough challenge because of the emergence of System-in-Package technology. SiP is the 3D packaging of many dies vertically, reducing the overall size as well as reducing the overall development cost. With the demand for miniaturized products, SiP is a great threat to the SoC market.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
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